3d ic? 3d metrology! -...

the art of metrologyTM

3D IC?3D Metrology !

Presentation at SEMICON Europa 2015 TechLOUNGEWednesday, 07. October 2015, 16:15

FRT, Fries Research & Technology GmbHDr. Bastian Marheinekewww.frt-gmbh.com

Visit us at booth 1241

the art of metrologyTMvisit us at booth 1241

Distributors:approx. 20 in 18 countries

Founded 1995 by Dr. Thomas FriesPresidents: Dr. Thomas Fries, Dr. Bastian MarheinekeSubsidiaries in US and ChinaDistribution and service partners in Asia and EuropeDelivered more than 600 metrology tools world wide

Company Introduction


Distributors:approx. 20 in 18 countries

Development of optical 3D surface metrology systems:

� Measurement of topography, film thickness etc.� Multi sensor tools� Sensor development� Development of control and analysis software� Integration and automation� Contract measurements

� Global distribution and service network� Member in professional associations� Member in committees for standardization



Multi Sensor Metrology Modular Software Set Up

Modular Hardware Set UpMeasurement Solutions Variety



Multi sensor technology for flexible metrology syst ems

� FRT offers various sensors giving 4 basic combinati on options:

FRT Multi Sensor Technology


Fully Integrated Production Tool

Tabletop Unit

FRT ProductsFRT standard systems for various industries


MicroProf ® 100100 mm x 150 mm



Identical technology – different sizes!

MicroProf ® Series – 3D IC ApplicationCompact Multi-Sensor Systems for R&D, Production a nd QA


MicroProf ® Series – 3D IC ApplicationFully Automated Wafer Metrology Tool

MicroProf ® 200 MHUMulti Sensor metrology tool with 200 mm stage and material handling unit

MicroProf ® 300 TTV MHUMulti Sensor metrology tool with 300 mm stage, sensor setup for wafer thickness measurement (TTV), fully automated

SEMI CompliantTTV Measurement

FRT MFE - Metrology for FrontendFully automated Multi Sensor metrology tool with 300 mm stage, bridge tool, class 1 EFEM, SECS/GEM interface, thin wafer handling optional

Identical technology – fully automated!


MicroProf ® Series – 3D IC ApplicationWafer Metrology Tool

Bow Warp TTV SBID Sori SFQR Sag ProfileRoughness 3D map LTV Thickness TIR

FPD Stress ROA Film Thickness Step Height …

One Metrology Tool for All Wafer Tasks !!!

GaAs / InP / Sapphire / GaN / SiC / Si / …

saw/grinding

epitaxy

pre/post polishing

device fabrication

pre/post PSS

thinning


MicroProf ® Series – 3D IC ApplicationWafer Metrology Tool in 3D IC

Application in 3D IC

Picture courtesy:High performance interposer for network processingG. Kimmich, Jan. 2015, European 3D TSV 2015

TSV

Interposer

Backgrinding

Trenches

Bumps / µ-Bumps

Thin film measurement

Step height / width

TSV / trench depth / width

Bump analysis

Bulk thickness

Stress

T-dependent topography

Metal Contacts

Photo Resist

BGA

RDL / UBM

Reflow soldering

Multiple measurement methods in one tool

the art of metrologyTMvisit us at booth 1241ASMC2015: Optical step height and trench depth measurement , F.Heider et al. Infineon/FRT

standard deviation for 12 weeksdynamic repeatability test = 9 nm (0.17 %)

step height = 5.2 µmstep width = 12 µm

FRT CWL point sensors

� chromatic white light sensor� optical measurement � fast and non contact� down to 6 nm vertical resolution� 2 µm lateral resolution� 4 kHz measuring frequency

also determines roughness according to international standards

MicroProf ® Series – 3D IC ApplicationAnalysis of step height / width


standard deviation for 12 weeksdynamic repeatability test = 63 nm (0.03 %)

trench depth = 225.9 µmtrench width = 24.8 µm

ASMC2015: Optical step height and trench depth measurement , F.Heider et al. Infineon/FRT

FRT WLI PL field of view sensors

� white light interferometer� field of view sensor� non-contact and non-destructive� very fast 3D topography measurement with

one-shot technology� deep surface measurement without shadowing

effects due to coaxial illumination� field of view 1 x 1 mm² to 85 x 85 mm²� lateral resolution 1 µm ~ 150 µm� vertical resolution 10 ~ 30 nm

MicroProf ® Series – 3D IC ApplicationAnalysis of trenches


Via Arrays 5 µm – 100 µm

Single Via 40 µm / 250 µm

Multiple Vias 15 µm – 80 µm Multiple Vias 5 µm / 70 µm

MicroProf ® Series – 3D IC ApplicationAnalysis of TSV


FRT WLI FL field of view sensors

� white light interferometer� field of view sensor� non-contact and non-destructive� very fast 3D topography measurement

with one-shot technology� sub-nanometer vertical resolution,

sub-micrometer lateral resolution� field of view 0.26 x 0.35 mm²

to 1.3 x 1.74 mm²� lateral resolution 0.6 µm ~ 2.3 µm� vertical resolution 0.1 ~ 1.0 nm

Analysis of Trench and TSV structures < 1µm!

MicroProf ® Series – 3D IC ApplicationAnalysis of Trenches and TSV


FRT CFM field of view sensors

� confocal microscope� field of view sensor� non-contact and non-destructive� very fast 3D topography measurement

with one-shot technology� nanometer vertical resolution,

sub-micrometer lateral resolution� field of view 0.14 x 0.19 mm²

to 0.72 x 0.96 mm²� lateral resolution 0.37 ~ 1.23 µm� vertical resolution 1 ~ 3 nm

Fully automated bump field analysis:Statistics on bump height, diameter, co-planarity, etc.

MicroProf ® Series – 3D IC ApplicationAnalysis of Bumps / Micro Bumps


No. T[nm] (n,k)

1 3079 SiO2.nk2 456 Si3N4$.nk3 750000 Si.nk

Fit results from centre measurement

FRT FTR film thickness sensor

� UV/VIS/NIR interferometric sensor� optical measurement – non contact� fit algorithm (up to 10 layers)� iterative FFT / fit analysis� 20 nm ~ 230 µm range� better 1% (1 nm) thickness resolution � 100 ~ 400 µm lateral resolution� ~ 5 µm high resolution with optics

SiO2 / Si3N4 on Si substrate

MicroProf ® Series – 3D IC ApplicationAnalysis of single and multilayer film thickness


FRT IRT film thickness sensor

� IR interferometric sensor� optical measurement – non contact� FFT analysis� 4 ~ 4,700 µm range (n = 1)� 15 ~ 105 nm thickness resolution� 6 ~ 25 µm lateral resolution� 4 kHz measuring frequency

Controlled thinning process from full wafer thickness (~ 724 µm) to < 5 µm

MicroProf ® Series – 3D IC ApplicationAnalysis of wafer thickness / back grinding


Total thicknessmeasurementin TTV set-up

(2x CWL)Film ThicknessSi-Waferwith FRT IRT

Film ThicknessResistwith FRT IRT

+ 2 x

MicroProf ® Series – 3D IC ApplicationAnalysis of back grinding: wafer and resist thickne ss


2 x

Fully automated analysis of global and local wafer parameters

- also for glass wafers -

MicroProf ® Series – 3D IC ApplicationAnalysis of wafer parameters: TTV, bow, warp, …


Topographypre treatment

Topography post treatment

MicroProf ® Series – 3D IC ApplicationAnalysis of bow of Si IC stack


Stress: σ = -7,65 MPa

Topography priorto film deposition

Topography afterfilm deposition

Thickness mapping

+

Stoney equation

MicroProf ® Series – 3D IC ApplicationAnalysis of wafer stress


T = 25°C T = 175°C

Fully automated topography measurement at different temperatures

MicroProf ® Series – 3D IC ApplicationThermo Unit


3D IC? – 3 D Metrology!

MicroProf ® Series:• Combination of multiple sensors

• Semi automated to fully automated wafer metrology

• Top- / backside topography

• Multiple parameter analysis

• TSV and Trench measurement

• Bump and µ-bump analysis

• Global and local wafer parameter analysis

• Film thickness measurement

• Stress analysis

• Measurement under thermal load

One Metrology Tool for All Wafer Tasks !!!


HeadquartersFRT, Fries Research & Technology GmbHFriedrich-Ebert-StrasseD-51429 Bergisch GladbachTel.: +49 (0) 2204 - 84 2430Fax: +49 (0) 2204 - 84 2431

Internetwww.frt-gmbh.com

[email protected]

FRT, Fries Research & Technology GmbH

Thank you for your attention!

Visit us at booth 1241!

3d ic? 3d metrology! -...

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