03 2.5d technologie, markus leitgeb ho - at&s · printing release layer 3. construct pcb 4....
TRANSCRIPT
Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben Tel +43 (0) 3842 200-0 | E-mail [email protected]
® Registered Trademark AT 257759
2.5D® Technology Platform
Markus Leitgeb
Programme Manager R&D
28. Februar 2013
2.5D Technology / Markus Leitgeb
Agenda
2.5D2.5D2.5D2.5D®®®® Basic PrincipleBasic PrincipleBasic PrincipleBasic Principle
RigidRigidRigidRigid----flex PCBsflex PCBsflex PCBsflex PCBs
2.5D2.5D2.5D2.5DCCCC CCCCavity avity avity avity
2.5D2.5D2.5D2.5DRRRR RRRRigidigidigidigid----flexible flexible flexible flexible
2.5D2.5D2.5D2.5D®®®® = = = = 2D Manufacturing 2D Manufacturing 2D Manufacturing 2D Manufacturing forforforfor3D Application3D Application3D Application3D Application
1
2.5D Technology / Markus Leitgeb
Agenda
2.5D2.5D2.5D2.5D® Basic Principle® Basic Principle® Basic Principle® Basic Principle
“Standard” Rigid“Standard” Rigid“Standard” Rigid“Standard” Rigid----flex PCBsflex PCBsflex PCBsflex PCBs
2.5D2.5D2.5D2.5DCCCC CCCCavity avity avity avity
2.5D2.5D2.5D2.5DRRRR RRRRigidigidigidigid----flexible flexible flexible flexible
2.5D2.5D2.5D2.5D®®®® = = = = 2D Manufacturing 2D Manufacturing 2D Manufacturing 2D Manufacturing forforforfor3D Application3D Application3D Application3D Application
2
What is 2.5D® Technology
� Core Competence AT&SHDI design rulesHigh thermal reliability (Reflow, TCT)High mechanical reliability (Drop Test)
� FeatureCavitiesRigid-flex (flex-to-install)3D ChannelEtc.
� BenefitCost advantage by using rigid PCB materials and processes
2.5D2.5D2.5D2.5D®®®® = Core = Core = Core = Core competencecompetencecompetencecompetence + Feature + + Feature + + Feature + + Feature + BenefitBenefitBenefitBenefit
Core Competence
AT&S
FeatureBenefit
2.5D2.5D2.5D2.5D®®®® = electrical & mechanical= electrical & mechanical= electrical & mechanical= electrical & mechanicalminiaturizationminiaturizationminiaturizationminiaturization
2.5D Technology / Markus Leitgeb 3
Basic Principle
1. Starting with Laminate 2. Printing Release Layer
3. Construct PCB 4. Laser Cutting
5. Cap Removal 6. Stripping Release Layer
2.5D Technology / Markus Leitgeb 4
Technology Platform
No limitations in base materials (e.g.. High Frequency, High Tg, halogen –reduced,…)
No limitations in shape and depth of cavity
Surface finishes in cavities (e.g.. ENiG, OSP,…)
Several depths can be achieved in 1 card
Solder mask in cavity
Fan out of assembled layer with vias
Excellent reliability performance Lateral non-conductive connection
Transport of gas through the PCB
Combination of FR4 and/ or Polyimide materials
No baking process prior to assembly needed for FR4 build up
High miniaturization potential for Polyimide build ups
Symmetrical build ups
Proven reliability for Flex-to-install applications
HDI Design guide lines
2.5D®
2.5DC Cavity
2.5DP Pipe
2.5DR Rigid-Flexible
® Registered Trademark AT 257759
2.5D Technology / Markus Leitgeb 5
2.5D Technology / Markus Leitgeb
Agenda
2.5D2.5D2.5D2.5D® Basic Principle® Basic Principle® Basic Principle® Basic Principle
“Standard” Rigid“Standard” Rigid“Standard” Rigid“Standard” Rigid----flex flex flex flex PCBsPCBsPCBsPCBs
2.5D2.5D2.5D2.5DCCCC CCCCavity avity avity avity
2.5D2.5D2.5D2.5DRRRR RRRRigidigidigidigid----flexibleflexibleflexibleflexible
2.5D2.5D2.5D2.5D®®®® = = = = 2D Manufacturing 2D Manufacturing 2D Manufacturing 2D Manufacturing forforforfor3D Application3D Application3D Application3D Application
6
„Standard“ Rigid-flex
Solder mask/ Cover layFlexible material , PINo-flow Prepreg
FR4 0,30 to 2,0 mm
Solder mask
Solder mask/ Cover layFlexible material , PICover layNo-flow Prepreg
FR4 0,30 to 2,0 mm
Solder mask
1-layer flexible
1- to 7-layers FR4
Total 8 layers
2-layers flexible
1- to 6-layers FR4
Total 8 layers
RigidRigidRigidRigid----flex on outermost layersflex on outermost layersflex on outermost layersflex on outermost layers
Special Materials• Polyimide Materials � hygroscopic (dimension stability, assembly!)• Noflow Prepregs and cover lay � cutting process
Special Process Steps• Pre-routing of cores � limitations in stack-up and design rules
Manufacturing costsAssembly processDesign rules
2.5D Technology / Markus Leitgeb 7
Solder mask
FR4 1 to 3 Cu-Layers
No-flow Prepreg/ Cover lay
50 µm Polyimide 2 x CuNo-flow Prepreg/ Cover lay
FR4 1 to 3 Cu-Layers
Solder mask
1- to 2 flexible layers, Partial Cover lay 2- to 6 layers FR4, total 8 layers
„Standard“ Rigid-flex
RigidRigidRigidRigid----flex in flex in flex in flex in centercentercentercenter layerslayerslayerslayers
Special Materials• Polyimide Materials � hygroscopic (dimension stability, assembly!)• No-flow Prepregs and Cover lay � cutting process
Special Process Steps• Pre-routing of cores � limitations in stack-up and design rules• Partial Cover lay ���� handling
Manufacturing costsAssembly processDesign rules
2.5D Technology / Markus Leitgeb 8
2.5D Technology / Markus Leitgeb
Agenda
2.5D2.5D2.5D2.5D® Basic Principle® Basic Principle® Basic Principle® Basic Principle
“Standard” Rigid“Standard” Rigid“Standard” Rigid“Standard” Rigid----flex flex flex flex PCBsPCBsPCBsPCBs
2.5D2.5D2.5D2.5DCCCC CCCCavity avity avity avity
2.5DR 2.5DR 2.5DR 2.5DR RigidRigidRigidRigid----flexible flexible flexible flexible
2.5D2.5D2.5D2.5D®®®® = = = = 2D Manufacturing 2D Manufacturing 2D Manufacturing 2D Manufacturing forforforfor3D Application3D Application3D Application3D Application
9
2.5DR – Rigid-flexible
2.5DR Rigid-Flexible
Flex on outer layer(s) Flex in center layer(s)
2.5D Technology / Markus Leitgeb 10
BU-Layer 1
2.5DR – Rigid-flexible
Stack UpStack UpStack UpStack Up
2.5D Technology / Markus Leitgeb
Feature Value Comment
Multilayer >=2 Layers
BU-Layer 1 Glass cloth 106 or 1080
BU-Layer 2 <50µm
PP 2 Glass cloth 106 oder 1080 or RCC-foilCu 2 / Soldermask <50µm: Flexible Soldermask
>50µm: Cover LayerFlexible Soldermask --> Polyimide-free BuildNo cross hatched design in flexible area
Bending radius (5x Bending 180°) > 3mm
Multilayer > 2 Layers
Laser Cut
Release Layer
BU-Layer 1
Lamination of PP
BU-Layer 2
BU-Layer 2
Lamination of PP
Solder mask
Depth Routing
11
2.5DR – Rigid-flexible
AdvantagesAdvantagesAdvantagesAdvantages
� Developed for “thin” build up layers
� Usage of standard material (halogen-free,…)
� Symmetrical build up with 1 or 2 flexible layers � Very thin Stack-ups possible
� Polyimide PI free � No baking process needed (process window)
� No Damage of Flexible layers �Increased Bending Performance
� No special materials � Cost advantage
� HDI design rules remain the same (also in flexible layers)
2.5D Technology / Markus Leitgeb 12
2.5DR – Rigid-flexible
10 Layer PCB with 1 HDI layerPI-free build upLaser via in flexible layerIndustrial application1,6mm thickness
SamplesSamplesSamplesSamples
2.5D Technology / Markus Leitgeb 13
2.5DR – Rigid-flexible
6 Layer PCB with buried viasPI-free build up2 Flexible layersEdge platingAutomotive application
SamplesSamplesSamplesSamples
2.5D Technology / Markus Leitgeb
SM25µm Cu0106PP18µm Cu0106PP25µm Cu510µm FR4 Core25µm Cu0106PP18µm Cu0106PP25µm CuSM Flex SM
14
2.5D® - Samples
Flex-to-install HDI in Flexible layerPolyimide-free build up (1x1080PP)PTH in CavityENiG in Cavity
2.5DR and 2.5DC sample2.5DR and 2.5DC sample2.5DR and 2.5DC sample2.5DR and 2.5DC sample
2.5D Technology / Markus Leitgeb 15
2.5DR – Rigid-flexible
2.5DR Rigid-Flexible
Flex on outer layer(s) Flex in center layer(s)
2.5D Technology / Markus Leitgeb 16
2.5DR – Rigid-flexible
Feature Value CommentFlex Core Polyimid: >=50µm
FR4: 50-75µm Polyimid-free Build upCu 1 18-35µmRCC- Foil 55-75µmCu RCC 18-35µm Can be used for design
PP X According Stack up Maximum 4 relaminationsMaximum total thickness: 1,6mm
Cu X According DesignBending radius(5x Bending180°)
Polyimid 50µm: > 2mm No dynamic bending or folding, no airgapFR4 50-75µm: > 3mm
Stack UpStack UpStack UpStack Up
2.5D Technology / Markus Leitgeb
Flex Core Flex Core
RCC-Foil
RCC-Foil
Release layer
Release layer
Lamination PP
Lamination PP(s)
Laser Cut
Solder Mask
Solder Mask
17
2.5DR – Rigid-flexible
� Tailor-made solutions
� 100% FR4 solution in place � No baking process needed
� Combination of PI-Core and Epoxy-Resin� High potential for miniaturization
� 100% PI solution under development � Full bending performance
� Symmetrical build up with Prepregs, RCC-foils
� HDI design rules remain the same
Flexible inner layer(s)Flexible inner layer(s)Flexible inner layer(s)Flexible inner layer(s)
2.5D Technology / Markus Leitgeb 18
2.5DR – Rigid-flexible
5-2-5 Build upFull Polyimide build up in bending areaMobile devices800µm thickness
DevelopmentDevelopmentDevelopmentDevelopment
2.5D Technology / Markus Leitgeb 19
UL-V0 Approval E67138
2.5D Technology / Markus Leitgeb
2.5DC 2.5DR
RF1 Logo RF1
Flame only Class Flame only
Panasonic R-1755M Base material Core Panasonic R-1755M
Panasonic R-1650M Base material Prepreg Panasonic R-1650M
Huntsman Probimer 65 Solder mask Huntsman Probimer 65
------------ Flexible Solder mask Taiyo PSR-4000 FLX101
>80µm Minimum remainingdielectric thickness
>80µm
20
2.5D Technology / Markus Leitgeb
Agenda
2.5D2.5D2.5D2.5D® Basic Principle® Basic Principle® Basic Principle® Basic Principle
“Standard” Rigid“Standard” Rigid“Standard” Rigid“Standard” Rigid----flex flex flex flex PCBsPCBsPCBsPCBs
2.5DC 2.5DC 2.5DC 2.5DC Cavity Cavity Cavity Cavity
2.5DR 2.5DR 2.5DR 2.5DR RigidRigidRigidRigid----flexible flexible flexible flexible
2.5D2.5D2.5D2.5D®®®® = = = = 2D Manufacturing 2D Manufacturing 2D Manufacturing 2D Manufacturing forforforfor3D Application3D Application3D Application3D Application
21
2.5DC – Cavity Formation
Enhance thermal management
by removing PCB material
Enhance radio performance
by removing PCB material below antennas
Reduce the thickness of an assembled device
by recessing “thick” components
Reasons for CavitiesReasons for CavitiesReasons for CavitiesReasons for Cavities
2.5D Technology / Markus Leitgeb 22
2.5DC – Cavity Formation
No limitations in base materials (e.g. High Frequency, High Tg, halogen reduced,…)
No limitations in shape and depth of cavity
Advantages of 2.5DCAdvantages of 2.5DCAdvantages of 2.5DCAdvantages of 2.5DC
2.5D Technology / Markus Leitgeb 23
2.5DC – Cavity Formation
No limitations in surface finish (e.g. ENiG, OSP,…)
Solder mask in cavity Fan out of cavity layer with vias
OSP finishingSIT finishing Carbon
Advantages of 2.5DCAdvantages of 2.5DCAdvantages of 2.5DCAdvantages of 2.5DC
2.5D Technology / Markus Leitgeb 24
2.5DC – Cavity Formation
Item Description Value [µm]A Min. Trace Width (inside cavity) for max. 25µm Cu thickness 60B Min. Spacing (inside cavity) for max. 25µm Cu thickness 60C Min. Space between SM and Cavity edge(outside cavity) 150D Min. Space between Cavity edge to Cu edge (EP outside Cavity) 500E Min. Laser Stop Width inside Cavity 350F Min. Laser Stop Width outside Cavity 100G Min. Space between Cavity edge to Cu edge (Outside Cavity) 250
HMin. Cavity Depth 50Max. Cavity Depth 750
K Min. Space between Cavity edge to Cu edge (Inside Cavity) 500
XMin. Cavity Width 1000Max. Cavity Width no limitationTolerance (+/-) -0,25
YMin. Cavity Width 1000Max. Cavity Width no limitationTolerance (+/-) -0,25
Design RulesDesign RulesDesign RulesDesign Rules
2.5D Technology / Markus Leitgeb 25
2.5DC – Stencil Printing
Footprint
Cavity depth
100µm 500µm 1000µm
BGA
Simple
Stencil Alternative needed?
ApplicationApplicationApplicationApplication ofofofof soldersoldersoldersolder pastepastepastepaste in PCB in PCB in PCB in PCB cavitiescavitiescavitiescavities
Is there a limititaion for stencil printing?
2.5D Technology / Markus Leitgeb 26
2.5DC – Stencil Printing
Component footprint: 0603 and 0402Fine pitch pads: 0,5mm and 0,4mmµBGA: 0,5mm and 0,3mm pitch
Project with Christian Project with Christian Project with Christian Project with Christian KoenenKoenenKoenenKoenen GmbHGmbHGmbHGmbH****
Stencil printing in PCB cavities
* Paper was published at SMTA, May 3-6 2011, Toronto
Cavity depths: 0- 750µmSolder mask on SurfaceOSP surface finishAlignment fiducilas only on outer layers
2.5D Technology / Markus Leitgeb 27
28
Step Stencil
Squeegee
� Base thickness 1mm� Print area 80µm� Sloped step edges
2.5DC – Stencil Printing
Printing SystemPrinting SystemPrinting SystemPrinting System
2.5D Technology / Markus Leitgeb
2.5DC – Stencil Printing
* Paper was published at SMTA, May 3-6 2011, Toronto
Results for Paste VolumeResults for Paste VolumeResults for Paste VolumeResults for Paste Volume
• The trials demonstrated successful solder paste printing in PCB cavities• Paste Type 4 shows better performance in terms of volume & surface coverage
than type 3• The biggest variation can be accounted with the solder mask height delta on
0µm• The somewhat inferior performance of 0,3mm BGA appears unrelated to cavity
depth
2.5D Technology / Markus Leitgeb 29
Very high z-axis accuracy
Cost advantage over conventional cavity and rigid flex concepts
Full HDI stacked via design rule available
Proven reliability for flex-to-install applications
No limitation in bases materials
Solder-able surfaces in cavities
Different technologies can be combined
Mass volume production capability
2.5D Technology / Markus Leitgeb
2.5D® = Mechanical and electrical miniaturization
2.5D® Technology Platform
30
AT&S – Well Positioned for the Future
Danke für Ihre Aufmerksamkeit!Danke für Ihre Aufmerksamkeit!Danke für Ihre Aufmerksamkeit!Danke für Ihre Aufmerksamkeit!
2.5D Technology / Markus Leitgeb 31