2015-05-05 webinar - ect best practice engl - downloadversion · c18, c19, c20 4.7uf 3 samsung...

www.we-online.com/embedding

WebinarECT Best Practice:How to handle a PCB project with embedded components?

How to handle a PCB projectwith embedded components?

Basic Motivation

Brief overview of technologies toembed discrete components

Possible components

Conceptual phase and layer constructions

Design & layout

Summary

Embedded Component Technology – ECTECT Best Practice

Jürgen Wolf

Würth Elektronik GmbH & Co. KGProduct Manager

Embedded Component Technology

05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1


Basic Motivation


Possible components


Design & layout

Summary



Embedded Component Technology – ECTAdvantages of „buried“ components?


Miniaturization

Performance/Function

Reliability

• Integrated shielding• Short signal paths• Protection against plagiarism

• Protected against influences• Secure fixing• Thermal management

• Package replacement• Space savings of assembly

area on the outer layers


Basic Motivation


Possible components


Design & layout

Summary



Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices

ECT–µVia ManufacturingECT–µVia Manufacturing

Assembly(Gluing/Sintering/

Soldering)

Multilayerpressing

Drilling ofvias and microvias



Non-plated microviaon embeddedcapacitor withCu termination


length: 58,97 µm

length: 21,96 µm


ECT–µVia ManufacturingECT–µVia Manufacturing

Assembly(Gluing/Sintering/

Soldering)

Multilayerpressing

Drilling ofvias and microvias

Plating andstructuring



Plated Microviaon embeddedcapacitor withCu termination


Embedded Component Technology – ECTECT–Flip Chip: Embedded active devices

ECT-Flip Chip ProductionECT-Flip Chip Production

Core with footprintfor Flip Chip

Assembly(Flip Chip – ACA)

Multilayerpressing

Remaining PCBprocesses



Basic Motivation


Possible components


Design & layout

Summary



Embedded Component Technology – ECTAvailability of components

Passive Components with Cu-Termination

mounting form0402

Thicknesses from150 µm to 300 µm

CapacitorsResistors

Bare Die Silicon ICs with process compatible pads

Generallya customerprovision

ECT–Flip Chip Pads

• Wirebond Au Stud-Bumps

• Wafer-level Au-Bumps

ECT–µVia Pads

• Cu

• NiPd

150 µm150 µm



Basic Motivation


Possible components


Design & layout

Summary



Embedded Component Technology – ECTCollaboration in the development

Very close collaborationis needed at a very early stage

in the concept and design phaseto be successful


product idea

concept

design

draft

development

prototypes

optimisation

Serial production

Products usingECT

BOM – Analysis of an existing predecessor-layout (if available)

Embedded Component Technology – ECTAnalysis of existing boards with regard to usability of embedded components

Designator Value Quantity Manufacturer Manufacturer Part Number Supplier 1 Supplier Device Package Supplier Part Number 1 Supplier Unit Price 1 Comment Footprint

nHIB, RST 2 C&K Components KMR231G ULC LFS Digi-Key CKN10245CT-ND 0.71 Value Taster_Miniatur

ANT 1 Cinch Connectivity Solutions Johnson 128-0711-201 Digi-Key J983CT-ND 0.99 U.FL-R-SMT U.FL-R-SMT

PROG 1 SAMTEC FTS-104-03-F-DV-TR Farnell 1928283 Stecker_8Pin SAMTEC_FTS_104

R1, R2, R3, R4, R6, R8, R9, R10, R11, R13, R14 100k 11 Yageo RC'0402JR-07100KL Digi-Key '0402 311-100KJRCT-ND 0.10 Res3 '0402

R12, R15, R16, R18, R19 N.C. 5 Res3 '0402

R17, R20 100 2 Panasonic Electronic Components ERJ-2GEJ101X Digi-Key '0402 P100JCT-ND 0.10 Res3 '0402

R5, R7 10k 2 Yageo RC'0402JR-0710KL Digi-Key '0402 311-10KJRCT-ND 0.10 Res3 '0402

T1, T2 N.C. 2 N.C. Testpin_0.8

U2 1 Micron Technology Inc M25PX80-VMN6TP Digi-Key 8-SO M25PX80-VMN6TPCT-ND 0.90 M25PX80-VMN6TP MICT-MN-8_N

L1, L3 2.2uH 2 Murata Electronics North America LQM2HPN2R2MG0L Digi-Key 1008 (2520 Metric) 490-5114-1-ND 0.36 LQM2HPN2R2MG0L 1008_inductor

L2 1uH 1 Murata Electronics North America LQM2HPN1R0MJ0L Digi-Key 1008 (2520 Metric) 490-6699-1-ND 0.42 LQM2HPN1R0MJ0L 1008_inductor

AUX N.C. 1 Header 2 PIN2 _1.27

J1, J2, J3 3 Hirose Electric Co Ltd DF40C-20DP-0.4V(51) Digi-Key H11618CT-ND 0.83 DF40C-20DP-0.4V DF40C-20DP-0.4V

FL1 1 TDK Corporation DEA202450BT-1294C1-H Digi-Key 445-172335-1-ND 0.54 DEA202450BT-1294C1-H DEA202450BT-1294C1-H

U1 1 TEXAS INSTRUMENTS CC3100R11MRGC Farnell 2445381 Dez 21 CC3100 PVQFN-64

C1, C6, C7, C9, C10, C15, C16, C21, C22, C23, C27 100nF 11 Taiyo Yuden LMK105BJ104KV-F Digi-Key 587-1227-1-ND 0.034 Cap Semi '0402

C12 1uF 1 Murata Electronics North America GRM155R61A105ME15D Digi-Key 490-5409-1-ND Cap Semi '0402

C13, C14 22uF 2 Taiyo Yuden AMK107BBJ226MAHT Digi-Key 587-3262-1-ND 0.66 Cap Semi J1-0603

C18, C19, C20 4.7uF 3 Samsung Electro-Mechanics America, Inc CL05A475MQ5NRNC Digi-Key 1276-1056-1-ND 0.22 Cap Semi '0402

C2, C3 6.2pF 2 Murata Electronics North America GRM1555C1H6R2BA01D Digi-Key 490-8224-1-ND 0.10 Cap Semi '0402

C24, C25 100uF 2 TDK Corporation C3216X5R0J107M160AB Digi-Key 445-6008-1-ND Jan 32 Cap Semi C1206

C4, C5, C26 10pF 3 AVX Corporation '04025U100CAT2A Digi-Key 478-5991-1-ND 0.14 Cap Semi '0402

C8, C11, C17 10uF 3 Murata Electronics North America GRM188R60J106ME47D Digi-Key 490-3896-2-ND Cap Semi J1-0603

XT2 1 Abracon Corporation ABS07-32.768KHZ-T Digi-Key 535-9542-1-ND Jan 24 ABS07-32.768KHZ-T ABS07

XT1 1 AVX Corp/Kyocera Corp CX3225GB40000D0HEQCC Digi-Key 1253-1222-1-ND 0.75 40MHz CMAC-XTAL_2.5x3.2

Designator Value Quantity Manufacturer Manufacturer Part Number Supplier 1 Supplier Device Package Supplier Part Number 1 Supplier Unit Price 1 Comment Footprint

nHIB, RST 2 C&K Components KMR231G ULC LFS Digi-Key CKN10245CT-ND 0.71 Value Taster_Miniatur

ANT 1 Cinch Connectivity Solutions Johnson 128-0711-201 Digi-Key J983CT-ND 0.99 U.FL-R-SMT U.FL-R-SMT

PROG 1 SAMTEC FTS-104-03-F-DV-TR Farnell 1928283 Stecker_8Pin SAMTEC_FTS_104

R1, R2, R3, R4, R6, R8, R9, R10, R11, R13, R14 100k 11 Yageo RC'0402JR-07100KL Digi-Key '0402 311-100KJRCT-ND 0.10 Res3 '0402

R12, R15, R16, R18, R19 N.C. 5 Res3 '0402

R17, R20 100 2 Panasonic Electronic Components ERJ-2GEJ101X Digi-Key '0402 P100JCT-ND 0.10 Res3 '0402

R5, R7 10k 2 Yageo RC'0402JR-0710KL Digi-Key '0402 311-10KJRCT-ND 0.10 Res3 '0402

T1, T2 N.C. 2 N.C. Testpin_0.8

U2 1 Micron Technology Inc M25PX80-VMN6TP Digi-Key 8-SO M25PX80-VMN6TPCT-ND 0.90 M25PX80-VMN6TP MICT-MN-8_N

L1, L3 2.2uH 2 Murata Electronics North America LQM2HPN2R2MG0L Digi-Key 1008 (2520 Metric) 490-5114-1-ND 0.36 LQM2HPN2R2MG0L 1008_inductor

L2 1uH 1 Murata Electronics North America LQM2HPN1R0MJ0L Digi-Key 1008 (2520 Metric) 490-6699-1-ND 0.42 LQM2HPN1R0MJ0L 1008_inductor

AUX N.C. 1 Header 2 PIN2 _1.27

J1, J2, J3 3 Hirose Electric Co Ltd DF40C-20DP-0.4V(51) Digi-Key H11618CT-ND 0.83 DF40C-20DP-0.4V DF40C-20DP-0.4V

FL1 1 TDK Corporation DEA202450BT-1294C1-H Digi-Key 445-172335-1-ND 0.54 DEA202450BT-1294C1-H DEA202450BT-1294C1-H

U1 1 TEXAS INSTRUMENTS CC3100R11MRGC Farnell 2445381 Dez 21 CC3100 PVQFN-64

C1, C6, C7, C9, C10, C15, C16, C21, C22, C23, C27 100nF 11 Taiyo Yuden LMK105BJ104KV-F Digi-Key 587-1227-1-ND 0.034 Cap Semi '0402

C12 1uF 1 Murata Electronics North America GRM155R61A105ME15D Digi-Key 490-5409-1-ND Cap Semi '0402

C13, C14 22uF 2 Taiyo Yuden AMK107BBJ226MAHT Digi-Key 587-3262-1-ND 0.66 Cap Semi J1-0603

C18, C19, C20 4.7uF 3 Samsung Electro-Mechanics America, Inc CL05A475MQ5NRNC Digi-Key 1276-1056-1-ND 0.22 Cap Semi '0402

C2, C3 6.2pF 2 Murata Electronics North America GRM1555C1H6R2BA01D Digi-Key 490-8224-1-ND 0.10 Cap Semi '0402

C24, C25 100uF 2 TDK Corporation C3216X5R0J107M160AB Digi-Key 445-6008-1-ND Jan 32 Cap Semi C1206

C4, C5, C26 10pF 3 AVX Corporation '04025U100CAT2A Digi-Key 478-5991-1-ND 0.14 Cap Semi '0402

C8, C11, C17 10uF 3 Murata Electronics North America GRM188R60J106ME47D Digi-Key 490-3896-2-ND Cap Semi J1-0603

XT2 1 Abracon Corporation ABS07-32.768KHZ-T Digi-Key 535-9542-1-ND Jan 24 ABS07-32.768KHZ-T ABS07

XT1 1 AVX Corp/Kyocera Corp CX3225GB40000D0HEQCC Digi-Key 1253-1222-1-ND 0.75 40MHz CMAC-XTAL_2.5x3.2


BOM – Analysis of an existing predecessor-layout (if available)

Embedded Component Technology – ECTAnalysis of existing boards with regard to usability of embedded components

Embeddable Componentsidentified in BOM


Embedding of active and passive components:

Initial meeting Final implementation

Embedded Component Technology – ECTCollaboration in the concept phase



Basic Motivation


Possible components


Design & layout

Summary



EDA-Tools for ECT:

The latest versions of these tools:

Embedded Component Technology – ECTDesign and layout?


Allegro® PCB DesignerMiniaturization Option

Further toolspossible,

but with limitations

with limitations

EDA-Tools for ECT:

Main differences between these tools

ECT capable tools:

Central part libraries,footprints may be moved toany Layer of the layout

3D Design Rule Checkincluding mechanical checks

ECT incapable tools:

Application specific partlibrary, same layer stack forlibrary and application boardwith footprint on dedicatedlayer

Only 2D Design Rule Check,no Z-axis-check

Embedded Component Technology – ECTDesign and layout?


Embedded Component Technology – ECTDesign Rules ECT–µVia and ECT–Flip Chip


distancechip / sidewall

≥ 500 µm

core

prepreg

pad 175 µm

end 70 µm

componentheight

≥ 150 µm (<150 µm

uponrequest)

pitch≥ 250 µm

pad metallization≥ 6 µm Cu or≥ 5 µm Ni + flash Pd

adhesive

embedded component≤ 5 mm x 5 mm

distancenext component

≥ 300 µm

dielectricthickness

≥ 50 µm

dielectricthickness

20 – 25 µm

pad ≥ 125 µm

distancepad / pad≥ 75 µm

≈

backside contact (microvia or ICA) available upon request

distancepad / pad≥ 50 µm

componentheight≥ 150 µm

dielectricthickness≥ 50 µm

pitch≥ 100 µm

embedded flip chip≤ 5 mm x 5 mm

pad≥ 50 µm

adhesiveACA / NCA /

ESC (EncapsulatedSolder Connection)


Basic Motivation


Possible components


Design & layout

Summary




Summary

Different technologies possible

Components must meet certain conditions

Würth Elektronik already provides supportduring conceptual phase for

layer constructions,

design and

layout


Jürgen Wolf

Würth Elektronik GmbH & Co. KGProduct Manager

Embedded Component Technology


2015-05-05 webinar - ect best practice engl - downloadversion · c18, c19, c20 4.7uf 3 samsung...

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