2015/9/4system arch 2008 (fire tom wada) 1 semiconductor technology -cmos- fire tom wada

23/04/19System Arch 2008 (Fire Tom

Wada) 1

SEMICONDUCTOR TECHNOLOGY-CMOS-

Fire Tom Wada

23/04/19 System Arch 2008 (Fire Tom Wada) 2

What is semiconductor and LSIs

Huge number of transistors can be integrated in a small Si chip.

The size of the chip is roughly the size of nails.

Currently, 10M transistors can be integrated.

1000 times integration comparing to 20 yrs ago.

The cost of the chip is roughly same. All electronic equipments are powered by

LSIs. PCs, Cellular phones, 3D graphics,

Internet.


PC mother board

Large Scale Integration


SONY PLAYSTATION 2 MAINBOARD

Rendering LSI

High Speed Memory

Graphics LSI

Direct RDRAM


Mobile Phone MainboardMobile Phone MainboardMemory, Logic,

Analog


Key device is LSI

INTEL Pentium III module


This is a packaged LSI-Pentium III 300MHz Cache LSI-

15 mm

20 mm


Si chip is molded in the package.

2 million transistor Chip is connected to the pins thru

wires.


6 inches Si wafer


8 inches Si wafer

Hundreds of Chips

on a Si

Wafer


Several hundreds of chips are fabricated on a wafer simultaneously.


Chip photo- Motion Estimation Chip for HDTV camera -

9.1 mm

8.6 mm

Your small

finger’s nail size.

200M transistor

s.


Scanning Electron Microscope photo- Cross-section of the LSI -

0.5 micron


Structure Of CMOS LSI

Isolation PN-Isolation, Local oxidation

Si Substrate Bulk, epitaxial , SOI

Well Structure N-type well in P-type Substrate

Latch Up PNP Bipolar Transistor and NPN Bipolar Transistor

Fabrication Process Technology


Cross-section of the LSI

P-type Si substrateN-type well

N+ N+ P+ P+

Metal wiring

Poly-silicon

Poly-silicon

N-type MOS transistor

P-type MOS transistor

Si wafer


Transistor module （ FEP)

65nmLithography(VUV, EPL) Mask

CMPplanarization

Low Resistance Contact withHigh Aspect ratio

High κGate insulator

Fine Cu interconnectLow κ

interdielectric

SiGe/Metal gate

Multi-level Metalization

Module（ BEP)

Low Resistance Ultra shallow junction

Low stress Shallow Trench Isolation

Advanced Process Development


LSI integration trend- Moore’s law -

Wide-TV, PHS Wide-TV, PHS phonephone

DVD player

DVD-ROM

DVD-RAMDVD recorder

Source: SEMATEC

81

10B

1B

100M

10M

1M

100K

10K

1K83 85 87 89 91 93 95 97 99 01 03 05 07 09

0.8 0.5 0.3 0.18

CHANNEL LENGTH (MICRON)

0.13

Digital HDTV receiver

Nu

mb

er

of

tran

sis

tors

on

a

ch

ip

The number of transistors are

increasing by 58% per year.

- Moore’s Law -


Communications and Consumer Products Drive Semiconductor

Sources: Applied Materials Corporate Marketing estimates, Dataquest

35%

30%

25%

20%

15%

10%

5%

0%0% 5% 10% 15% 20% 25% 30% 35%

CAGR % (1997-2002)

SemiconductorIndustry

Ap

plicati

on

Mark

et

Gro

wth

SC Content (As % of Equipment Cost)

3rd Generation

2nd Generation

1st Generation

ColorTV

ColorTV

CarRadioCar

Radio

VideoCameraVideo

Camera

PortableComputingPortable

ComputingSwitching& LAN

Switching& LAN

HDTVHDTV

MultimediaPC

MultimediaPC

Advanced DesktopPC and WorkstationAdvanced Desktop

PC and Workstation

AutomotiveApplications/GPS

AutomotiveApplications/GPS

DVDPlayerDVD

Player

Set-TopBox

Set-TopBox

Internet Game Consoles

Internet Game ConsolesSmart

Cards/KiosksSmart

Cards/KiosksSmart

Appliance-PhoneSmart

Appliance-Phone

Digital CameraDigital Camera

40% 45% 50% 55%

40%

45%Cellular PhonesCellular Phones


Fabrication Process Issues


Ultra Clean Room


Basic LSI process

Layer Deposition

lithography

etching

cleaning

M1

M2

M3

M4

M5

M6

M7

SEM photo of Logic LSIs


Projection

A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A

Lens

Si Wafer

Mask

Lens

Light Source

X

Y

Stage


Wafer Test

scribing

Chips

Mounting

Bonding

Enclosing

marking

Final Test I

Burn-In

Ex.)Vcc:7V ， Temp.:125 , 24℃ ～ 42hrs

Remove Process defect Chips

Functional Test ， DC TestA

ssem

bly

Flo

w

Shipping TestFinal Test II

Packaging & Test

Sample

Wafer

Functional Test ， DC/AC Test

Functional Test(at Speed) ， DC/AC Test

Pre Test

Testing


Large Scale Integration

NMOS , PMOS and Wiring All Logic Function can be made Memory Element Can be made

Billions of Transistors and wiring make LSI!


CMOS NOT (Inverter)


CMOS NAND と NORA B f

0 0 1

0 1 1

1 0 1

1 1 0

A B f

0 0 1

0 1 0

1 0 0

1 1 0


Classification Of LSI

1. Logic LSI: Micro Processor, Digital Signal Processor (DSP), FPGA2. Memory LSI: RAM (DRAM, SRAM), ROM (Flash Memory)3. Analog LSI: ADC, DAC, Filter, Amplifier

Micro Processor (PC’s central processing Unit) Perform Digital computation according to the program in Memory Integration in 7000 times in 25 years, (Moor’s Law) Clock Speed : 700 times in 25 years

Memory LSI: 　 Dynamic Random Access Memory: Main memory for Computer, 4-

times density in 4 years Static Random Access Memory : work memory for mobile

equipments Flash Memory : Nonvolatile memory , Digital Camera Storage

Analog LSI: Used for interface, high speed RF interface, Analog to Digital

Conversion, Digital to Analog Conversion


Analog to Digital Conversion

ADC LSI

Analog to Digital

Sample the analog wave

Convert to Digital format in Binary

Same as f(t) to AnContinuous time

Discrete time


SoC Flash Memory

Chip photo

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