© 2014 ibm corporation high value x6 3850/3950 technical overview wayne wigley- advanced technical...

44
© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

Upload: sylvia-atkinson

Post on 15-Jan-2016

214 views

Category:

Documents


0 download

TRANSCRIPT

Page 1: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Wayne Wigley- Advanced Technical Sales

Page 2: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

X6: The sixth generation of EXA technology

Innovative eXFlash = 2X higher performance

12TB of memory, 15 CPU cores = leadership database performance

Seamless Scalability

Easy to configure and service

Support for multiple generations of technology

Enterprise class availability

CPU, Memory, I/O resilience

Hypervisor management Integration

Flex System X6Flex System X6 System x3850 X6System x3850 X6System x3950 X6System x3950 X6

FASTFAST AGILEAGILE RESILIENTRESILIENT

Page 3: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview 4 Socket Comparison

3

Traditional Rack Design

7 PCIe Slots

High AvailabilityPredictive Failure

40 Cores

2TB Standard Memory on x3850

1TB on HX5

8 x 2.5” Disk Drives on x3850

SSD only on HX5

+50%

+300%

+57%

10X More internal flash storage

Leadership Performance

Flexible Software-defined Modular Design

Flexible Software-defined Modular Design

11 PCIe SlotsI/O Choice HL or FL

8 Mezz adapters for Flex

11 PCIe SlotsI/O Choice HL or FL

8 Mezz adapters for Flex

Extreme AvailabilityFault Tolerance

Extreme AvailabilityFault Tolerance

60 Cores60 Cores

6TB Standard Memory6TB Standard Memory

30 TB of Flash StorageFlash Accelerator & Caching

30 TB of Flash StorageFlash Accelerator & Caching

Highest Storage Performance and Density

Ultra-Low Latency Performance

Highest Fault Tolerance & Fastest Serviceability

Maximum I/O Throughput

Application Optimized Fit-for-purpose

Page 4: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Smarter Computing: Rack PortfolioTrusted Innovation for Business Advantage

4

Page 5: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

IBM System x3850 X6 Overview

5

The x3850 X6 delivers the most performance and capacity in the x86 segment without compromising on reliability, availability, and serviceability. It’s also features IBM’s new modular rack design that can host multiple generations of technology in a single platform.

Intel® Xeon® based 4-socket 4U server that is scalable to 8-sockets 8U in the field Supports up to 6TB of memory and 60 cores of processing power Up to 12TB of IBM’s newest DIMM based flash technology for ultra-low latency applications Most flexibility by supporting a modular book design which allows clients to create “fit for

purpose” solutions and host multiple generations of technology in the same package In addition to Intel® RunSure® Technology, features X6 Advance RAS capabilities that

deliver mainframe class reliability

Key FeaturesKey Features

WorkloadsWorkloads ERP Analytics Database Virtualization

Announce: 2/18, GA: 3/5

AGILEAGILE

FASTFAST

RESILIENTRESILIENT

Page 6: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

IBM System x3950 X6 Overview

6

The x3950 X6 delivers the most performance and capacity in the x86 segment without compromising on reliability, availability, and serviceability. This 8-way server is designed with seamless management and scalable performance for the largest, business critical workloads.

Intel® Xeon® based 8-socket 8U server with seamless management Supports up to 12TB of memory and 120 cores of processing power Single point of control and single serial asset tracking for ease of management Up to 12TB of IBM’s newest DIMM based flash technology for ultra-low latency applications Most flexibility by supporting a modular book design which allows clients to create “fit for

purpose” solutions and host multiple generations of technology in the same package In addition to Intel® RunSure® Technology, features X6 Advance RAS capabilities that

deliver mainframe class reliability

Key FeaturesKey Features

WorkloadsWorkloads ERP Analytics Database and OLTP Virtualization

Announce: 2/18, GA: 6/5

AGILEAGILE

FASTFAST

RESILIENTRESILIENT

Page 7: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Smarter Computing: InnovationsTrusted Innovation for Business Advantage

7

Page 8: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Modular Book Design

8

Storage Book 4 Compute Books

Each compute book includes 1 processor and 24 DIMMs

Deliver up to 6TB of memory or 12.8TB of eXFlash memory – channel storage

Each x3850 X6 contains 4 Compute books

Ability to swap out Compute books as memory or processor generations change

The Storage book delivers up to 6.4TB of eXFlash 1.8” SSD or 12.8TB of SAS 2.5”

Ability to host 2 storage controllers for maximum bandwidth

AGILEAGILE

Page 9: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Modular Book Design

9

Create the fit-for-purpose solution, whether clients need to support typical HBAs or specialty GPGPU cards

Primary I/O Book

Up to 2 types of IO Books, Half-Length and Full-Length

Each IO Book delivers an additional 3 PCIe slots

Mezz-LOM solution gives clients the ability to select the networking technology that fits their requirements

Hosts the IMM, PCIe slots, and the dedicated Mezz-LOM solution

AGILEAGILE

• Up to 4 Power Supplies

• 900W, 1400W AC or 750W DC

Page 10: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

10

19nm MLC 10 Drive Writes Per Day 5 Year Warranty

Patented GuardianTM Technology Patented GuardianTM Technology

<5µs Write Latency >120K Read IOPS >35K Write IOPS

Ultra Low Latency, High PerformanceUltra Low Latency, High Performance

Back Up Power Circuitry End-To-End Data Protection 2M hours MTBF

Enterprise Class ReliabilityEnterprise Class Reliability

DDR3 protocol Configurable As Block Device Configurable As Memory Extension

Memory Channel InterfaceMemory Channel Interface

200, 400 GB Capacities Scalable Architecture 19nm MLC NAND

Scalable, Cost Effective MediaScalable, Cost Effective Media

S.M.A.R.T. Monitoring Supports TRIM Maintenance Tools

Additional FeaturesAdditional Features

eXFlash Memory Channel Storage

IBM eXFlash Memory Channel Storage

Page 11: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Smarter Computing:Processor E7v2Trusted Innovation for Business Advantage

11

Page 12: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

IntelIntel®® Xeon Xeon®® Processor E3 Family Processor E3 Family

Highest density, lowest costHighest density, lowest cost

IntelIntel®® Xeon Xeon®® Processor E5 Family Processor E5 Family

Most flexible & efficientMost flexible & efficient

IntelIntel®® Xeon Xeon®® Processor E7 Family Processor E7 Family

Highest reliability & scalabilityHighest reliability & scalability

Intel® Xeon® Processor Families Positioning

E5-4600 v2E5-4600 v2

E7-8800/4800/2800 v2E7-8800/4800/2800 v2

E5-2400 v2E5-2400 v2

E3-1200 v3E3-1200 v3

8-Socket+/4-Socket/2-Socket8-Socket+/4-Socket/2-SocketTop of the Line Performance Top of the Line Performance

Entry Entry 2-Socket2-Socket

Dense Dense 4-Socket4-Socket

Dependable & Economical 1-SocketDependable & Economical 1-Socket

E5-2600 v2E5-2600 v2MainstreamMainstreamLeadershipLeadership

Page 13: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Intel® Xeon® Processor E7-8800/4800/2800 v2 Overview

Integrated PCI Express* 3.0Up to 32 lanes per socket

Up to 3 DIMMs per channel (up to 24 DDR3 1600Mhz DIMMs per socket)

Up to 37.5MB Shared CacheUp to 37.5MB Shared Cache

Intel® Xeon® ProcessorE7-4800 v2

Product Family

Intel® Xeon® ProcessorE7-4800 v2

Product Family

Up to 4 Intel ® C102/C104Scalable Memory Buffersper socket

13All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.

• 64-bit Intel Xeon Multi-core Enterprise Processor

• Up to 15 cores and 30 threads (with Hyper-Threading) per socket

• Up to 37.5 MB of shared last-level cache (LLC)

• QuickPath Interconnect (QPI) 1.1 with speeds up to 8.0 GT/s

• Integrated I/O (IIO) 32 lanes of PCI Express 3.0. 4 lanes of PCI Express 2.0 (or DMI)

• 2 Internal Memory Controllers

4 Intel SMI2 channels

Page 14: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Memory Architecture Overview

14

Up to 24 DIMMs per socket

Up to 4 Intel ® C102/C104Scalable Memory Buffersper socket

Up to 37.5MB Shared CacheUp to 37.5MB Shared Cache

Intel® Xeon® ProcessorE7-4800 v2

Product Family

Intel® Xeon® ProcessorE7-4800 v2

Product Family

Up to 8 DDR3 Channels

1 to 6 DIMMs per Buffer

• 8 DDR3 channels per socket• Up to 24 DDR3 DIMMs per socket• Supports up to 64GB DDR3 LR-DIMM• Up to 6TB in a 4S platform, 12TB in a 8S platform1

Large Memory Capacity

• Up to 1600MHz DDR3 speeds• Intel® SMI Gen 2: Up to 2.66 GT/s• Memory Controller can support 2 modes

• Performance Mode (higher I/O, B/W)• Lockstep Mode (highest DDR3 speeds)

POR Speeds, Memory Controller Modes

• Active (Rack): Up to 9W @2.66 GT/s• Idle: Up to 2.5W

Power (Target)

1 Memory capacity possible by populating all (96 for 4S; 192 for 8S) DIMMs with 64GB DDR3 LR-DIMMs

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.

Page 15: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview Intel® E7-8800/4800/2800 v2 product

Basic

12-15 CoresQPI: 8.0 GT/sUp to 37.5M cacheIntel® HT TechnologyIntel® Turbo Boost TechnologySMI Gen2: Up to 2666 MT/s2:1 DDR3:1333 MHz (max)1:1 DDR3:1600 MHz (max)

8-12 CoresQPI: 7.2 GT/sUp to 24M cacheIntel® HT TechnologyIntel® Turbo Boost TechnologySMI Gen2: Up to 2132 MT/s2:1 DDR3: 1066 MHz (max)1:1 DDR3: 1333 MHz (max)

8S/Scalable* 4S/Scalable* 2S/Scalable*

Frequency Optimized : HPC

Stan

dard

Adva

nced

*Scaling capability refers to maximum supported number of CPUs in a “glueless” platform (e.g.8S means that this SKU can be used to populate up to 8 sockets in a single system).. Above skus may be used in even larger than 8S systems through the use of 3RD party node -controllers (not available from Intel).++ Please refer to the memory population matrix table for detailed information on POR Slots-per-Channel (SPC) & DIMMS-per-Channel (DPC) combinations

Frequency Optimized : Enterprise

6 CoresQPI: Up to 6.4 GT/sUp to 12M cacheIntel® HT TechnologySMI Gen2: Up to 2132 MT/s2:1 DDR3: 1066 MHz (max)1:1 DDR3: 1066 MHz (max)

8S/Scalable*QPI: 8.0 GT/sUp to 30M cacheIntel Turbo BoostSMI Gen2: Up to 2666 MT/s2:1 DDR3: 1333 MHz (max)1:1 DDR3:1600 MHz (max)

Segment Optimized

8S/Scalable*QPI: 8.0 GT/sUp to 37.5M cacheIntel HT TechnologyIntel Turbo BoostSMI Gen2: Up to 2666 MT/s2:1 DDR3: 1333 MHz (max)1:1 DDR3:1600 MHz (max)

15C 130W2.5GHz 37.5M

15C 130W2.5 GHz 37.5M

15C 130W2.5GHz 37.5M

12C 105W2.3GHz 24M

12C 105W2.3GHz 24M

12C 105W2.3GHz 24M

15C 130W2.3GHz 30M

15C 130W2.3 GHz 30M

15C 130W2.3GHz 30M

10C 105W2.2GHz 20M

15C 155W2.8GHz 37.5M

15C 155W2.8 GHz 37.5M

15C 155W2.8 GHz 37.5M

12C 130W2.6 GHz 30M

8C 105W2.0GHz 16M

6C 105W1.9GHz 12M

E7-4890 v2

E7-4870 v2

E7-4880 v2

E7-4860 v2

E7-4850 v2

E7-4830 v2

E7-4820 v2

E7-4809 v2

E7-8890 v2

E7-8870 v2

E7-8880 v2

E7-8850 v2

E7-2890 v2

E7-2870 v2

E7-2880 v2

E7-2850 v2

10C 155W3.2GHz 37.5M

6C 155W3.4GHz 37.5M

E7-8891 v2

E7-8893 v2

15C 105W105W2.2 GHz 37.5M

High Performance,Low Power

E7-8880 L v2

12C 130W130W3.0GHz 30M

E7-8857 v2

Page 16: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Smarter Computing:Compute BookTrusted Innovation for Business Advantage

16

Page 17: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Memory Buffers

CPU12 DIMMs

17

Compute Book

Page 18: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Fans

Cover with Window

12 DIMMs

18

Compute Book

Page 19: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Smarter Computing:MemoryTrusted Innovation for Business Advantage

19

Page 20: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Memory Subsystem Block Diagram

20

Page 21: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Memory Modes

21

Memory Operation Modes Supported

•Independent Mode - Performance mode. Each DDR3 channel is addressed individually via burst lengths of 8 bytes. The Intel SMI2 channel will operate at twice the DDR3 data rates.•Lockstep Mode - The high RAS mode supporting DDDC with x4 DRAMs. The memory controller handles all cache lines across two DDR3 channels behind one JC. The Intel SMI2 channel operates at the DDR3 transfer rate.•Mirrored Mode - The memory contents of the system are mirrored between CPU sockets. Because of mirroring of the memory, the total memory available to the system is half of the memory that is physically installed.•Rank Sparing Mode - One memory DIMM rank is a spare of the other ranks on the same channel. The spare rank is held in reserve and is not utilized by the system as part of its system memory.

Two modes of operation: 2:1 Independent Channel Mode

SMI2 Max Freq. – 1.33 GHz (2 transfers per clock = 2667 MHz) SMI2 Transfer Rate – 2.67 GT/s SMI2 Channel Bandwidth – 21.3 GB/s

1:1 Sub-Channel Lockstep Mode SMI2 Max Freq. – 0.93 GHz (2 transfers per clock = 1600 MHz) SMI2 Transfer Rate – 1.6 GT/s SMI2 Channel Bandwidth – 12.8 GB/s

Page 22: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

X6 platforms deliver the best memory scalability in the industry

22

Standard x86 servers will see memory speed lower as more DIMMs are populated

Each processor has 8 channels

Each channel supports up to 3 DIMMs

Results in 24 DIMMs per processor

As you add more DIMMs to each channel, the Intel® architecture will lower the memory bus speed from 1333Mhz to 1066Mhz (20% reduction) for workloads over 1TB (assuming 16GB DIMMs)

CPU1333 Mhz

Memory

Memory

Memory

MemoryCPU

1066 Mhz

Memory

Memory !

x3850 X6 and x3950 X6 are designed to maintain memory performance for larger workloads

For memory workloads from 500GB and above, the X6 platforms will be able to maintain the 1333 Mhz memory bus speed

Delivering higher performance for larger workloads with scalable memory performance

FASTFAST

Page 23: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Smarter Computing:eXFlash MCSTrusted Innovation for Business Advantage

23

Page 24: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

IBM eXFlash Memory Channel Storage Benefits Fastest flash response time in the market

– Significantly lower write latency than any other Flash offering; as low as 3.3 microseconds

• Up to  83% lower latency than PCIe** and 95% lower latency than SSD***•  Fastest response time available for analytics, critical VMs and high frequency

trading Consistent performance under mixed workloads

– more than 125K IOPS per eXFlash DIMM†, scaling linearly without negatively impacting latency

– On memory bus – avoids potential I/O contention• Databases from 200GB to 12.8TB have deterministic response times and consistent

performance Scalable form factor/performance/capacity

– Leverages ubiquitous DIMM slots - ideal for all server types including Flex System– Interoperable with standard DDR3 RDIMMs– Supports anywhere from 200GB to 12.8TB of flash

24

Page 25: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

IBM eXFlash MCS Configuration Rules

Maximum of one eXFlash DIMM per DDR3 memory channel is supported At least one RDIMM must be installed in the same memory channel as eXFlash DIMM eXFlash DIMMs only support RDIMMs; other memory types not supported eXFlash DIMMs with different capacities (i.e. 200 GB and 400 GB) can not be intermixed in

the same server eXFlash DIMMs are supported only in memory performance mode; other memory modes of

operations (such as lockstep, memory mirroring, and memory sparing) not supported. Maximum capacity is 32 x 400GB = 12.8TB IBM will add enhanced market offering features over time

See Session xSM04e for additional information. Tuesday and Thursday

IBM eXFlash MCS

Page 26: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Smarter Computing:StorageTrusted Innovation for Business Advantage

26

Page 27: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

8 HDD or 16

eXFlash SSD

LCD Display

1 USB 2.02 USB 3.0

Front VideoPower Button

Storage I/O Card

Raid Adapter 2 Slots

Storage I/O Book Overview

27

Gen 3 Drive Enclosures

Page 28: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Gen 3 HDD or SSD

Backplane

Storage I/O Book Overview

28

Page 29: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

RAID Adapters

ServeRAID M5210 Internal RAID Adapter– May only plug into “Storage Adapter Slots. – PCI Low Profile, MD2 Length Card outline– PCIe Gen 3 x8 lanes– RAID 0/1/10 support – no Cache on base card

– LSI SAS3108 ServeRAID M5120 – 6 Gb SAS RAID Adapter (External)

– PCI Low Profile, Half-length - MD2 form factor – Eight external 6 Gbps SAS/SATA ports – Two external Mini-SAS connectors (SFF-8088) – 6 Gbps throughput per port – LSI SAS2208

IBM N2215 High Performance HBA Non-RAID– May only plug into “Storage Adapter Slots” – PCI Low Profile, MD2 Length Card outline– 8-port Controller (SAS 12G / SATA 6G) – PCIe Gen 3 x8 lanes– Non-RAID HBA, SSD/JBOD focused

29

Page 30: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Smarter Computing:I/OTrusted Innovation for Business Advantage

30

Page 31: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

I/O and PCIe changes on E7v2

PCIe controller has moved from IOH onto CPU PCIe Gen 3 is passed through both the mid-planes from the compute books to the I/O books 8 lanes of PCIe Gen 3 from both CPU 0 and CPU 1 are routed to the storage book to

provide connectivity for up to two storage adapters. DMI from CPU 0 and CPU 1 are routed to the base I/O book for high availability legacy

connectivity to the Patsburg PCH DMI from CPU 2 and 3 are repurposed for PCIe Gen 2 and provide additional lanes for PCIe

slots on full length full height I/O books when installed

• PCIe Gen3 doubles PCIe bandwidth to 8.0GT/s (1024MB/s / lane / direction)• X4 Gen3 slot ~= 4GBps uni- 8GBps bi-directional bandwidth• X8 Gen3 slot ~= 8GBps uni- 16GBps bi-directional bandwidth• X16 Gen 3 slot ~= 16GBps uni – 32GBps bi-directional bandwidth

• PCIe Gen3 allows for more power per slot, within system operational constraints

• Slots now have NUMA considerations with IO adapter placement

31

Page 32: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Base I/O Book Details

32

IMM v2

Patsburg Platform Controller Hub (PCH)

MLOM Slot Gen3 x8 (Dual 10Gb, Quad 1Gb)

Three PCIe Gen 3 slots2-x16 and 1-x8

Four USB 2.0 IMM 1GbE BaseT Port

• The Primary IO Book contains the minimum set of I/O components to form a complete server. High level breakdown of these components:

Note: CPU2 and CPU3 correspond to 3rd and 4th CPUs (CPU0 is the 1st CPU)

1 USB 2.0 Internal for Hypervisor

Page 33: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

MLOM Adapters

33

Emulex VF A5 ML2 Dual Port 10GbE SFP+ Adapter

Intel X540 ML2 Dual Port10 Gb-T Adapter

Intel I350-T4 ML4 Quad Port GbE Adapter

Broadcom NetXtreme II ML2 Dual Port 10GbE SFP+ Adapter

Broadcom NetXtreme II ML2 Dual Port 10Gb-T Adapter

Page 34: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Half-Length I/O Book Details

34

One x16 Slot

Two x8 Slots

• x3850 X6 modular I/O book design allows clients to select the type of I/O infrastructure within the server

• The Half-Length I/O Book provides up to 3 PCIe slots each

• Up to 2 of these Books can be added to the 4-Socket configuration for a total of 6 additional slots to the 3 standard on the Primary I/O book

• Each Half-Length I/O Book is Hot-Swappable

Note: CPU2 and CPU3 correspond to 3rd and 4th CPUs (CPU0 is the 1st CPU)

Page 35: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Full-Length I/O Book Details

35

Two x16 Slot

One x4 Slots

•The Full-Length I/O Book provides up to 3 PCIe slots each

•Up to 2 of these Books can be added to the 4-Socket configuration for a total of 6 additional slots to the 3 standard on the Primary I/O book

•The Full-Length I/O Book supports one high power PCIe card (GPU/Accelerators) with a max power of 300W

•Two AUX power connectors provided to support 225W and 300W support: one 2x4 for 150W, one 2x3 support up to 75W

AUX power to support 300W cards

Support for Double-Wide cards

Note: CPU2 and CPU3 correspond to 3rd and 4th CPUs (CPU0 is the 1st CPU)

Air Baffle

I/O Book Guide

Page 36: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Full Length PCIe Expansion Card

Two auxiliary power connectors are provided on Pavo in order to support 225W and 300W high power adapters

One 2x4 power connector . This power connector can support up to 150W of power. 2x3 cables may also be plugged into this connector.

One 2x3 power connector. This power connector can support up to 75W of power

36

2x4 Auxiliary Connector

2x3 Auxiliary Connector

Page 37: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

37

Compute

Book

Base I/O

Book

Storage

Book

Backplane H/L-F/H I/O

Book

F/L-F/H I/O

Book

Not Shown

System Bus Diagram

Page 38: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Smarter Computing:8 Socket UpgradeTrusted Innovation for Business Advantage

38

Page 39: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Expansion to 8 socket

8u, 8 CPU, 192 DIMM, 22 PCIe, 16 HDD

FlexNode physical partition to two 4S

Front/rear service only, similar to 4u

Unique Parts:– 8U Chassis

– 8 socket Midplane/Shuttle

Common:– Processor/Memory Book

– I/O Books

– Power Supplies

– Storage Book

– HDD backplanes

39

Page 40: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview 4S to 8S Upgrade

40

Parts Re-used

4S Unique Parts Removed

8S Upgrade Kit

HDD/Storage Module

Fan, Processor &Memory Module

4S Chassis

4S I/O Shuttle

4S MidplaneI/O Modules

8S Midplane

8S I/O Shuttle

8S Chassis

Primary I/O Module

Storage Module

4S Configuration

8S Configuration

Page 41: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

FlexNode Partitioning

41

Page 42: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Leadership Performance with IBM System x3850 X6

SPECVirtSPECVirt

TPC-ETPC-E

SAP SD two-tier(4-socket)

SAP SD two-tier(4-socket)

#1

#1

#1

THREE #1 RECORD PERFORMANCE BENCHMARKS

ACHIEVED AT PRODUCT ANNOUNCEMENT1

(1/16/2014)

THREE #1 RECORD PERFORMANCE BENCHMARKS

ACHIEVED AT PRODUCT ANNOUNCEMENT1

(1/16/2014)

ACTION: Drive High End Solutions Focus: We have leadership across multiple workloads client deploy.ACTION: Drive High End Solutions Focus: We have leadership across multiple workloads client deploy.

7X OLTP Performance

Improvement on Microsoft SQL Server 2014Enterprise

Edition

7X OLTP Performance

Improvement on Microsoft SQL Server 2014Enterprise

Edition

TPC-HTPC-H

Paper:“OLTP Performance Unleashed…”

Paper:“OLTP Performance Unleashed…”

#1

MORE #1PERFORMANCEBENCHMARKS

ACHIEVED SINCE LAUNCH

Microsoft SQL Server 2014Enterprise Edition

MORE #1PERFORMANCEBENCHMARKS

ACHIEVED SINCE LAUNCH

Microsoft SQL Server 2014Enterprise Edition

1Click links for exact data about benchmarks. 1Click links for exact data about benchmarks.

4/16/144/16/14

Page 43: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Reference

3850x6 Landing Page– http://www-03.ibm.com/systems/x/hardware/enterprise/x3850x6/index.html

3950x6 Landing Page– http://www-03.ibm.com/systems/x/hardware/enterprise/x3950x6/index.html

Solutions and Reference Architectures– http://www-03.ibm.com/systems/x/solutions/index.html

3850/3950 Configuration and Options Guide– http://www-03.ibm.com/systems/xbc/cog/x3850x6_3837/x3850x6_3837aag.html

IBM Server Proven– http://www-03.ibm.com/systems/info/x86servers/serverproven/compat/us/indexsp.html

IBM x86 Solutions for VMware– http://www-03.ibm.com/systems/x/os/vmware/

43

Page 44: © 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales

© 2014 IBM Corporation

High Value x6 3850/3950 Technical Overview

Smarter Computing:Thank You !Trusted Innovation for Business Advantage

44