3-d imaging by terahertz scanner
DESCRIPTION
With the recent development of improved 3D imaging, ARP’s terahertz scanner is now capable of “seeing” inside of wafers and image defects. Thus, in addition to quantifying the defect size, one is also able to visualize the defects on the nanometer scale.TRANSCRIPT
- 1. Demonstration of sub-surface 3-D imaging capability Applied Research & Photonics, Inc.470 Friendship Road, Suite 10Harrisburg, PA 17111, USA http://arphotonics.net/Phone: +1-717-220-1003 Email: [email protected]
2. Demonstration of sub-surface 3-Dimaging capabilityWith the recent development of improved 3Dimaging, ARPs terahertz scanner is nowcapable of seeing inside of wafers and otheropaque substrates. A scanning image isgenerated pinpointing location and size ofparticulate, void, and other defects. Inaddition, defect size is quantified by to-the-scale direct measurements. It can alsovisualize the defects on the nanometer scale. 3. Snap shot of patterns on a wafer Scanned surface image of a wafer. Total scan length is ~5 m. 4. 360 inside view of the object360 view of a wafer. Color contrast represents objects of different size and material. 5. Scanner details The terahertz sub-surface scanner from ARPis a user friendly, easy to use machine. All operations are automated via includedsoftware. The machine exhibits an unprecedentedresolution of a few nanometers in 3 axialdirections. Yet scanning is fast 6. Scanner details (contd.) Screen shot of measurement consoleshown in the next slide. All parameters are entered by the front-end interface. Measured data are accessible for furthermanipulations. 7. Measurement ConsoleScreen shot of measurement console. All parameters are enteredvia the front-end. Data are easily accessible. 8. Contact informationFor more information, please contact:Anis Rahman, PhDemail: [email protected]: 717-623-8201