09/02/20121 delay chip prototype & delay chip test board joan mauricio – xavier ondoño la...

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09/02/2012 1 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

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12/04/20133 Delay Chip Features (1/3) –QFN48 Package. –4 DLL Channels (12 sub-channels). –Jitter: 4 ps. –DNL: 18 ps. –Delay Range: ~ ns. –~280 mW power consumption. –70 mW per DLL Channel. –INT/T&H DLL: 27 mW. –ADC DLL: 13 mW. –3 LVDS Drivers: 30 mW.

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Page 1: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

09/02/2012 1

Delay Chip Prototype&

Delay Chip Test Board

Joan Mauricio – Xavier Ondoño

La Salle (URL)

12/04/2013

Page 2: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

12/04/2013 2

Delay Chip Overview

SPI Slave

ResetBlock

Mux

VCDL+Mux

Phase Comp +

Charge PumpConfig Status

VCDL+MuxConfig

rst

nRst

coarse

coarse vControl

clkRef

clkINT<3:0>

clkT&H<3:0>

clkADC<3:0>

vControl<3:0>

Analog Config.

Digital Config.

Diff. LVDS Clock

Diff.CMOS Clock

Slow Control

!en, clk din, dout

nRst

nRst

powRstIn

powRstOut(externally shorted)

vRef···

Page 3: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

12/04/2013 3

Delay Chip Features (1/3)

– QFN48 Package.

– 4 DLL Channels (12 sub-channels).– Jitter: 4 ps.– DNL: 18 ps.– Delay Range: 17.45 ~ 39.88 ns.

– ~280 mW power consumption.– 70 mW per DLL Channel.

– INT/T&H DLL: 27 mW.– ADC DLL: 13 mW.– 3 LVDS Drivers: 30 mW.

Page 4: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

12/04/2013 4

Delay Chip Features (2/3)

– Each DLL channel contains:– 1 x LVDS to CMOS driver.– 2 x VCDLs.– 3 x Multiplexors.– 1 x Phase Comparator.– 1 x Charge Pump.– 2 x Configuration Registers.– 1 x Status Register– 3 x CMOS to LVDS driver.

Page 5: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

12/04/2013 5

Delay Chip Features (3/3)

– SPI Slave:– Interfaces with SPI Master (Mode 1).– Works fine @ 20 Mbps.– Up to 32 Configuration registers and 32 Status Registers.– Also implements a software reset (used to clear the charge pumps).

– Serial Registers:– 16 Bits R/W TMR Registers (Configuration).– 8 Bits RO (Status). No memory.

– Reset:– Power Reset signal (1-ms-wide, active high) is generated.– Power Reset can be inhibited by not shorting pins 47 and 48.– Glitch supressor ensures that SETs do not accidentally reset the chip (up to

8-ns-wide glitch).

Page 6: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

12/04/2013 6

Power Reset & Glitch Supressor

Page 7: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

12/04/2013 7

SPI Slave Addressing Scheme

ADDR ICECAL Ch Width (bits) Description0x00 0 16 Integrator / Track&Hold Clock Configuration Register.0x01 0 16 ADC Clock Configuration Register.0x02 1 16 Integrator / Track&Hold Clock Configuration Register.0x03 1 16 ADC Clock Configuration Register.···0x10 2 16 Integrator / Track&Hold Clock Configuration Register.0x11 2 16 ADC Clock Configuration Register.0x12 3 16 Integrator / Track&Hold Clock Configuration Register.0x13 3 16 ADC Clock Configuration Register.···0x40 Any - Software Reset of the Charge Pumps.···0xA0 0 8 Status Register.0xA1 1 8 Status Register.0xB0 2 8 Status Register.0xB1 3 8 Status Register.···0xFF - - SDI / SDO Bypass. For testing purposes.

b7 b6 b5 b4 b3 b2 b1 b0

R/!W Pump Rst Status/!Conf RSEL4 RSEL3 RSEL2 RSEL1 RSEL0

Page 8: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

– Integrator / Track & Hold Clock Configuration Registers (default 0x9E00):

– ADC Clock Configuration Registers (default 0x9E00):

– CE : LVDS Output Clock Enable. If 0, outputs are tri-stated (default = ‘1’).– ϕT&H : Track & Hold Clock phase. MSB = b13 (default = 0xF).

– ϕINT : Integrator Clock phase. MSB = b8 (default = 0x0).

– ϕADC : ADC Clock phase. MSB = b13 (default = 0xF).

– VCE : Enables Voltage Control monitors 0~3 (default = ‘0’).– DEB : Internal pads Output Enable (default = ‘0’). *Only available in SPI @ = 2. – LOCUS: LVDS Output Current Selector (default = ‘00’).

‘00’: 3.0 mA. ‘10’: 2.3 mA. ’01’: 1.4 mA. ‘11’: .35 mA.

12/04/2013 8

SPI Slave Configuration Data Frames

b15 b14 b13..9 b8..4 b3 b2 b1..0

CE - ϕT&H ϕINT VCE DEB* LOCUS

b15 b14 b13..9 b8..4 b3 b2 b1..0

CE - ϕADC - - - LOCUS

Page 9: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

– DLL Status Registers:

– ESLOW : Error: VCDL is too slow. DNL > 0.– LOCKED : DLL is locked.

– WFAST : Warning: VCNTi is near to cut VCDL NMOS transistors.

12/04/2013 9

SPI Slave Status Data Frame

b7 b6 b5 b4..0

ESLOW LOCKED WFAST 00000

Page 10: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

TEST BOARD…

09/02/2012

Page 11: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

– Main features:– Mechanically compatible with the analog mezzanine.– Clock signals will be tested with probes.– Requires 5 FPGA wires (2 SPI Masters).– It also can work in standalone mode (USB SPI).– Coarse voltage:

– Resistive Voltage Divider.– Low cost SPI DAC.

12/04/2013 11

Delay Chip Test Board Schematics

Page 12: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

BACKUP…

09/02/2012

Page 13: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

12/04/2013 13

Delay Chip Pinout (1/3)

CK

T&H

<0>

QFN-48

1

2

3

4

5

6

7

8

9

10

11

33

32

31

30

29

28

27

26

25

35

34

13 14 15 16 17 18 19 20 21 22

44 43 42 41 40 39 38 3747 46 45

SP

IDIN

SP

ICLK

SP

IEN

SP

IDO

UT

VS

S

VD

D

VD

D

CK

INT<

3>

CK

INT<

3>

CK

T&H

<3>

CK

T&H

<3>

PW

RS

TO

PW

RS

TI

RS

T

CO

AR

SE

VS

S

VD

D

VS

S

CK

T&H

<0>

CK

INT<

0>

CK

INT<

0>

CKT&H<1>

CKINT<1>

CKINT<1>

VCNT<1>

VDD

VSS

VCNT<2>

CKINT<2>

CKINT<2>

CKT&H<2>

CKT&H<2>1223 24

36 CKT&H<1>48

VC

NT<

0>

VC

NT<

3>

CKADC<0>

CKADC<0>

CKADC<1>

CKADC<1>

VSS

VDD

CLKREF

CKADC<2>

CKADC<2>

CKADC<3>

CKADC<3>

CLKREF

Control Voltages

Power / Ground

LVDS Clocks

Slow Control (SPI)

Page 14: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

15/02/2013 14

Delay Chip Pinout (2/3)

Pin No. Mnemonic Description1 CKADC<0> Positive LVDS Clock Output pin to Channel 0 ADC. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

2 CKADC<0> Negative LVDS Clock Output pin to Channel 0 ADC. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

3 CKADC<1> Negative LVDS Clock Output pin to Channel 1 ADC. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

4 CKADC<1> Positive LVDS Clock Output pin to Channel 1 ADC. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

5 CLKREF Positive LVDS Clock Input pin. VCM = 1.2 V. VDIFF = 400 mV (rT = 100Ω).

6 VSS Ground.

7 VDD Supply Voltage (3.3 V).

8 CLKREF Negative LVDS Clock Input pin. VCM = 1.2 V. VDIFF = 400 mV (rT = 100Ω).

9 CKADC<2> Positive LVDS Clock Output pin to Channel 2 ADC. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

10 CKADC<2> Negative LVDS Clock Output pin to Channel 2 ADC. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

11 CKADC<3> Negative LVDS Clock Output pin to Channel 3 ADC. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

12 CKADC<3> Positive LVDS Clock Output pin to Channel 3 ADC. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

13 SPIDIN SPI Data Input.

14 SPICLK SPI Clock.

15 SPIEN SPI Enable. Active low.

16 SPIDOUT SPI Data Out. Open drain.

17 VCNT<3> DLL Channel 3 Control Voltage monitor.

18 VSS Ground.

19 VDD Supply Voltage (3.3 V).

20 VDD Supply Voltage (3.3 V).

21 CKINT<3> Positive LVDS Clock Output pin to Channel 3 Integrator block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

22 CKINT<3> Negative LVDS Clock Output pin to Channel 3 Integrator block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

23 CKT&H<3> Positive LVDS Clock Output pin to Channel 3 Track & Hold block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

24 CKT&H<3> Negative LVDS Clock Output pin to Channel 3 Track & Hold block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

Page 15: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

15/02/2013 15

Delay Chip Pinout (3/3)

Pin No. Mnemonic Description25 CKT&H<2> Positive LVDS Clock Output pin to Channel 2 Track & Hold block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

26 CKT&H<2> Negative LVDS Clock Output pin to Channel 2 Track & Hold block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

27 CKINT<2> Positive LVDS Clock Output pin to Channel 2 Integrator block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

28 CKINT<2> Negative LVDS Clock Output pin to Channel 2 Integrator block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

29 VCNT<2> DLL Channel 2 Control Voltage monitor.

30 VSS Ground.

31 VDD Supply Voltage (3.3 V).

32 VCNT<1> DLL Channel 1 Control Voltage monitor.

33 CKINT<1> Negative LVDS Clock Output pin to Channel 1 Integrator block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

34 CKINT<1> Positive LVDS Clock Output pin to Channel 1 Integrator block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

35 CKT&H<1> Negative LVDS Clock Output pin to Channel 1 Track & Hold block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

36 CKT&H<1> Positive LVDS Clock Output pin to Channel 1 Track & Hold block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

37 CKINT<0> Negative LVDS Clock Output pin to Channel 0 Integrator block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

38 CKINT<0> Positive LVDS Clock Output pin to Channel 0 Integrator block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

39 CKT&H<0> Negative LVDS Clock Output pin to Channel 0 Track & Hold block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

40 CKT&H<0> Positive LVDS Clock Output pin to Channel 0 Track & Hold block. VCM = 1.2 V. VDIFF = 300 mV (rT = 100Ω).

41 VCNT<0> DLL Channel 0 Control Voltage monitor.

42 VSS Ground.

43 VDD Supply Voltage (3.3 V).

44 VSS Ground.

45 COARSE DLL Channel 0~3 external Voltage adjust.

46 RST SPI Slave Reset and Memory Preset.

47 PWRSTI Power Reset Input.

48 PWRSTO Power Reset (1.2 ms wide) Output.

Page 16: 09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013

• USB RS232:

• RS232 SPI (PIC):

12/04/2013 16

Delay Chip Test Board Schematics

• Coarse (DAC):