SEMICON China 2016

200mm Equipment Technology

Development

In An Era of More-than-Moore (MTM)

and The Internet-of-Things (IoT)

Dr Zheng Yuan

Vice President, 200mm Equipment Product Group

Applied Global Services

SEMICON China

March 16th, 2016

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SEMICON China 2016

Presentation Outline

Introduction To Applied Materials

200mm Market Outlook & Trends

More-Than-Moore (MTM) Technologies

200mm Product Portfolio & Manufacturing Capability

Enabling MTM Technologies on 200mm

Summary

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SEMICON China 2016

The Global Strength of Applied

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Stock Ticker: Nasdaq: AMAT

Fiscal 2015 Revenue: $9.7 billion

Fiscal 2015 RD&E: $1.5 billion

Founded: November 10, 1967

Headquarters: Santa Clara, California

Global Presence: 81 locations in

18 countries

Principal Locations United States, Israel,

Singapore, Taiwan

Employees*: ~14,600 worldwide

Patents: ~10,200 issued

Data as of fiscal year end, October 25, 2015

*Excluding temporary and interns

SEMICON China 2016

What Does Applied Materials Do

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Energy and

Environmental

Solutions

Display Silicon Systems Global Services

SEMICON China 2016

A Global Footprint

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Taiwan

Italy

Singapore

Israel

California

Texas

Montana

Massachusetts India

81 WORLDWIDE LOCATIONS, 18 COUNTRIES

Data as of fiscal year end, October 25, 2015

Germany

China

SEMICON China 2016

LOCATED IN SINGAPORE: Dedicated advanced packaging center since April 2012

14K SQFT CLASS 10 CLEANROOM:

11 Applied platforms & over 40 supporting tools

Asia Product Development Center (APDC)

LOCATED IN SANTA CLARA, CA: HQ dedicated to product development transistors,

interconnects, memory applications.

39K SQFT CLASS 1 cleanroom with 120 tools

Maydan Technology Center

Applied Materials Global R&D Infrastructure

Xi’an Technology Center

LOCATED IN Xi’an China:

Dedicated 200mm demo and development facility

SEMICON China 2016 7

1980 1984 1994 1997 2000 2003 2006 2009 2012 2015

Service Center

开设服务中心

China Office

设立办事处

China Sole Corporation

设立独资公司

China Headquarter

开设中国总部

Training Center

设立培训中心

China Holding Company

设立中国控股公司

Global Procurement Center

设立全球采购中心

Global R&D Center

设立全球研发中心

Applied Materials 30+ years in China

Applied 30th Anniversary

in China 30

周年

SEMICON China 2016

North/Central China

Guangzhou/Shenzhen Area

South China

Beijing & Xi’an Area

Beijing

Shanghai

Xi’an

Wuxi Wuhan

Dalian

Shenzhen

Suzhou

Shanghai Area

East China

Supply Chain Globalization

Expand supply chain base in China to take

advantage of cost effective operations

Partner with strategic contract

manufacturers in China to enhance operation

efficiency

Cultivate advanced manufacturing and process

technology at Chinese local suppliers

Xi’an global semiconductor

procurement center

SEMICON China 2016

Market Outlook & Key Trends

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200mm fab capacity is growing, globally!

China is showing the largest capacity increase of any other region world wide

MTM technologies continue to drive the growth with approx. >80% of China’s 200mm capacity

increase occurring in the foundry space

© SEMI, Global 200mm Fab Outlook, Oct 2015.

Capacity Change by Region

(2015 to 2018)

200mm Fab Capacity by Product Type

(China)

SEMICON China 2016

Evolution of More-Than-Moore (MTM) in the Marketplace

MTM technology segments : MEMS, Power, Analog, Image Sensors, LP-MCU and Packaging technologies;

MTM technologies support: Consumer, Automotive, Industrial, Medical, etc. device segments;

Today ≤200mm represent > 70% of all IC content in Automobiles, Mobile Devices and Wearables;

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SEMICON China 2016

MTM Technologies for Mobile Devices

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Improved Communications

RF Switch Timing Oscillator Antenna Tuning RF Filter

Amazing Sound

Microphones

Advanced

Speaker

Technologies

Navigation &

Environmental Sensing

Gyroscope /

Accelerometer

Magnetometer

Pressure & Humidity

Sensors

Battery Lifetime

Energy

Harvesting

Visual Performance

Micro -

bolometer

Pico-

Projector

Autofocus

Micro-

Display

Security

Fingerprint

Scanning

SEMICON China 2016

MTM Technologies for Automotive

Collision Warning

Adv. Driver Awareness Systems

(ADAS) Interior / Infotainment Systems Vehicle Safety Systems

Engine / Power Train Power Management Systems Chassis / Body Sensors

Heads Up Display

Digital Compass

Pre-Crash Sensing

Emergency Braking

Adaptive Cruise Control Blind-Spot Detection

Lane-Change Assistance

Parking Slot Measurement

Backing Aid Far IR Sensors

High-Beam Control

Cross-Traffic Assist

Object Detection

Side-Impact

Sensors

Front/Rear Impact

Sensors

Driver Monitoring

Auto Dimming Mirrors

Interior Cameras

Stability Control Systems

Noise Cancelling Microphones

Night Vision Cameras

Air Bag Sensors

Active Suspension Passenger Occupation

Rain Sensors

Steering Angle

HVAC Sensors Automatic Lights

Seat Belt Tension Fuel Vapor

Seat Position

Engine Speed Camshaft Position Oil / Fluid Levels

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Starter / Alternator Stop Start

Tire Pressure Monitoring

Cooling Fan Speed

Transmission Gear Position Pedal Position(s) Battery Management Sensor Solar Power Sensors

Mass Air Flow

Altitude Sensor

Manifold Pressure

360° External Cameras

Anti-lock Braking

System

Engine Temperature

Chassis Position Sensors Engine Vibration Sensors Vibration Sensors

Cylinder Temperature

Particulate Sensor

NOx Sensor

High V/I Sensor High-Voltage Battery Cut-Off Sensor

Crash Impact Microphones

Network ICs

Pedestrian Protection Sensor

SEMICON China 2016 13

What is the Internet-of-Things (IoT)

A basic ‘IoT Device’ is comprised of the

following elements:

Controller

(LP MCU +

Memory + Comms)

Power Supply

(E. Harvester, Battery or

Fixed Line)

Sensor

SEMICON China 2016

IoT Market Forecasts

Forecasts range from 30Bn to 50Bn internet connected devices by 2020

Device Market Value of ~$30Bn in 2020 growing to ~$38Bn in 2024, with a CAGR of ~19%

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© IHS

Cisco predicts 50Bn devices in 2020 IHS, predicts ~30Bn devices in 2020

© Cisco

SEMICON China 2016

200mm Equipment Portfolio

Implant E220/500

Kestrel

VIISion 80/200

Thermal Centura®

RTP

Epi

LPCVD

Gate

Inspection &

Metrology SEMVision

Compass

Complus

VeraSEM

NanoSEM

VeritySEM

PVD Endura®

Al (Slab/Fill)

Liner/Barrier

iLB

CuBS

ALPS Al / Co

CleanW™

SIP TTN

CVD Centura

Producer

DxZ Silane

DxZ TEOS

DxZ SACVD

Gigafill SACVD

Ultima HDP

WxZ and WEB

Etch Centura

MxP®

Super-E

Metal/Poly DPS

ASP+

eMAX

CMP Mirra®

Mirra Mesa

Oxide

Tungsten

STI / Poly

Copper

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Plating Raider®

Nokota®

Bump/Pillar/RDL

TSV

Interconnect ECD

Cleans

Supporting the MTM evolution with innovative 200mm platform technologies

SEMICON China 2016

Extending 200mm Equipment Life

Producer® Mirra®

/ Mirra Mesa®

ComPLUS™ Endura® Centura®

Faster processing 80X

Greater data rate 1000X

More data storage 100X

More computational bandwidth 100X

Available now for

all platforms

shown

Applied Vita

Controller for 200mm

Systems

TM

Full backward compatibility with existing

software versions and customer recipes

SEMICON China 2016

Main 200mm Manufacturing Facility in Austin

Dedicated team

► Average experience >12 years

New and used system manufacturing

► 92,000 sq ft. of manufacturing and warehouse space

► 17 test bays

► Capability to ramp up to >70 tools/quarter

Serving Applied Materials product lines

Comprehensive manufacturing capability

Continuously driving manufacturing efficiency

Field startup and on-site support expertise

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SEMICON China 2016

Enabling MTM Technologies on 200mm Smartphone / Tablet, Automotive and Wearables will drive 200mm device unit growth and new

technology requirement for the next 5+ years

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Automotive

(Body, Engine, Infotainment, ADAS)

Wearables

(Fitness, Garments) Smartphones & Tablets

End Use Application(s)

Segments with >70%

200mm Content

Key inflections in high growth application segments drive requirements for new

materials, packaging and CMOS integration

Adv. CMOS Compatible Films

(PECVD SiGe for MEMS) Ultra Uniform AlN Films

(MEMS RF Filters)

Adv. Epi Technologies

(Power Switching)

Adv. Etch Solutions

(Packaging, Power) Adv. Metal Deposition

(Power Technologies)

Endura Centura / Producer

CVD Centura Epi Centura DPS DTM Endura

SEMICON China 2016

Thick Epitaxial Silicon for MEMS and Power Devices

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Epi Chamber

Improved Hardware

Improved Productivity

Tighter Process Control

New Software Capability

Thickness Profile Resistivity Profile

Growth Rate Profile

Epi GR (um/min)

SEMICON China 2016

High Deposition Rate Aluminum for Thick Al Applications

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Single pass, per chamber up to 12µm thick films

High productivity >2.3µm/min deposition rate

Defect free films, no whiskers, no hillocks

Logic, Power, MEMS, Automotive and RF Power

Thick Aluminum layer processed at 350°C with

minimal depth grain boundaries at ≤105nm

SEMICON China 2016

Aluminum Nitride Films for RF Filter Devices Application in MEMS and Power Devices

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(8” Wafer Images Shown)

No

n-U

nif

orm

ity (

1σ

)

Th

ick

ne

ss

No

n-U

nifo

rmity

FW

HM

De

po

sitio

n R

ate

(nm

/min

)

Best in class thickness uniformities

High degree of crystallinity for (002) oriented films

Production proven Endura ™PVD platform

SEMICON China 2016

Deep Reactive Ion Etch (DRIE) DRIE for Power, MEMS and Packaging Technologies

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New Etch Processes for SiC

and GaN Applications

GaN Etch SiC Etch

DPS-DTM

(200mm)

DPS II – Silvia / Silvia-N

(200mm/300mm)

Transitioning MTM Technologies to

200mm/300mm Capable Tools

High Aspect Ratio

(>110:1)

Sub-Micron CD

(<< 200nm)

High Etch Rate

(>25µ/min)

SEMICON China 2016

Ultra Low Temperature / Thick / Conformal Dielectrics

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Producer™ Mainframe

(3-Twin Chamber Configuration)

For Application in MEMS, Power Devices and Packaging

Thick PECVD TEOS Oxide Conformal Nitride Low Temp PECVD SiGe

Centura™ Mainframe

(4-DxZ Chamber Configuration)

Amorphous Silicon (aSi) Low Temp Via Last Liner

High Deposition Rates

Best In Class Low Temp Capabilities

Thicker Films For MTM Applications

Industry Leading Platform

SEMICON China 2016

Ongoing Development of Key Materials on 200mm

Continued Investment In New Materials, Process and Hardware Capability

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Next Generation

RF/pDC PVD

SEMICON China 2016

Transition Technologies

The 200mm/300mm transition will occur in MTM on an opportunistic basis, likely under the

following considerations:

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Volume / ASP Pressure Available BW On Depreciated 300mm Line

More Sophisticated ASIC Opportunity For Disruption (ASP/ Technology)

WLCSP Required Technology Existing Or Easily Ported To 300mm

Examples from the MEMS segment may include:

Gyro – ASIC / WLCSP AlN Based Devices Disruptive Technologies

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