2007-1017.light peak tech
TRANSCRIPT
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LIGHT PEAK
TECHNOLOGY
LIGHT PEAK
TECHNOLOGYINTELS HIGH-SPEED DEVICE
CONNECTIVITY
Presented By :
Apurba Kumar Mandal
Computer Science & Engg.
Roll no :- 2007 - 1017
University Institute of Technology
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� INTRODUCTION
� FEATURES
� TODAYS CHALLENGES
� LIGHT PEAK VS USB 3.0
� COMPONENT OVERVIEW
� OPTICAL MODULE
� CONTROLLER CHIP
� ADVANTAGES
� FUTURE SCOPE
CONTENTS
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� Light peak is the code name for the highspeed optical cable technology.
� It connects electronic devices to eachother.
� Delivers bandwidth of 10Gb/s with a potential to scale to 100Gb/s.
INTRODUCTIO
N
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�
Provide a standard low cost optical based interconnect- support for key existing protocols(USB, HDMI, DP,
PCIe , etc)
- scalable bandwidth, cost, power to support broad
base for 10+years
- support wide range of devices(handhelds, laptop, pc¶s)
� Common optical i/o architecture for the next decade and
more- single flexible cable that can carry any platform i/o
- economies of scale from a single optical solution
FEATURES
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Limitations of Electrical Cable
Technology :
� Reached its practical limit for speed & length� Gets distorted due to Electro-Magnetic
Interference(EMI)
�Cables are becoming costly
TODAY¶S
CHALLENGES
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� Needs different cable
for running different protocols simultaneously
� Too many different connectors and cables
�
Devices getting smaller, thinner and lighter
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� 4 Optical Fibre
Cable
� Speed-10 Gb/sec
� Universal
� Max Cable
Length-100m
� 9 Copper Wires
� Speed-3 Gb/sec
� Only Usb Protocol
� Max Cable
Length-9m
LIGHT PEAK VS USB
3.0
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� OPTICAL MODULE
� CONTROLLER CHIP
MAJOR
COMPONENTS
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� Two way chip
� Consists of photo detectors and miniaturelasers
� Does conversion from Light to Electricity
Vice-Versa
OPTICAL
MODULE
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� Manages multiple protocol
� It Identifies which protocol is to be transmitted
� API helps to determine the different protocols
� API places the FIS packets in memory.
� sends these Packets to destination over Opticallink
CONTROLLER
CHIP
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� 10 Gbit/s over optical cable (up to 100 metres
in length)
� Connect to multiple devices at the same time
� Multiple protocols
�
Bi-Directional transfer
� Quality of service implementation
� Works on existing I/O standards
ADVANTAGE
S
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� Fast external storage
-> SSD or HDD arrays transferring at
10Gbs and faster.
� PC-to-PC high-speed connection-> Transfer files, PC migration, etc.
� Simplified home connectivity
-> Connect multiple PCs and portableconsumer electronics (CE) devices.
� Sony & Nokia are working with Intel
FUTURE
SCOPE
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Thank You !!!