©2012 tt electronics plc 0 power & hybrid business unit, microelectronics
TRANSCRIPT
©2012 TT electronics plc 1
Power & Hybrid Business Unit, Microelectronics
©2012 TT electronics plc 2
Who Are we?
Manufacturers of ultra reliable, high performance discrete semiconductors, power modules & hybrid microelectronic solutions designed to operate in any environment.
©2012 TT electronics plc 3
Our aimThrough our flexibility and innovation, we aim to be recognised as trusted technology leaders in the aerospace, space, defence, medical and industrial markets.
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What we do
We research, design and manufacture an innovative range of MOSFETS, Bipolar Transistors, IGBTS, Power Modules, Diodes, Voltage Regulators and Customised Hybrid Microcircuits.
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Aerospace Market Segments Actuation RADAR Engine control Flight subsystems
. Space Market segments Commercial Satellite - Telecoms, Broadcast,
GPS, Weather Exploratory Missions Nano and Cube Satellites
Industrial Market segments RF Energy (oil/gas, renewable) Audio Power conversion & management
• Military Market segments Transportation Communications Homeland Defence Aircraft UAVs
• Motorsport Market segments Formula 1 KERS Touring Car KERS
• Medical Market segments Analytical equipment Oncology equipment De Fib
Customers and markets we serve
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Product/ Technology
Features Applications Benefits
Discrete Semiconductors • Wide Range of modern & traditional packages
• Screening to International standards
• Down-hole drilling• Satellites• Defence programs
• Choice of silicon to match application
• 35 year pedigree of supply
RF (VDMOS) MOSFETs • High Gain• Excellent linearity
• Jammers• Radios• Broadcast
• Never made a part obsolete
• Higher performance• Very rugged and reliable
Power Modules • IGBT’s, MOSFET’s, Diodes
• High-Rel screening• Hermetic or Plastic Hi-Rel
• Aircraft Actuation• Power Factor Correction• Hybrid Motor Drive
• Extended reliability• Long term supply• Harsh environment
capability
Hybrid Microcircuits • Superior resistor characteristics
• MIL-PRF-38534, Class H certified & MIL-STD-883 screening options
• Fully customized circuits• High temperature
operation
• Aero-engine cooling systems
• Renewable energy – Solar CPV
• Driveline modules• Exhaust after treatment
• Reduced size • Improved circuit
performance• Enhanced thermal
properties• Improved reliability
Our Portfolio
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Power Modules Space
High Temp Solar
•Power conversion: Inverters for wind & solar•Motor drive: HEV (on and off road), traction•Actuation: Hydraulic replacement, steering
Discrete product for Satellite subsystems:•Nano and Cube satellites•GPS and Communications constellations•Weather/Scientific monitoring in Space
• Motor drive actuation• Control systems• Inverters• Power factor correction
• Concentrated Solar energy collection systems - using photo-voltaic cells
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Automotive KERS ModuleCustomer Requirement • Power module solution for racing car Kinetic Energy Recovery System (KERS)
Solution• Custom Power Module
• Custom configuration for application • Enhanced electrical, temperature and mechanical operation
Value Proposition• High temperature capability through using latest available technologies• Customised solution utilising the latest aerospace technologies to deliver high reliability
in a very harsh environment• Reduced weight through utilising latest materials to deliver a solution that is light yet extremely rugged
Core Competence• Flexibility – Closely working with the customer to realise their stringent technical & environmental requirements• Innovation – Utilising cutting edge mechanical and silicon/SiC technologies to achieve the spec• Pedigree - 35 years proven understanding of harsh environment requirements for high temperature and high
reliability applications
Status• Successfully designed, built and winning races• Currently working with teams on the 2013 season• Proven experience and success at the highest performance level• Now looking to move into more race types
Reason for success?• Technical Innovation, experience in ultimate reliability and close engineering to engineering relationship with
customer to understand their application and deliver a winning solution
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Why Use Microelectronics
Power & Control
High Power
High Frequency
Braking Resistors/Heaters
High Density & Reliability
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Thick Film Circuit
Thick Film Ink Systems
Printing – Firing – Lasering
Gold, Silver, High and low Temperature Copper.
Resistor Printing directly in circuit.
Aspect ratio to 0.1mm track and gap width, +/- 0.03mm registration.
Automatic printing machines cassette to cassette process.
Automatic Laser trimming and continuity testing.
Clean-room facility operating on 3 shifts.
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Technologies
Substrates
Thick film on 96% alumina or aluminium nitride
Directly bonded copper (DBC)
Active metal braise on aluminium nitride & silicon nitride
High/Low temperature co-fired ceramic (HTCC/LTCC)
Steel
Aluminium
Thin film
FR4
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Technologies Component Attach– Solder Surface Mount– Polymer Component and die attach– Vacuum soldering (Power Die Attach) up to
400oC
Wire Bonding– Fine wire Au 17um to 33um– Fine wire Al 25um to 33um– Large diameter Al >125um
Packaging– Hermetic sealing– Projection weld & Seam Seal– Ceramic lidding– Glob-top / Silicon conformal coat
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Microelectronics Assembly
Clean-room assembly operations.
Automated die bonding and wire bonding by pattern recognition.
Re-flow soldering and real time x-ray for void detection.
Aluminium fine wire bonding for high density signal and control circuits.
Large diameter Aluminium wire bonding for power circuits.
Hermetic sealing in inert atmosphere.
Leak detection.
Automatic test facilities.
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Test, Burn-In and Screening FacilitiesTest Two General Purpose ATEs in Chip &
Wire Clean Room. One reduced capability, DC only,
ATE. One General Purpose ATE for one
high volume product. Two ATEs for surface mount hybrids. One tray pack system – measure,
accept/reject, pack. One PIC program/test XYZ system.
Screening: Temperature cycling Constant acceleration Burn-in Fine & Gross Leak Test Pin D Bump Limited range vibration
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MCM Engine ManagementCharacteristics:
High Temperature Co-fired Ceramic (HTCC) Chip and Wire (>1000 bonds) High Density – Reduced size and Weight Hermetically sealed Engine mounted Qualified –55oC to +150oC Extended high temperature approval testing –
55oC to +205 oC. Completed 1000 hours +205oC Completed 100 cycles –55oC to 205 oC
Function: Engine management (FADEC)
Custom ASIC - CPU, SRAM, EPROM, Oscillator
Hi Reliability >20yrs life
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MCM (Linear) Engine Management – Civil Aviation
Function
3 Precision instrumentation amplifiers High common mode rejection Precision gain 3 Precision voltage references General purpose comparator
Characteristics High operating temperature -55oC to +150oC Engine mounted Thin Film provides high accuracy and stability. Active Trimming to <0.01% tolerance. High precision and accuracy achieved with low
cost Commercial Off The Shelf Components. Easily redesigned if amplifiers or reference
become obsolete
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DC/DC Converter – Civil Aviation
Function:
3 Fixed DC Outputs from 14 to 36VDC 28 Watts Flight computer System Self Monitoring Self Diagnostics
Characteristics:
Mixed power and control circuits. High reliability >20 years life proven through
extreme temperature cycling (>3,000 cycles) and HALT testing.
Operating temperature -40oC to +95oC High packing density. Relatively low cost.
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Safety Critical Fuse
Function: 10 amps continuous current carrying capacity
Fuse activation by external control
Fusing time <5 second @ -40oC to +110oC
Current applications: Wing ice protections system, heater circuit
protection (787 Dreamliner)
Engine de-icing (Joint Strike Fighter) heater protection
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Power MCM – Civil Aviation
Function: Part of Wing Ice Protection System
Switching controls power to wing tip or engine heaters (up to 5 amps continuous without heatsinking).
Used in conjunction with thick film solder fuse protection device
Characteristics: Each module contains 8 MOSFETs with low Rdson
(<138m Ohm)
High packing density and low assembly cost (35mm x 20mm)
Good thermal management
High reliability
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Sonar Transducer Power Driver – Naval Systems
Function: H Bridge MOSFET Switch to control power to
sonar antenna
Intelligent switch with ASIC control and MOSFET drivers.
Characteristics: Each module contains 4 MOSFETs with low Rdson,
drivers and control ASIC
Uses mixed technologies
Good thermal management
High reliability
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Flight Controls
Steel Dynamic Braking Resistors
For Aileron, Elevator and Rudder Actuation
Increased power dissipation by the use of bottom and top heat sinking
Low profile, Low Weight
Design-ins on:– Airbus A400M – A330 MRTT– Boeing 787 EBACS
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Power Resistor – Motor Speed Control
Design for high temperature environment Design for high reliability Low Profile, fits in motor housing 0.7 Ohm Resistance Curved shape to fit in housing
Test Requirement
Duty Cycle Number
Power On Off Cycles
300W 3 10 100
100W 10 10 50,000
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AIN Heater – Toner Fusing
Function: Instantaneous heating with individual control of 3 discrete segments
210°C in 2 seconds (1kW)
Precision Temperature Control
Characteristics: Large size printing
AlN Hi thermal Conductivity Resistance to thermal shock
Developed Inks with Fraunhofer Institute
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Hi Frequency Telecoms
Function:Frequencies up to 38GHz
Hi Reliability
Direct feed to antenna
Small Package size
Characteristics: Low loss at high frequency
Gold based ink
0.38mm thick substrate down to 0.1% tolerance
Good thermal management
Precise track definition
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Automotive – Mass Air Flow Sensor
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Industrial – Ink Jet Print Head
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Military and Avionics
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Industrial – Power Module