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Page 1: ˘ˇ ˆ - ASE Kaohsiung PowerPoint - ASEMTL buildup Roadmap 2004 0531 Author SHA00179 Created Date 6/21/2004 9:11:31

Rev. 20040531A

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Page 2: ˘ˇ ˆ - ASE Kaohsiung PowerPoint - ASEMTL buildup Roadmap 2004 0531 Author SHA00179 Created Date 6/21/2004 9:11:31

Rev. 20040531A

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Available Solutions

Category Items Available SolutionsMicro Via 48um, Staggered, StackedVOP Via on PTHPTH 100um, 150 umTenting 45/45 umSAP 20/20 umENIG Electroless Ni/AuSOP Solder on PadEntetic Low Alpha 63/27Leadfree Sn / Ag 3% / Cu 0.5%Core/Leadfree BT HL832LS

Core Halogen Free HL832NX, E679FGB

Dielectric/Leadfree ABF-SH9K

Dielectric/Halogen Free ABF-GX

Structure

Presolder

Material

Fine Pitch

Metal Finish

Page 3: ˘ˇ ˆ - ASE Kaohsiung PowerPoint - ASEMTL buildup Roadmap 2004 0531 Author SHA00179 Created Date 6/21/2004 9:11:31

Rev. 20040531A

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Test Vehicle - FC Substrate SpecificationTest Vehicle - FC Substrate Specification

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Page 4: ˘ˇ ˆ - ASE Kaohsiung PowerPoint - ASEMTL buildup Roadmap 2004 0531 Author SHA00179 Created Date 6/21/2004 9:11:31

Rev. 20040531A

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Stagger via

Stacked via

Via Pad

Via Pad

Via Drill Diameter

Via Pad Size

PTH Pad Size

Via, PTH, Line W/SVia, PTH, Line W/S

151518151820182025Build up

121515151518151820Necking

303540354040404050Core

Line W/S

150175180175180200180200300PTH Pad

707580758010080100150DiameterPTH

65758570801057085108Via Pad

353545404045404548Diameter

YYYYYYYYYStacked

YYYYYYYYYStagger

Via

5+N+55+N+54+N+44+N+44+N+43+N+34+N+43+N+33+N+3Structure

(N=Core Layer)

ProtoAdvancedNormalProtoAdvancedNormalProtoAdvancedNormal

200620052004Year

Flip-Chip IC Substrate Technology Roadmap I (Build-up)

Page 5: ˘ˇ ˆ - ASE Kaohsiung PowerPoint - ASEMTL buildup Roadmap 2004 0531 Author SHA00179 Created Date 6/21/2004 9:11:31

Rev. 20040531A

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SROSRO Pad Size

BumppitchSR width

Bump Pitch

SRO, Bump & Metal FinishSRO, Bump & Metal Finish

max 15max 15max 15max 15max 15max 15max 15max 15max 15Co-planarity

Bump

Metal Finish Solder on Pad /ENIGSolder on Pad /ENIGSolder on Pad /ENIG

90100115100115135115135175Bump Pitch

21+/-821+/-821+/-821+/-821+/-821+/-821+/-821+/-825+/-10THK

707590759010090100130SRO Pad

404560456070607090SROSolder Resist

ProtoAdvancedNormalProtoAdvancedNormalProtoAdvancedNormal

200620052004Year

Flip-Chip IC Substrate Technology Roadmap II (Build-up)

Page 6: ˘ˇ ˆ - ASE Kaohsiung PowerPoint - ASEMTL buildup Roadmap 2004 0531 Author SHA00179 Created Date 6/21/2004 9:11:31

Rev. 20040531A

������ ���������������� Qualification summaryQualification summaryPASS

Cutomer Structure Body Size Die Size Pre-con PCT TCT HAST HTST THT

125~ -55

125~ -55

130

/85%RH 150

pass 1000X 100hrs 1000hrs

125~ -55

121

/100%RH 125~ -55

130

/85%RH 150

85

/85%RH

pass 96hrs 1000X 100hrs 1000hrs 1000hrs

150 ~ -65

121

/100%RH 125 ~ -55

130

/85%RH 150

85

/85%RH

pass 96hrs 1000X 100hrs 1000hrs 1000hrs

125~ -55

125 ~ -55

130

/85%RH 150

85

/85%RH220

�� ��

Reflowpass

1000X 100hrs 1000hrs 1000hrs

125~ -55

125 ~ -55

130

/85%RH 150

85

/85%RH260 �� �� Reflow

pass 1000X 100hrs 1000hrs 1000hrs

125~ -55

125 ~ -55

130�

/85%RH 150

85

/85%RH220

�� ��

Reflowpass 1000X 100hrs 1000hrs 1000hrs

125~ -55

125 ~ -55

130

/85%RH 150

85

/85%RH260 �� �� Reflow

pass1000X 100hrs 1000hrs 1000hrs

125~ -55

125~ -55�

130

/85%RH 150

85

/85%RH

pass 1000X 100hrs 100hrs 100hrs

125~ -55

125 ~ -40

130

/85%RH 150

pass 1000X 168hrs 1000hrs

125~ -55

125 ~ -55

130

/85%RH

pass 1000X 168hrs

150~ -65

150~-65

130

/100%RH 150

pass 500X 96hrs 1000hrs35*35 9.93*6.17

37.5*37.5

40*40

14.5*14.5

Graphic

2+2+2

2+2+2

N/A

40*40 15.3*15.3

14.5*14.5

9.5*9.5 N/AChipSet 2+2+2

Test Vehicle 2+2+2

Graphic

N/A

2+2+2 40*40 14.5*14.5 N/A

40*40

Graphic

2+2+2 31*31 9.7*9.8

N/A3+2+3 10.92*10.85

N/A

2+2+2 31*31 9.7*9.8

40*40 14.5*14.5

N/A

N/A

Graphic

N/A N/AN/AGraphic 2+2+2 35*35 12*12

31*31

Graphic 2+2+2

ASIC 1+2+1

N/A

N/A

On-GoingCustomer Structure Body Size Die Size Pre-con PCT TCT HAST HTST THT

150~ -65�125~ -55

130

/85%RH 150

85

/85%RH

Pass 500X pass1000X on going

96hrs pass168hrs on going

500hrs pass1000hrs on going N/A

150~ -65

121

/100%RH 125~-55

130

/100%RH 150

pass 96hrs on going 500X on going 96hrs pass 500hrs passN/AGraphic 2+2+2 37.5*37.5

N/AGraphic 2+2+2 35*35

N/A

Page 7: ˘ˇ ˆ - ASE Kaohsiung PowerPoint - ASEMTL buildup Roadmap 2004 0531 Author SHA00179 Created Date 6/21/2004 9:11:31

Rev. 20040531A

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L/S = 18/12 um

Plating+ Flash Etching

Dry film Adhesion 12um

After Developing

L/S = 15/15 um

After Pretreatment

� Risk:

1.Line edge roughness : Change Film AW to Glass AW .

2.Stripping problem: Modify Stripping machine with add high-pressure set.

Decrease E'less roughness Rz from 10um to 6um

-->Change ABF SH-9K to GX type and modify desmear parameter

Fine Line Technology

�./7./���7��

Page 8: ˘ˇ ˆ - ASE Kaohsiung PowerPoint - ASEMTL buildup Roadmap 2004 0531 Author SHA00179 Created Date 6/21/2004 9:11:31

Rev. 20040531A

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2004 Advanced

150um Bump Pitch

2003 HVM

200um Bump Pitch

After Reflow

After Coining

Fine Pitch Technology

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Page 9: ˘ˇ ˆ - ASE Kaohsiung PowerPoint - ASEMTL buildup Roadmap 2004 0531 Author SHA00179 Created Date 6/21/2004 9:11:31

Rev. 20040531A

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2+N structure

One-Side Buildup

2+2+2 structure

Normal Buildup

Advantage:

1.Reduce buildup layer

2.Cost Saving

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New build-up technology

Page 10: ˘ˇ ˆ - ASE Kaohsiung PowerPoint - ASEMTL buildup Roadmap 2004 0531 Author SHA00179 Created Date 6/21/2004 9:11:31

Rev. 20040531A

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60um SRO (Mask design)50um SRO (Mask design)

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Capability Analysis

28

29

30

31

32

33

34

35

36

1 2 3 4 5 6

40

50

1 2 3 4 5 6

Page 11: ˘ˇ ˆ - ASE Kaohsiung PowerPoint - ASEMTL buildup Roadmap 2004 0531 Author SHA00179 Created Date 6/21/2004 9:11:31

Rev. 20040531A

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X-section 100X

Lead Free

X-section 500X

Lead Free

Top View

Lead Free

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Capability Analysis

Page 12: ˘ˇ ˆ - ASE Kaohsiung PowerPoint - ASEMTL buildup Roadmap 2004 0531 Author SHA00179 Created Date 6/21/2004 9:11:31

Rev. 20040531A

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Thin Core FC-BGA Capability

50/5090/100Core Layer LW/S

23.75*31.9mm35*35mmPackage Size

250um700umTotal Thickness

40/4030/30Build-up Layer LW/S

PP (60um)ABF (35um)Build-up Dielectric

T CompanyV CompanyCustomer

BT (0.06mm)BT (0.4mm)Core

SR7000SR7000SM

200um215umBump Pitch

StripUnitShipping Type

1+2+11+2+1Layer Structure

Laminate- FCSAP-FCType