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Z-PACK Slim UHD Connector Platform RoHS Ready

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Page 1: 1-Z-PACK Slim UHD CONNECTIVITY/1982257-5.pdf · Z-PACK Slim UHD CS (Common Speed) 3.5 Gbps Z-PACK Slim UHD HS (High Speed) 12.5+ Gbps (2.0 DP/Column) 20+ Gbps (1.5 DP/Column) PIN

Z-PACK Slim UHD Connector Platform

RoHSReady

1-Z-PACK Slim UHD.qxd 13.09.2008 11:18 Uhr Seite 1

Page 2: 1-Z-PACK Slim UHD CONNECTIVITY/1982257-5.pdf · Z-PACK Slim UHD CS (Common Speed) 3.5 Gbps Z-PACK Slim UHD HS (High Speed) 12.5+ Gbps (2.0 DP/Column) 20+ Gbps (1.5 DP/Column) PIN

Introduction

Z-PACK Slim UHD Connector Platform Catalog 1654261-5 Issued 9-2008

www.tycoelectronics.com

All specifications subject to change. Consult Tyco Electronics for latest specifications. 2

Description

Z-PACK Slim (low profile) UHD(Ultra High Density) is a flexible and upgradeableconnector system designed tofit 15 mm (0.6 inch) slotpitch applications.

The Z-PACK Slim UHD con-nector has an extremely highcontact density combinedwith excellent high speedsignal performance.

Applications

� Telecom Equipment

� Switches

� Routers

� Servers etc.

Key Features

� Density of 55 pins/cm2

� Fits +13 mm slot pitches

� 20+ Gbps scalable signalspeed

� Complete end-to-end stackable

� Press-fit termination technology

� Different pin assignments possible

� Post/Premating possible

� Integrated polarization and guiding

For more Information:http://www.zpackuhd.com

Disclaimer

While Tyco Electronics Corporation and its affiliates referenced herein (“Tyco Electronics”) have made every reasonable effort to ensure theaccuracy of the information in this catalog, Tyco Electronics does not guarantee that it is error-free, nor does Tyco Electronics make anyother representation, warranty or guarantee that the information is accurate, correct, reliable or current.

Tyco Electronics reserves the right to make any adjustments to the information contained herein at any time without notice. Tyco Electronics expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose. Tyco Electronics’ only obligations are those in the Tyco Electronics Standard Termsand Conditions of Sale, and in no case will Tyco Electronics be responsible for any incidental, indirect, or consequential damages arisingfrom the sale, resale, use, or misuse of its products. Users should independently evaluate the suitability of, and test each product for, their application.

The dimensions, specifications, designs, construction, materials and processes in this catalog are for reference purposes only and are subject to change without notice. Please consult Tyco Electronics for the most current product information.

The export of certain Tyco Electronics products is restricted by the Arms Export Control Act (Title 22, U.S.C. Sec 2751, et seq.) or the Export Administration Act of 1979, as amended (Title 50, U.S.C., App. 2401 et seq.). Orders may be subject to export approval by the U.S. Government. Buyer must comply with all applicable export laws of all applicable jurisdictions.

1-Z-PACK Slim UHD.qxd 13.09.2008 11:18 Uhr Seite 2

Page 3: 1-Z-PACK Slim UHD CONNECTIVITY/1982257-5.pdf · Z-PACK Slim UHD CS (Common Speed) 3.5 Gbps Z-PACK Slim UHD HS (High Speed) 12.5+ Gbps (2.0 DP/Column) 20+ Gbps (1.5 DP/Column) PIN

Connector Concept

Z-PACK Slim UHD Connector Platform Catalog 1654261-5 Issued 9-2008

www.tycoelectronics.com

All specifications subject to change. Consult Tyco Electronics for latest specifications. 3

For other assignments, please see Application Specification or contact Tyco Electronics.

Upgradeability

� Z-PACK Slim UHD CS (Common Speed) �3.5 Gbps

� Z-PACK Slim UHD HS (High Speed) 12.5+ Gbps (2.0 DP/Column) 20+ Gbps (1.5 DP/Column)

PIN ASSIGNMENTS

2.0 DP/Column 1.5 DP/Column 1.5 DP/Column 1.5 DP/Column Single Ended

Example illustrating the FLEXIBILITY

Flexibility

Multiple types of high speed pinassignments are permissible.

See Application Specificationsor contact Tyco Electronics.

Some Examples: • 1.5 differential pairs per column • 2.0 differential pairs per column • Extremely high density in fully

single ended arrangement upto 55 signal lines/cm2

8 Contacts per Column – 12 Columns per Module

Flexibility

1-Z-PACK Slim UHD.qxd 13.09.2008 11:18 Uhr Seite 3

Page 4: 1-Z-PACK Slim UHD CONNECTIVITY/1982257-5.pdf · Z-PACK Slim UHD CS (Common Speed) 3.5 Gbps Z-PACK Slim UHD HS (High Speed) 12.5+ Gbps (2.0 DP/Column) 20+ Gbps (1.5 DP/Column) PIN

Upgradeability

Connector Footprint

Z-PACK Slim UHD Connector Platform Catalog 1654261-5 Issued 9-2008

www.tycoelectronics.com

All specifications subject to change. Consult Tyco Electronics for latest specifications. 4

Row

A

Row

B

Row

C

Row

D

Row

E

Row

F

Row

G

Row

H

Horizontal Routing

Vertical Routing

1.25

mm

1.45

mm

1.25

mm

1.45

mm

1.25

mm

1.45

mm

1.25

mm

Row Pitch

Col

umn

Pitc

h

1.45 mm

Drill Size: 0.5 mm

Finished Hole Size: 0.4 mm

Pad Size: 0.8 mm

Anti-Pad Size: 0.95 mm

� Identical board footprints on Backplane andDaughter-Card

� 1.45 mm routing channelsavailable in Horizontal and Vertical Direction

� Footprint allows 4-6-4 MILor 5-7-5 MIL differentialrouting

Remark:A combination of CS and HS chick-lets in one female connector housing is available upon customer request. Please contact Tyco Electronics.

System and connector evaluationboards are available upon request.

First Release

Signal Assignment

Second Release

1-Z-PACK Slim UHD.qxd 13.09.2008 11:18 Uhr Seite 4

Page 5: 1-Z-PACK Slim UHD CONNECTIVITY/1982257-5.pdf · Z-PACK Slim UHD CS (Common Speed) 3.5 Gbps Z-PACK Slim UHD HS (High Speed) 12.5+ Gbps (2.0 DP/Column) 20+ Gbps (1.5 DP/Column) PIN

Typical Electrical Properties

Z-PACK Slim UHD Connector Platform Catalog 1654261-5 Issued 9-2008

www.tycoelectronics.com

All specifications subject to change. Consult Tyco Electronics for latest specifications. 5

**) All simulation data include the footprint performance of a 1.1 mmthick PCB test-board.

**) All measurement data include the footprint performance of a 1.1 mmthick PCB test-board.

0 1 2 3 4 5-10

-9

-8

-7

-6

-5

-4

-3

-2

-1

0

Frequency [GHz]

Diff

eren

tial i

nser

tion

loss

[dB

]

Differential insertion loss (1.1 mm thick PCB included)

Pair AB

Pair CD

Pair EF

Pair GH0 0.1 0.2 0.3 0.4 0.5 0.6

70

80

90

100

110

120

130

Time [ns]

Impe

danc

e [O

hm]

Differential impedance profile (risetime: 75ps 20%-80%)

Pair AB

Pair CDPair EF

Pair GH

Via ondaughtercard sideVia on backplane

side

Connector

0 0.1 0.2 0.3 0.4 0.5 0.670

80

90

100

110

120

130

Time [ns]

Impe

danc

e [O

hm]

Differential impedance profile (risetime: 75ps 20%-80%)

Pair AB

Pair CDPair EF

Pair GH

Via ondaughtercard sideVia on backplane

side

Connector

2.0 DP/Column Common Speed* Worst Case Noise with recommended TX/RX pinout: 2.1% @ 75 ps (20% to 80%)

NoiseSummary

NoiseSummary

NoiseSummary

Total Asynchronous Noise @75 ps Risetime (20% to 80%)

Total Asynchronous Noise @50 ps Risetime (20% to 80%)

2.0 different pairs /column

Victim Pair Total Async. NEXT Total Async. FEXT

Pair AB 1.4 % 0.7 %

Pair CD 2.9 % 1.1 %

Pair EF 2.9 % 1.2 %

Pair GH 1.4 % 0.7 %

2.0 different pairs /column

Victim Pair Total Async. NEXT Total Async. FEXT

Pair AB 1.5 % 0.6 %

Pair CD 3.1 % 1.3 %

Pair EF 3.1 % 1.5 %

Pair GH 1.5 % 0.8 %

0 1 2 3 4 5 6 7 8 9 10-10

-9

-8

-7

-6

-5

-4

-3

-2

-1

0

Frequency [GHz]

Diff

eren

tial i

nser

tion

loss

[dB

]

Differential insertion loss (1.1 mm thick testboards included)

Pair AB

Pair CD

Pair EF

Pair GH47.9 48 48.1 48.2 48.3 48.4 48.5 48.6 48.7

70

80

90

100

110

120

130

Time [ns]

Impe

danc

e [O

hm]

Differential impedance profile (risetime: 50ps 20%-80%)

Pair AB

Pair CDPair EF

Pair GH

Via ondaughtercard sideVia on backplane

side

Connector

47.9 48 48.1 48.2 48.3 48.4 48.5 48.6 48.770

80

90

100

110

120

130

Time [ns]

Impe

danc

e [O

hm]

Differential impedance profile (risetime: 50ps 20%-80%)

Pair AB

Pair CDPair EF

Pair GH

Via ondaughtercard sideVia on backplane

side

Connector

2.0 DP/Column High Speed** Worst Case Noise with recommended TX/RX pinout: 1.9 % @ 50 ps (20% to 80%)

Total Asynchronous Noise @50 ps Risetime (20% to 80%)

2.0 different pairs /column

Victim Pair Total Async. NEXT Total Async. FEXT

Pair AB 1.0 % 0.6 %

Pair DE 0.4 % 0.6 %

Pair GH 1.2 % 0.8 %

0 1 2 3 4 5 6 7 8 9 10-10

-9

-8

-7

-6

-5

-4

-3

-2

-1

0

Frequency [GHz]

Diff

eren

tial i

nser

tion

loss

[dB

]

Differential insertion loss (1.1 mm thick testboards included)

Pair AB

Pair DE

Pair GH47.9 48 48.1 48.2 48.3 48.4 48.5 48.6 48.7

70

80

90

100

110

120

130

Time [ns]

Impe

danc

e [O

hm]

Differential impedance profile (risetime: 50ps 20%-80%)

Pair AB

Pair DEPair GH

Via ondaughtercard sideVia on backplane

side

Connector

47.9 48 48.1 48.2 48.3 48.4 48.5 48.670

80

90

100

110

120

130

Time [ns]

Impe

danc

e [O

hm]

Differential impedance profile (risetime: 50ps 20%-80%)

Pair AB

Pair DEPair GH

Via ondaughtercard sideVia on backplane

side

Connector

1.5 DP/Column High Speed** Worst Case Noise with recommended TX/RX pinout: 0.9 % @ 50 ps (20% to 80%)

1-Z-PACK Slim UHD.qxd 13.09.2008 11:18 Uhr Seite 5

Page 6: 1-Z-PACK Slim UHD CONNECTIVITY/1982257-5.pdf · Z-PACK Slim UHD CS (Common Speed) 3.5 Gbps Z-PACK Slim UHD HS (High Speed) 12.5+ Gbps (2.0 DP/Column) 20+ Gbps (1.5 DP/Column) PIN

Connectors

Z-PACK Slim UHD Connector Platform Catalog 1654261-5 Issued 9-2008

www.tycoelectronics.com

All specifications subject to change. Consult Tyco Electronics for latest specifications. 6

Female Connector High Speed Version

Male ConnectorUniform Male Connector for High/Common Speed

Footprint of male connector is identical to footprint of female connector.

Post/pre-mating pins at pre-defined positions can be obtained upon request.For further information, please contact Tyco Electronics.

Design Objectives/Product Specification

Reference Part Numbers

Female MaleApplication

Specification

High Speed 108-19353 / 108-19320 114-19106 1857657-1/-22042088-1/-2

Common Speed 108-19354 / 108-19352 114-19112 1982738-1/-2

Power (see page 7) 108-19367 114-19122 1982257-5/-2 1982260-5/-2

Common Speed Version

24.524.5

0.70.7

1.45

1.61.25 12.51 1.25 12.51

12.9514.3

6.5 1.6

2.8

3

12.95

14.3

17.3

17.3

12.51

1.45 (11x)

1.6

Recommended PCB Layout Component side shown

Position a1

Position a1

1.15± 0.1

4.7 max 4.7 max

∅ 0.4 Ref Finished Hole

1-Z-PACK Slim UHD.qxd 13.09.2008 11:18 Uhr Seite 6

Page 7: 1-Z-PACK Slim UHD CONNECTIVITY/1982257-5.pdf · Z-PACK Slim UHD CS (Common Speed) 3.5 Gbps Z-PACK Slim UHD HS (High Speed) 12.5+ Gbps (2.0 DP/Column) 20+ Gbps (1.5 DP/Column) PIN

Z-PACK Slim UHD Complementary Products

Z-PACK Slim UHD Connector Platform Catalog 1654261-5 Issued 9-2008

www.tycoelectronics.com

All specifications subject to change. Consult Tyco Electronics for latest specifications. 7

Male Guide Pin Part No. 1857988-1

Guiding Pins Female Guide Module Part No. 223957-3

Right-Angle Male (RAM)Connector

� Co-planar application basedon right-angle female andright-angle male.

� Performance up to 20+ Gbps (in combinationwith Female HS)

� Part No. 2042162-1

25.3

1.6

PC

BLe

vel

15.5

2.84.7

12.51

1.25

7.83

1.35

∅ 5.4

∅ 4.9

∅ 7.8

5.4

9.75.5

16.8 15.0 28.8

4.7 6.2 5.934.2

M3M4

4

Power Connector

� Envelope dimensions identical to Z-PACK SlimUHD modules

� High durability (250 cycles)

� 2 Sequencing levels

� Current carrying capacity>18 Amp/Contact

Male Connector: Part No. 1982260-5

Female Connector: Part No. 1982257-5

1-Z-PACK Slim UHD.qxd 13.09.2008 11:18 Uhr Seite 7

Page 8: 1-Z-PACK Slim UHD CONNECTIVITY/1982257-5.pdf · Z-PACK Slim UHD CS (Common Speed) 3.5 Gbps Z-PACK Slim UHD HS (High Speed) 12.5+ Gbps (2.0 DP/Column) 20+ Gbps (1.5 DP/Column) PIN

Tyco Electronics AMP GmbH AMPèrestr. 12–14

64625 Bensheim / Germany

Phone: +49-(0)6251-133-0

Fax: +49-(0)6251-133-1600

www.tycoelectronics.com

Z-PACK, TE Logo and Tyco Electronics

are trademarks

© 2008 Tyco Electronics Ltd.

1654261-5 Issued 9-2008 3M ST

1-Z-PACK Slim UHD.qxd 13.09.2008 11:18 Uhr Seite 8