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IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 53, NO. 9, SEPTEMBER 2005 2935

Electromagnetic Bandgap Power/Ground Planes forWideband Suppression of Ground Bounce Noise

and Radiated Emission in High-Speed CircuitsTzong-Lin Wu, Senior Member, IEEE, Yen-Hui Lin, Ting-Kuang Wang, Chien-Chung Wang, and Sin-Ting Chen

AbstractA power/ground planes design for efficiently elim-inating the ground bounce noise (GBN) in high-speed digitalcircuits is proposed by using low-period coplanar electromagneticbandgap (LPC-EBG) structure. Keeping solid for the groundplane and designing an LPC-EBG pattern on the power plane, theproposed structure omnidirectionally behaves highly efficiently insuppression of GBN (over 50 dB) within the broad-band frequencyrange (over 4 GHz). In addition, the proposed designs suppressradiated emission (or electromagnetic interference) caused by theGBN within the stopband. These extinctive behaviors of low ra-

diation and broad-band suppression of the GBN is demonstratednumerically and experimentally. Good agreements are seen. Theimpact of the LPC-EBG power plane on the signal integrity for thesignals referring to the power plane is investigated. Two possiblesolutions, differential signals and an embedded LPC-EBG powerplane concept, are suggested and discussed to reduce the impact.

Index TermsElectromagnetic bandgap (EBG), electromag-netic interference (EMI), ground bounce noise (GBN), high-speeddigital circuits, radiation, signal integrity (SI), simultaneouslyswitching noises (SSN).

I. INTRODUCTION

WITH the trends of fast edge rates, high clock frequen-cies, and low voltage levels for the high-speed digital

computer systems, the ground bounce noise (GBN) or simul-

taneously switching noise (SSN) on the power/ground planes

is becoming one of the major challenges for designing the high-

speed circuits. Because of the parallel-plate waveguide structure

between power and ground planes in the advanced high-speed

packages, the resonance modes of the parallel-plate waveguide

can be excited by the GBN. Research has shown the resonance

noise propagating between the power and ground planes could

cause serious signal integrity (SI) or power integrity (PI) prob-

lems for the high-speed circuits [1][3]. Moreover, due to the

cavity resonance effect between the power/ground planes, the

GBN also results in significant radiated emissions or electro-magnetic interference (EMI) issues [3].

Manuscript received November 29, 2004; revised May 18, 2005. This workwas supported by the National Science Council, Taiwan, R.O.C., under GrantNSC 93-2213-E-110-010.

T.-L. Wu is with the Department of Electrical Engineering and Graduate In-stitute of Communication Engineering, National Taiwan University, Taipei 106,Taiwan, R.O.C. (e-mail: [email protected]).

Y.-H. Lin, T.-K. Wang, C.-C. Wang, and S.-T. Chen are with the Departmentof Electrical Engineering, National Sun Yat-sen University, Kaohsiung 80424,Taiwan, R.O.C.

Digital Object Identifier 10.1109/TMTT.2005.854248

Several researchers have contributed to the mitigation of the

GBN. Adding decoupling capacitors between power and ground

planes is a typical way to eliminate the GBN and reduce the

EMI, but they are not effective above a few hundred megahertz

due to the unavoidable lead inductance. Although using the iso-

lation moat [3] on the power or ground plane or selecting the

location of the via ports to eliminate the excitation of the GBN

[4] could suppress the GBN at higher frequencies, these ap-

proaches are suitable only to suppress the GBN at specific lo-cations. Recently, a new idea for eliminating the GBN is pro-

posed by using a photonic bandgap (PBG) [5] or electromag-

netic bandgap (EBG) structure on the ground plane to form a

high-impedance surface (HIS) [1], [2]. By designing the for-

bidden bandgap of the EBG structure within the resonant mode

frequencies of the power and ground planes, this structure offers

an efficient suppression of the GBN propagating in omnidirec-

tion of the planes. However, multilayer substrates with specially

designed via are required in the EBG structure for achieving the

HIS on the ground plane [2].

This paper proposes a novel power/ground planes design

using a low-period coplanar EBG structure (LPC-EBG). Al-

though a similar EBG structure designed on the ground planehas been used in filter or antenna design in the microwave range

(above 10 GHz) [6], it has not been applied in the elimination of

the GBN on the power/ground planes of the high-speed digital

circuits. The key features of this new concept is keeping solid

or continuous for the ground plane and designing the LPC-EBG

structure on the power plane. Due to the periodic inductor and

capacitor (LC) networks realized by the combining effect of

the solid ground and the LPC-EBG power plane, the bandstop

behavior can be achieved. This design is suitable for applying

in high-speed circuits with GBN dominantly existing in the

low-frequency range below 6 GHz [1]. The advantages of this

design are broad-band suppression of the GBN due to the com-bining effect of the LPC-EBG structure on the power plane and

the continuous plane on the ground plane, low EMI caused by

the GBN because of the continuous ground reference, and low

cost due to the compatibility with the conventional printed cir-

cuit board (PCB) or package substrate manufacturing process.

This paper is organized as follows. Section II describes the

design concept and corresponding theoretical model of the

proposed LPC-EBG structure. In Section III, the distinctive

behavior of GBN elimination, both in frequency and time

domains, is measured and compared with simulation by the

three-dimensional (3-D)-finite-difference time-domain (FDTD)

method. The broad-band EMI suppression performance is also

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2936 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 53, NO. 9, SEPTEMBER 2005

Fig. 1. Schematicdiagram of proposed test boards.(a) 9-cell LPC-EBGboard.

(b) 25-cell LPC-EBG board.

Fig. 2. (a) Two unit cells of the LPC-EBG and its corresponding parameters.(b) Equivalent circuit model for the two connecting unit cells in Fig. 2(a).

presented in this section. The impact of the LPC-EBG struc-

ture on the SI is discussed, and corresponding solutions are

suggested in Section IV. Conclusions are drawn in Section V.

II. DESIGN AND MODEL OF THE LPC-EBG POWER PLANE

A. Structure Design

In high-speed digital circuit design, power and ground planes

are embedded in multilayer substrate of PCB to provide the re-

turn current for the high-speed signals and supply the neces-

sary dc voltage. From the SI point of view, keeping the ref-

erence planes continuous is important, to have a good signal

quality. Therefore, in our design, the ground plane is kept con-

tinuous, and the LPC-EBG structure is applied on the power

plane. Fig. 1(a) and (b) show two power/ground plane designs

with 9 (3 by 3) and 25 (5 by 5) unit cells on a two-layer FR4

PCB substrate. The dimension of the substrate is 90 mm 90

mm with 0.4 mm thickness. Fig. 2(a) shows two unit cells ofthe LPC-EBG connected by the bridges. Each unit cell consists

of one square metal pad and four connecting narrow bridges.

The corresponding geometrical parameters of the unit cell are

denoted as , where is the unit cell period, is

the bridge length, is the bridge width, is the half-gap be-

tween adjacent unit cells, and is the gap between the metal

pad and the bridge. The corresponding parameters for the de-

signs in Fig. 1(a) and (b) are (30, 5, 1, 1, and 1 mm) and (18,3, 1, 1, and 1 mm), respectively. The main differences of these

two designs are the cell period and the bridge length .

It is noted that these five geometrical parameters significantly

influence the bandstop behavior. The parameters of these two

designs are obtained through an optimal process for achieving

wider stopband bandwidth. As will be shown in the next section,

these two examples perform broader stopband than our previous

design [5].

B. Equivalent Model and Stopband Prediction

Although the proposed structure is constructed under a

two-dimensional (2-D) concept, a simple 1-D wave propaga-

tion model is developed to efficiently predict the bandwidth

and center frequency of the stopband for the LPC-EBG struc-

ture. Fig. 2(b) shows the equivalent circuit model for two

connecting unit cells shown in Fig. 2(a). Each unit section

of the equivalent model consists of two parts. The first part

describes the propagation characteristics between the square

metal pad on the power plane and the continuous ground plane,

using an equivalent inductance and capacitance . The

second part describes the connecting characteristics of the two

adjacent unit cells, which include the bridging effect with the

bridge inductance , bridge capacitance , and the capacitive

gap coupling effect between two adjacent unit cells. It is

assumed that infinite unit sections are periodically cascaded, asshown in Fig. 2(b), to represent the EBG structure.

Next, the dispersion behavior for the current on this periodic

circuit is derived. As shown in Fig. 2, the current on the first

part and the second part (sum of the current on and )

of section are denoted as and . The electric charges

on and of section are denoted as and . The

relations between the currents and node charges can be derived

as

(1)

(2)

(3)

(4)

Differentiating (3) and (4) with time, and combining with (1)

and (2), yields

(5)

(6)

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WU et al.: ELECTROMAGNETIC BANDGAP POWER/GROUND PLANES 2937

TABLE IESTIMATED PAD/BRIDGE/GAP INDUCTANCE AND

CAPACITANCE OF THE LPC-EBG STRUCTURE

Considering the periodic conditions of the EBG, it is assumed

that the wave solutions for and in (5) and (6) have the

same frequency and wave number but different amplitudes, and

are expressed as

(7)

(8)

where .

Substituting (7) and (8) into (5) and (6), and setting the de-

terminant of the coefficients of and to be zero, we obtain

the dispersion relation between and as

(9)

The values of the parameters , and are easily

obtained by the transmission line theory for the microstrip

line. The gap-coupling capacitance is calculated as, where is the

width of the square corner pad, and is the distance between

the centers of the neighboring corner pads [7]. The corre-

sponding parameter values for the 9-cell and 25-cell LPC-EBG

boards are listed in Table I. Employing (9), Fig. 3(a) and (b)

show the dispersion diagrams ( as a function of ) for 9-cell

and 25-cell LPC-EBG boards, respectively. As shown in Fig. 3,

there are two modes solved by (9), and a bandgap is clearly

seen between these two modes. The bandwidth of the stopband

predicted by the 1-D circuit model for the 9-cell board is 4.2

GHz, ranging from 1 to 5.2 GHz, and for the 25-cell board is

5.7 GHz, ranging from 2 to 7.7 GHz. Validity of this simplemodel will be checked by the measurement in the next section.

III. NUMERICAL AND EXPERIMENTAL RESULTS

A. GBN Suppression

1) Frequency Domain: We first see the bandstop behavior

for eliminating the GBN in frequency domain. Fig. 4(a) and

(b) show both the measured and simulated for the 9-cell

and 25-cell LPC-EBG boards, respectively. The behaviors of

the reference board with both power and ground plane being

solid (or continuous) are also included in these two figures for

comparison. The 3-D-FDTD approach is used to simulate the

GBN behavior for all power/ground plane structures. As shownin Fig. 4(a) and (b), good agreement between the measurement

Fig. 3. Dispersion diagrams ( as a function of ). (a) 9-cell LPC-EBG board.(b) 25-cell LPC-EBG board.

and 3-D-FDTD prediction is obtained. Slight discrepancy be-

tween them occurs at resonant peaks and at higher frequencies,

where the numerical prediction is higher than the measured

results. The reasons are that the dispersion property of theFR4 structure and the conductor loss due to skin effect is not

considered in our FDTD modeling. Comparing both LPC-EBG

boards with the reference board, it is clearly seen that the pro-

posed LPC-EBG power/ground planes significantly eliminate

the GBN with, on average, an over-50-dB suppression in a

broad-band frequency range. Here, the bandwidth is defined

as the range of the lower than dB. The simulated and

measured stopband bandwidth for 9-cell board is 3.9 and 4.1

GHz, respectively, and is 5.7 and 6.3 GHz, respectively, for the

25-cell board. The simulated and measured center frequency is

2.9 and 3.0 GHz, respectively, for the 9-cell board, and is 5.2

and 5.3 GHz for the 25-cell board. It is seen that the measured

bandwidth and center frequency of the stopband are slightlyhigher than the simulated one for both boards. The reason could

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Fig. 4. Comparison of obtained by 3-D-FDTD and measurement. (a)9-cell LPC-EBG board. (b) 25-cell LPC-EBG board.

TABLE II

BANDWIDTH AND CENTER FREQUENCY COMPARISON FORTHE PROPOSED LPC-EBG STRUCTURE

also be that the conductor loss and the dielectric dispersion

broaden the stopband at a higher frequency range, i.e., near 5

GHz for the 9-cell board and near 8 GHz for the 25-cell board.

Table II compares the bandwidth and center frequency

obtained by the 3-D-FDTD, the measurement, and the 1-D

equivalent circuit model. It is found that the 1-D circuit model

has good accuracy in predicting the stopband behavior of

the LPC-EBG structure. As shown in Table II, the difference

from either the 3-D-FDTD approach or the measurement is all

below 8%. Fig. 5 shows the measured , and for

the 9-cell board, where the receiving port (port1) is located

at (15 mm, 76 mm), and the noise is, respectively, excited atdifferent locations, port2 (45 mm, 72 mm), port3 (48 mm, 45

Fig. 5. Measured GBN suppression behavior for the noise excited at differentlocations; ports 2, 3, and 4, respectively.

mm), and port4 (48 mm, 12 mm). The left lower corner of the

board is defined as the zero point of the coordinate. It is seenthat the proposed design provides the similar broad-band GBN

suppression behavior for different positions of the noise. This

behavior demonstrates that the proposed power/ground planes

can omnidirectionally eliminate the GBN on the power plane.

2) Time Domain: Next, we try to understand the GBN sup-

pression capability in the time domain for the proposed power

plane. The power/ground planes of those test boards are excited

by a pulse-pattern generator (Anritsu MP1763C) to emulate the

GBN on the power plane, and the coupling noise at the receiving

port is measured in the time domain by the a signal analyzer

(Tektronix CSA8000). All test boards, including the reference,

9-cell, and 25-cell boards are measured. Fig. 6(a) shows thewaveform of the excitation waveform launched from the pat-

tern generator. It is a periodic square-like wave with frequency

2.25 GHz and amplitude 125 mV. The locations of the ex-

citation ports are (45 mm, 45 mm) for all test boards, and re-

ceiving ports are (15 mm, 75 mm) for both reference and 9-cell

boards and (27 mm, 63 mm) for 25-cell board. Fig. 6(b), (c),

and (d) show the measured GBN at the receiving port for the

reference, 9-cell, and 25-cell boards, respectively. It is seen that

peak-to-peak amplitude of the coupling noise is about 44, 7, and

11 mV, respectively, for these three boards. Compared with the

reference board, the GBN can be reduced about 84% and 75%,

respectively. It is clearly seen that the GBN is significantly re-

duced by the proposed LPC-EBG power planes.

B. Radiation (or EMI) Elimination

Previous literature showed that the microstrip line on the

EBG structure may cause significant leakage radiation on

the stopband, due to an imperfect reference plane [8]. Low

radiation or EMI is important in high-speed circuits for the

compliance of the strict electromagnetic compatibility (EMC)

regulations. This subsection numerically and experimentally

investigates the EMI performance of the proposed LPC-EBG

power/ground plane structure by comparing with the reference

board.

Fig. 7 shows the EMI measurement setup in an EMC fullyanechoic chamber. The test board is put on the wooden table,

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Fig. 6. Measured GBN suppression behavior in the time domain for the proposed power plane. (a) The waveform of the excitation source launched from a patterngenerator. (b) Coupling GBN at the receiving port for the reference board. (c) Coupling GBN at the receiving port for 9-cell LPC-EBG board. (d) Coupling GBNat the receiving port for 25-cell LPC-EBG board.

Fig. 7. Measurement setup for EMI in 3 m fully anechoic chamber.

and the RF signal of 20 mV generated by the signal source (HP

8324) is launched into the power plane of the board through

the high-frequency connector. The height of the receiving an-

tenna and test board is fixed at 1.2 m from the floor of the

chamber, and the distance between them is 3 m. The radiatedE-field below 1 GHz is measured by a bi-log antenna (Chase

CBL611 B), and above 1 GHz, the horn antenna (R&S HF906)

is employed. The wooden table with test board is rotated in

360 at the speed of 4.5 /s for each excited frequency point,

and the maximum radiated E-field is recorded by the spectrum

analyzer (R&S FSP) with 100 kHz resolution bandwidth. The

simulated radiated E-field in 3-D-FDTD modeling is obtained

by the near-field and far-field transformation of Kirchhoffs sur-

face integral [9] and Fourier transforms with source normaliza-

tion method [3].

Fig. 8(a) and (b) show the simulated and measured EMI ra-

diation at 3 m distance for the 9-cell and 25-cell LPC-EBG

boards, respectively. The reference board with both power and

ground plane being solid is also included in both figures for

comparison. Only the EMI behaviors below 4 GHz are mea-

sured, due to the limitation of our signal generator. It is seen that

the agreement between the measurement and the simulation is

reasonably good. For the reference board, there are several radi-

ation peaks with strength over 55 dB V/m at 1.6, 2.3, 3.3, and

3.7 GHz, which are corresponding to the resonance frequencies

of the cavity modes for the 9 cm board. However, for the 9-cell

and 25-cell boards, all of the radiation peaks have been sup-

pressed with the average radiation strength under 40 dB V/m.

It is clearly seen that the proposed power/ground plane design

performs with significantly low EMI behavior at the designed

bandgap frequency ranges, although several etched slots are de-signed on the power planes.

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Fig. 8. Simulated and measured EMI radiation at 3 m. (a) 9-cell LPC-EBGboard. (b) 25-cell LPC-EBG board.

IV. IMPACT ON THE SI AND POSSIBLE SOLUTIONS

Although the proposed power/ground planes designs show

excellent performance on eliminating the GBN and corre-

sponding EMI at broad-band frequency ranges, the power

planes with etched slots would degrade the signal quality for

the signal traces referring to the imperfect power plane [ 10].

This section will discuss the impact of the proposed LPC-EBG

power plane on the SI, and two possible solutions to improve

the SI are discussed.

A. Single-Ended and Differential Signals

Fig. 9(a) and (b) show the single-ended and differential traces,

respectively, of 60 mm passing from the first (top) layer to the

fourth (bottom) layer and back to the first layer, with two via

transitions along the signal path. The second and third layers are

the 9-cell power plane and solid ground plane, respectively. It is

known that via transitions and imperfect reference plane are two

of the main factors to influence the signal quality for the high-

speed signals. This setup in Fig. 9 tries to evaluate the impact of

the LPC-EBG power plane on the signal quality for the signals,

both referring to the power plane and with via transitions. The

traces are designed as 50 for the single-ended signal, and 100for the differential impedance. Eye patterns for evaluating the

Fig. 9. Four-layer structure with transmission line transient between the9-cell LPC-EBG power plane and solid ground plane. (a) Single-ended trace.

(b) Differential traces.

signal quality are obtained following three steps. First, the two-

port and four-port -parameters for the single-ended and differ-

ential cases, respectively, are simulated by the 3-D-FDTD. The

broad-band SPICE-compatible models are then extracted by the

commercial tool SPEED2000 (the boardband SPICE module)

using the solved -parameters. According to the broad-band

SPICE models, the eye patterns at the output side are finally

generated in the HSPICE environment by launching a pattern

source of - pseudorandom bit sequence (PRBS), nonreturn

to zero (NRZ), coded at 2.5 GHz. The bit-sequence swing and

the nominal rise/fall time are 500 mV and 120 ps, respectively,

for the single-ended case, and 250 mV and 100 ps for the dif-

ferential cases.Fig. 10(a) and (b) show the simulated eye patterns for the ref-

erence board with continuous power plane and the 9-cell board,

respectively. Two parameters, maximum eye open (MEO) and

maximum eye width (MEW), are used as metrics of the eye pat-

tern quality. It is seen that for the reference board, MEO

mV and MEW ps, and for the 9-cell board, MEO

mV and MEW ps. Compared with the reference board,

the degradation of the MEO and MEW for the 9-cell board is

about 17% and 4.6% in the single-ended case. It is believed

that this mild degradation is acceptable in practical high-speed

circuits. Furthermore, through suitable components placement

and layout designs, such as routing lower speed signals on thetop layer and keeping high-speed traces on the bottom layer,

keeping high-speed traces shorter, or avoiding the high-speed

signals crossing the cells, the overall SI performance will be

significantly better than the previously simulated case.

However, if long and high-speed signals are still necessary on

the first layer, the differential signaling approach is a good so-

lution in the LPC-EBG power/ground planes design. Fig. 10(c)

shows the eye patterns of the differential signals at the outside of

the configuration in Fig. 9(b). The MEO and MEW are 471 mV

and 389 ps, respectively. Compared with the single-ended case

on the 9-cell LPC-EBG board, the improvement of the MEO and

MEW is about 30% and 5% in the differential-signal case. It is

seenthattheSIperformanceofthedifferentialapproachissigni fi-cantlybetterthanthesingle-endedcases,bothinthe9-cellboards.

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Fig. 10. Simulatedeye patterns.(a) Reference board (continuous power plane)with single-end trace.(b) 9-cellLPC-EBG board with single-endtrace. (c)9-cellLPC-EBG board with differential traces.

B. Embedded LPC-EBG Power Planes

Another idea to solve the SI issues for the EBG-power plane

is adding one more ground plane above the EBG power plane.

As shown in Fig. 11, the LPC-EBG power plane is embedded

between two solid ground planes with the vias electrically

connecting these two planes. To keep the performance of the

broad-band GBN suppression, a suitable design for the vias

distribution and the substrate thickness between the addedground plane and the power plane is needed.

Fig. 11. Schematic of embedded 9-cell LPC-EBG power plane with groundvia stitching structure.

Fig. 12. Comparison of between embedded 9-cell LPC-EBG powerplane and embedded solid power-plane structure obtained by 3-D-FDTD andHFSS.

As shown in Fig. 11, an embedded 9-cell LPC-EBG board

is designed with the added substrate thickness being 0.4 mm.

There are 16 vias on each unit cell; each corner pad has four via

uniformly distributed with distance 7.5 mm. Fig. 12 shows the

frequency-domain response of the embedded LPC-EBG power

plane. The reference board with the continuous embedded

power plane is also presented for comparison. The results are

simulated both by the 3-D-FDTD method and the HFSS, based

on the finite-element method. The agreement between these two

approaches shows the validity of the simulated GBN-suppres-

sion behavior. It is seen that the designed embedded LPC-EBG

power plane still maintains broad-band GBN suppression in the

frequency range from 900 MHz to 4.8 GHz. Compared with

the performance using a two-layer design (one EBG power

and one ground plane) shown in Fig. 5, the embedded power

plane using three layers still keep excellent GBN elimination

capability. The main advantage of this design is that the signalquality will be better than the previous design, because both

reference planes are now continuous, but the design cost will

be increased because one more layer is needed.

V. CONCLUSION

A novel power/ground planes design using an LPC-EBG

structure is proposed to eliminate the GBN or SSN in high-speed

circuits. Two example designs, 9-unit cell and 25-unit cell

LPC-EBG boards, are implemented, and their extinctive

performance of efficient and wideband GBN suppression is

theoretically and experimentally demonstrated both in time

and frequency domains. It has been shown the LPC-EBGpower plane behaves over a 4-GHz stopband with an average

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of over 50-dB reduction of the GBN. A simple 1-D equivalent

circuit model with the periodic boundary conditions is also

developed to predict their stopband characteristics. In addition,

the proposed design suppresses low radiated emission (or EMI)

resulting from the GBN at the designed stopband, although

there are several etched slots on the power plane. The impact

of the LPC-EBG power plane on the SI for the signal tracesreferring to the power plane is investigated. Two possible

solutions, differential signals and embedded LPC-EBG power

planes, are proposed to decrease the influence on the SI.

REFERENCES

[1] R. Abhari and G. V. Eleftheriades, Metallo-dielectric electromagneticbandgap structures for suppression and isolation of the parallel-platenoise in high-speed circuits, IEEE Trans. Microw. Theory Tech., vol.51, no. 6, pp. 16291639, Jun. 2003.

[2] T. Kamgaing and O. M. Ramahi, A novel power plane with inte-grated simultaneous switching noise mitigation capability using highimpedance surface, IEEE Microw. Compon. Lett., vol. 13, no. 1, pp.2123, Jan. 2003.

[3] T. L. Wu, S. T. Chen, J. N. Huang, and Y. H. Lin, Numerical and exper-

imental investigation of radiation caused by the switching noise on thepartitioned dc reference planes of high-speed digital PCB, IEEE Trans.Electromagn. Compat., vol. 46, no. 1, pp. 3345, Feb. 2004.

[4] G.-T. Lei, R. W. Techentin, and B. K. Gilbert, High frequency char-acterization of power/ground-plane structures, IEEE Trans. Microw.Theory Tech., vol. 47, no. 5, pp. 562569, May 1999.

[5] T. L. Wu, Y. H. Lin, and S. T. Chen, A novel power planes with lowradiation and broadband suppression of ground bounce noise using pho-tonic bandgap structures, IEEE Microw. Compon. Lett., vol. 14, no. 7,pp. 337339, Jul. 2004.

[6] R. Coccioli, F. R. Yang, K. P. Ma, and T. Itoh, Aperture-coupled patchantenna on UC-PBG substrate, IEEE Trans. Microw. Theory Tech., vol.47, no. 11, pp. 21232130, Nov. 1999.

[7] D. F. Sievenpiper, High-impedance electromagnetic surfaces, Ph.D.dissertation, Dept. Elect. Eng., Univ. California at Los Angeles, Los An-geles, CA, 1999.

[8] N. Shino and Z. Popovic, Radiation from ground-plane photonicbandgap microstrip waveguide, in Dig. IEEE MTT-S Int. Microw.

Symp., Jun. 2002, pp. 10791082.[9] O. M. Ramahi, Near-field and far-field calculation in FDTD simula-

tions using Kirchhoff surface integral representation, IEEE Trans. An-tennas Propag., vol. 45, no. 5, pp. 753759, May 1997.

[10] Y. H. Lin and T. L. Wu, Investigation of signal quality and radiatedemission of microstrip line on imperfect ground plane: FDTD analysisand measurement, in Proc. IEEE Int. Symp. Electromagn. Compat.,Montreal, QC, Canada, Aug. 2001, pp. 319324.

Tzong-Lin Wu (S93M98SM04) received theB.S.E.E. and Ph.D. degrees from National TaiwanUniversity, Taipei, Taiwan, R.O.C., in 1991 and1995, respectively.

From 1995 to 1996, he was a Senior Engineer withMicroelectronics Technology, Inc., Hsinchu, Taiwan,

R.O.C. From 1996 to 1998, he was with the CentralResearch Institute, Tatung Company, Taipei, Taiwan,

R.O.C., where he was involved with the analysis andmeasurement of EMC/EMI problems of high-speed

digital systems. From 1998 to 2005, he was with theElectrical Engineering Department,National Sun Yat-SenUniversity (NSYSU),Kaohsiung, Taiwan, R.O.C. He is currently an Associate Professor with theDepartment of Electrical Engineering amd Graduate Institute of Communica-tion Engineering, National Taiwan University, Taipei, Taiwan, R.O.C. His re-search interests include design and analysis of fiber-optic components, EMCand signal-integrity design, and measurement for high-speed digital/optical sys-tems.

Dr. Wu received the Excellent Research Award and Excellent Advisor Awardfrom NSYSU in 2000 and 2003, respectively, the Outstanding Young EngineersAward from the Chinese Institute of Electrical Engineers in 2002, and the Wu

Ta-You Memorial Award from the National Science Council (NSC) in 2005. Hewas also listed in Marquis Whos Who in the World in 2001. He is a member ofthe Chinese Institute of Electrical Engineers.

Yen-Hui Lin was born in Chiayi, Taiwan, R.O.C., onFebruary 8, 1977. He received the B.S.E.E. degree in1999, and the Ph.D. degree in 2005, both from Na-tional Sun Yat-Sen University, Kaohsiung, Taiwan,R.O.C.

His research interests include the signal integrity(SI) and EMI designs in high-speed digital circuitsand numerical EM field analysis for EMC problems.

Dr. Lin received the Best Paper Award from theTaiwan Print Circuit Association (TPCA) in 2004.

Ting-Kuang Wang was born in Tainan, Taiwan,R.O.C., on December 27, 1980. He received the

B.S.E.E. degree from National Sun Yat-Sen Uni-

versity, Kaohsiung, Taiwan, R.O.C., in 2003, andis currently working toward the Ph.D. degree at thesame university.

His current research interest is the power-integritydesign in high-speed circuits.

Chien-Chung Wang was born in Tainan, Taiwan,R.O.C., in 1979. He received the B.S.E.E. degree

from National Sun Yat-Sen University, Kaohsiung,Taiwan, R.O.C., in 2003, and is currently workingtoward the Ph.D. degree in electrical engineering atthe same university.

His research interests include the EMI/SI measure-ment for high-speed digital circuits and numericalEM field analysis for EMC problems.

Sin-Ting Chen was born in Pingtung, Taiwan,R.O.C., in 1980. He received the B.S.E.E. degree

from National Sun Yat-Sen University, Kaohsiung,Taiwan, R.O.C., in 2002. He is currently workingtoward the Ph.D. degree in electrical engineering atthe same university.

His research interests are modeling and measure-ment for the power integrity of high-speed packageand printed circuit boards.

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