1. F ASTECHS YNERGYL TD Leading-edge Solutions for Niche Customers

2.

26 years in Semiconductor Manufacturing business with 900+ employees

Established in 1983 as Circuit Packaging Inc. Renamed as Fastech in 1989.

Acquired Tag Semiconductor Philippine operations in 1993

IPO and listing in the Singapore Stock Exchange in 1999.

Consolidated factory operations from 3 to 1 location in 2001

Expanded RF Microwave operations in 2004

Certified to TS16949:2002 and ISO9001:2000 in 2006

Established Precision Machining for RF/Microwave customer in January 2007

Expanded capacity by 25% on 3 major package in 2007

Introduced 5 new packages on Power packages in 2007

MACOM/Tyco test transfer of all Mixer products at Fastech.

Microsemi Scottsdale line transfer of all CBU products

CASCO automotive sensor products, production orders from Volvo, Audi and BMW Europe.

2007 Sales US$ 14.2M /2008 Sales US$11.6M /2009 US$ 5M

Quick Facts about FASTECH 3. A recognized leader in outsource manufacturing & test for RF/Microwave components,systems and modules, and hybrid assembly products.

Maintain a long-term relationship of trust andconfidence with our customer and supplier.

Achieve reasonable returns for our shareholders in awork environment where employees are respected,listened to, recognized, involved and motivated.

Company Introduction Vision Vision Mission Mission 4.

• Total Area (Building 1 & 2) : 145,300 square feet

• Addt'l. Available Area (Building 3): 155,700 square feet

• Total Land Area: 300,000 square feet

Bldg 3 - Corporate Office Bldg 2 RF and Microwave ModulesDivision ManufacturingComplex Ampere St. cor. West Road, Light Industry & Science Park I,Cabuyao, Laguna, Phils. Bldg 1 Semiconductor Division 5. Management Team OFFICE OF THE CHIEF EXECUTIVE SATURNINO G. BELEN JR CEO / PRESIDENT BUSINESS UNIT BUSINESS SUPPORT [ SALES & MARKETING & CUSTOMER SERVICE] [ SEMICONDUCTORS ] [RF & MICROWAVE ] OFFICE OF THE PRESIDENT PRIMO MATEO CFO - COO BONG SADURALVice President21 years ERWIN O. MANIBOG Executive Director 25 years ARLENE S. SAUDI Vice- President 15 years [ HRMD ] WALTER AGCAMBERT Vice President22 years CORPORATE QA/REL RENE I. DELA CRUZ Executive Director 20 years ODESSA T./ SALLY L./ RIZA R. QA Supervisors [ SEMICON and RF MICROWAVE ] 6. Fastech Human Resources (Semiconductor / RF Microwave) As of June 2010 561+ hi ghly-skilled and English-speaking employees 8 Senior Management 9Managers 9Technical Supervisors31Engineers 44 Technicians19Administrative Staff 63Non-Technical Staff 378Operators/ Assemblers 7. Human Resources Focus

Engineering Scholarship

In-House Masters Program on Engineering courses

Continuing Education Program

Advanced Technical Training

Team Building Seminars

Technical Ladder for Technicians and Engineers

Cadetship Engineers Program

8. Operating Pillars

TQM SEVEN ADVOCACY GROUPS

Customer Focus

TPM

ESD

IT

Employee Empowerment

Environmental/Health/Safety

5S

PRODUCTIVITY

Direct Labor & staff productivity thru IPR(DL800+; IDL150+)

Integrated with Monthly Performance Appraisal(Individual/Team)

Results tied up to Incentive Programs

TECHNICAL COMPETENCY:

Establish Technical position ladder

Technical Staff membership (10)

Semi annual Key Technical Employee (KTE) summit/awards (40+papers)

9. Management Information System

• Integrated Finance, Distribution and Manufacturing Systems

• 30+ segregated access terminals

Enterprise Resource Program (JD Edwards) 12 Support Information Systems in:

• HRIS, Training, Quality, Maintenance and Test Engineering

System Infrastracture:

• Secured access by 300+ users in 250 terminals in the Factory

• T1 connection with back-up (Dial-up)

• Redundant Hardwire system on 15 servers

10. Management Information System 11. Quality Milestones Major Customer Commendations Valpey Fisher Corporation Best Supplier2008 Advanced Control Components Best Supplier 2008 RFS/AlcatelBest Supplier2007 Semtech CorporationBest Quality 2008 Macom/Tyco Best Supplier 2007 Maxim/Dallas (power modules) Best Supplier 2007 Tyco / MACOM Best Supplier AwardMACOM Microwave Group 2001/ 2003 Golden Shell AwardDept of Trade & Industry, Phils1995/ 2000 12. Quality Milestones Certification/Award Certifying Body TS14969:2000 TUV Nord 2007 ISO 9001:2000 TUV NORD 2007 ISO/ TS16949TUV NORD 2006RoHs Compliant 2005IPC-A-610IPC / EPTAC 2005IPC-J-STD IPC / EPTAC 2005IBM AuditDALLAS/MAXIM 2005 Quality Systems Approval HERLEY-CTI 2006 Quality Systems Approval VALPEY FISHER 2006 Quality Systems Approval ALCATEL FERROCOM 2006 Quality Systems Approval TEMEX FRANCE 2004 Quality Systems Approval CHELTON UK 2004 QS9000 TUV 2003 Quality System Review (Level 2) MACOM /Tyco 2000 IBM Audit(RF / Microwave) modules 1999 Quality System Approval DALLAS/MAXIM 1998 13. Quality Milestones Certification/ Award 2010 Fujitsu Quality Laboratory Ltd AuditMarch 2010 Broadband Amplifiers products 2009 Nokia Siemens Audit (Broadband Wireless Group) February 2009 Sony Japan (Power IC Group)March 2009 NEC Audit(Microwave Group) June 2009 Emerson Audit(Semicon/IC Group) October 2009 2008 Miyoshi Electric/ Sony Japan Quality Systems Audit December 2008 Advanced Control Components - Quality Systems ApprovalOctober 2008Semtech/Huawei China Quality Audit August 2008 Microsemi Quality AuditJuly 2008 Emerson Power/ Astec Quality AuditJuly 2008 Semtech / Canon Japan Quality Audit May 2008 2007 RFS/ Alcatel Ferrocom / Motorola Quality AuditNovember 2007 M/A COM Tyco/ NTT Japan Quality AuditOctober 2007 Semtech / Sharp Japan Quality Audit October 2007 Amplifier Solution Corp - Quality System ApprovalApril 2007 14. Customer MilestonesSemiconductor Group 9697989900010203040506070809 MICROSEMISEMTECH / FAGORSMARTEC/ VITESSE / TIMEXCATALYST AME / HONEYWELL ATMEL / API / EMM Semiconductor Components TYCO ELECTRONICS RICHTEK ST MICROELECTRONICS ( Grenoble) MICROELECTRONICS ( Catania & Tours)BOURNS U.K. SEMELAB UK / CASCO CENTRAL SEMI / SUPERTEX CLARE / IXYS LITTELFUSE/ TECCOR AOS/ QSPEED / AMSFUJIMOTO INC / FUJI ELECTRIC INC VISHAY IES AUSTRALIA MICOSEMI APT MICROSEMI SCOTSDALE SEMEFAB SCOTLAND E2V HENDON TRANSFORM 15. Customer Milestones RF / Microwaves Group 9697989900010203040506070809 RF / Microwave Components & Module Assembly MAXIM/ DALLAS M/A COM / TYCO (MA/ SJ) CHELTON U.K. TELEDYNE/ COUGAR HERLEY CTI RLC ELECTRONICSMICRONETICSALCATEL FERROCOM/ LUCENT VALPEY/ FISHER ADVANCED CONTROL COMPONENTS TEMEX CERAMICS TEMEX MICROSONICS HETRONIC MALTA FIRST SUMIDEN CIRCUITSRALTON ELECTRONICS CENTELLAX AMPLIFIER SOLUTIONS TRAK MICORWAVE TRIQUINT/ WJ RFS / ALCATEL SILICON CRYSTAL 16. PowerDiscretes SOTMicro PackagesCopper Strap Packages Metal CanOPTOELECTRONICS / POWER Hybrid Power Packages Opto Sensor ClearPackagesSemicondutor CORE COMPETENCE Core CompetenceSemiconductor 17. RF Isolators / Circulators RF Filters RF VCO/ OCXO/Oscillators RF/ Microwave CORE COMPETENCE RF Mixers / Dividers VTDRO/PDROVSS LNA Amplifiers Attenuators Power Limiters Core Competence RF/ Microwave 18. SEMICON MANUFACTURING EXPERTISE

Power Discrete

1.TO-220 3L/5L Au/Al

2.TO-263 3L/5L Au/Al

3.TO-252 3L/5L Au/Al

4.TO-251 3L/5L Au/Al

5.TO-247 3L Al

6.TO-264 coming 2011 Al

7.TO-268 coming 2011 Al

8.TO-3P coming 2012 Al

9.SOT-223 Au

10.SOT-89 Au

11. SOT-23 3/5/6L Au

12.SO-8

13.SO-14/16

14.SMA/ SMB/ SMC

15.Axial

II. Opto Sensors/ITS 1.SO-8 Clear Package 2.SO-16 Black Transmissive 3.Custom Automotive Package 4.Metal Cans TO-18/TO-72/TO-39 III. Thermally Enhanced Package 1.TO-220 Dual Die w/ DBC 2.TO-247 Dual Die w/ DBC 3.SO-8 EHS Clip coming 2011 4.DPAK Clip coming 2011 19. POWER Packages TO92 2L/3L 3L TO252 (DPAK) 5L TO252 (DPAK) 3L TO252 (IPAK) 3L TO263 (DDPAK) 5L TO263 (DDPAK) 3L TO220 Standard 5L TO220 Standard 3L TO220 B/C NIA/ISOA TO202 V1 TO202 V3 TO3 MICRO Packages SOT23 3L SOT23 5L SOT89 SOT223 Annual Capacity of600 Million units TSOT25 5L SOT23 6L 20. NEW PACKAGE CAPABILITIES TO-247 Standard / Max PLAD(Plastic Large Area Device) AXIAL SMB SMC 21. Integrated Circuits & Optoelectronics 5L SIP 8L SIP 8L SOIC 16L SOIC CUSTOM CLEAR & DIP PACKAGES 22. Wafer Plus Services WAFER SAW WAFER PROBE WAFER BACKGRIND WAFER PLATE WAFER SORT 23. Handler and Prober Package Model Configuration / Capability PACKAGING DPAK MCT3608 Ambient or Dual Temp; Single site Bulk, tube IPAK MCT3608 Ambient or Dual -Temp; Single siteBulk, tube T0263 3Ld/5LdMCT3608 Ambient ; Single siteBulk, tube T0220Tesec 8512PHAmbient ; 4 test site Bulk, tubeTesec 8307MKAmbient ; Dual function (Test/Mark)Bulk, tube T0202Tesec 8017PHAmbient ; Single test Bulk, tube

Gravity:

Package Model Configuration / CapabilityPACKAGING T092TSM THD111Ambient ; Single testBulk Tesec 906Ambient ; Single testBulkTesec 786Ambient ; Single testBulk SOT89Shinja JT100Ambient ; Single testBulk SOT23 3Ld Tesec 9718HT Ambient ; In-line (Test/Mark/Reel)Bulk, TNR Ismeca NT216Ambient ; In-line (Test/Mark/Reel)Bulk, TNR SOT23 5Ld/6LdTesec 9718HTAmbient ; In-line (Test/Mark/Reel)Bulk, TNRIsmeca NT216Ambient ; In-line (Test/Mark/Reel)Bulk, TNR SOT223Tesec 9718HTAmbient ; In-line (Test/Mark/Reel) Bulk, tube, TNR

Bowl Feed:

24.

Wafer Probing

Assembly / Packaging

Custom Package Development

Final Test

Product Engineering

New Product Development

Failure Analysis

Product Reliability

Component/ Logistics Outsourcing

Drop Shipment/ Warehousing

Packaging & Test Turnkey Services 25. TEST/ADDED VALUE SERVICES

• • Test Program Generation and Hardware Development

• • Test Program Debugging and Optimization

• • Test Program Platform Conversion

• • New Device Correlation and Qualification

• • In depth Product Engineering

• • 24-Hour Failure Analysis

• • Test Yield Improvements

• • FT Data Logs and Statistical Analysis

• • Correlation to Wafer Probe and Fab Yields

• • Primary Test Platforms TMT, LTX and TESEC

• • Delta Vf, UIL/UIS and Trr tests for MOSFET devices

26. Test Equipment 27. Package Model Configuration / Capability PACKAGINGT0202 Tesec 9512PH Ambient ; In-line (Test/Mark/Test) Bulk, tube TO220 Tesec 9512PH Ambient ; In-line (Test/Mark/Test) Bulk, tube Three Test site TO247Tesec 9512PHAmbient ; In line (Test/Mark/Test)Bulk, tube

Pick & Place:

Package Model Configuration / Capability 4-6 inch EG2001X Ambient ; Single test

Prober:

Package Model Configuration / Capability PACKAGING DPAK STI TRI8AS3 Mark & lead vision inspection, taping TNR SOT89 Shinja ST400 Taping TNR TO263 3Ld/5Ld STI TRI8AS3 Mark & Lead vision inspection, taping TNR Shinja ST300 Mark & Lead vision inspection, taping TNR TO92 Sillner Taping Ammopack (Reverse/standard) TNR

Tape & Reel:

28. PACKAGE RELIABILIY CAPABILITY Test Integrity for Die and Wire Bond

Intermittent Operating Life (IOL)

Solder Heat Test (Die Crack Test)

High Temp. Storage Life (HTSL)

Resistance to Soldering Heat (RSH)

Temp. Cycle Test (TCT)

IR Reflow

Pressure Cooker Test (PCT)

Pre conditioning

• Humidity Chamber (Q2 2004 Avail.)

Wire Bond Die Bond

Lead Integrity Test

• Lead Fatigue Test

29. Package Analysis Capability 30. VCXO, Clock New Products VCXO Low Noise Amplifier Radio Remote ControlTransmitter for Overhead Crane Tunnel Module Detector SP3T RF Switch SP2T RF Switch 31. ON-GOING QUALS Circulator - 6GHz Broadband Amplifier Module BroadbandDigital Synthesizer Down ConverterJitter Attenuator Crystal Oscillator 32.

To enable our customers/strategic partners to achieve a sustainable advantage in terms of:

• Quality

• Cost of Ownership

• Delivery (time to market/time to volume)

• Process technology/engineering

• Assurance of supply (capacity planning)

• Environmental Compliance

• Security

Commitment to Customers 33. Line Transfer Success Story

1.2008 CENTELLAX INC

-Broadband Amplifier

2008 TRIQUINT / WJ

- High Linear Amplifier

3. 2008 RFS / ALCATEL

-Isolators

4.2007 MICROSEMI CORPORATION

-Plad / SMB/SMC / Axial / Dicing

5.2007 AMPLIFIER SOLUTION CORPORATION

-LNA Amplifiers

6. 2006 HERLEY CTI

- VSS Oscillator Modules, VTDRO

7. 2006 ADVANCED CONTROL COMPONENTS

-Down Converter, RF Driver Amplifier

34. 8. 2005 CASCO / ITALY -Optoelectronics / Sun sensors 9. 2005 VALPEY FISHER -RF Oscillator Modules 10. 2005 ALCATEL / LUCENT FERROCOM -Isolators / Circulators 11. 2004 TEMEX / CHELTON -VCO-Oscillators / Isolators / Circulators 12. 1999 DALLAS / MAXIM (second source 2007) -PCB Modules 13. 1997 ST MICOELECTRONICS -TO-220 B/C / TO220 Al / TO202 /TOP3P (ended 2005) 14. 1995 MACOM / TYCO -RF Components 35. Thank you & Mabuhay If we dont have it, lets talk.