Copyright ©2011 SENJU METAL INDUSTRY CO.,LTD.

Fine Pitch Bumping Formation Application Fine Pitch Bumping Formation Application -- PPS & Micro ball PPS & Micro ball --

Sep.08.2011Senju Metal IndustryR&D center Kaichi Tsuruta

Role of Senju Micro Soldering Material

Support for The Development Support for The Development of High Density Packaging Technologyof High Density Packaging Technology

Trend of Semiconductor Packaging

Demand for The Development ofDemand for The Development ofMicro Soldering TechnologyMicro Soldering Technology

Solder Material for Semiconductor

Y2005 Y2010

Fine Pitch Trend and Micro Soldering Methods

Micro Solder Ball Mounting

80um Pitch

Y2015

120um Pitch 60um Pitch 35um Pitch

写真提供：長瀬産業株式会社様

100um Pitch

Solder Paste Printing

Senju PPS Method

25um Pitch

Y20XX

PPS: Pre-coated by Powder Sheets

The Current Method

Copyright ©2011 SENJU METAL INDUSTRY CO.,LTD.

MicroMicro--Solder Precoat Technology Solder Precoat Technology by Precoat by Powder Sheet (PPS)by Precoat by Powder Sheet (PPS)

Micro solder bump by PPS

25um Pitch

35um Pitch

Sample by NAGASE & CO., LTD

Peripheral PCB

７５μｍP

Micro solder bump for Peripheral PCB by PPS

Sample by Hitachi chemical

Those issues may be resolved by PPS

Comparison of Micro‐Solder Bump Technologies

Variation of Thickness

Printability for fine pitch patterns

Solder Paste

(Screen Print)

Voids

Expensive mounting toolBall mount

Accuracy of mounting

Plating Limitation of metal compositions 

PPS=Precoat by Powder Sheet

Features of PPS method

Features of PPS method1. Applicable to fine pitch   (25 µm Pitch)2. Solder bump height is usually apx.4‐6 µm with 1 st PPS  and 

apx.10 μm height with 2 nd PPS for a wafer with 40 µ m pitch. 3. Small variation of Bump Height

σ<1  for a wafer with 40 μm pitch 4.   No need of solder mask or alignment tools

5.  Applicable for a variety of solder alloy composition 

Structure  of  PPS sheet

Powder size：5～10umPowder size and alloy composition are selective for each application 

Solder Powder

Base sheet （PET）

5um~10um

View from top side

Adhesive layer

Top view of PPS sheet

Cross section view

25um Pitch

35um Pitch

Surface×500（Bird’s eye view）

X‐Section×2.0kSurface×500（Bird’ eye  view）

After UBM After Solder bump

Solder Bump by PPS  

25um

35um

Si‐Sub

Solder BumpUBM

Solder BumpUBM

Si‐Sub

Sample by NAGASE & CO., LTD

1. Contact PPS sheet with work then press with heat

PPS process‐1

PPS transfer temperature should be lower than the melting point of solder alloy.

Press with heat

Under plate  (40℃)

2. Removing PPS sheet

PPS process‐2

Cleaning

3. Flux+Reflow, Cleaning 

PPS process‐3

Reflow temperature is higher than the melting point of solder alloy

fluxReflow

PPS bonder φ320mm Max

Upper heat plate

Lower heat   plate

PPS process for peripheral PCB

Cross section of PPS bump

Void inspection by X ray viewer

Less voids 

Voids of PPS Bump

PCB size 30×30×0.8 mm

# of Electrodes  60×60=3600 pads

Pitch 200 µm

Diameter of each pad

120 µm

Test Board

Mechanism of PPS method

Fts < Fimc

Selective transfer, Selective solder bump

Solder bumpFimc IMC

Electrode, pad

PET

Adhasive layer

Solder powder

PPS sheetFts

Copyright ©2011 SENJU METAL INDUSTRY CO.,LTD.

Senju Micro Ball TechnologySenju Micro Ball Technology

The Success Factor for Micro Soldering

Micro Solder Ball

30um

50um

Flux for Micro Soldering

DELTALUX MB-T100

Reflow Oven for Micro Soldering

SNR-850MB CX-430 /for Clean Room

Solder Ball M705-50umFlux MB-T100Reflow Oven SNR-850MB

wafer 8 inchPitch 85 um# of Bumps 3200K

Work Size

Soldering Materials and Equipment85um Pitch/50um Ball Bumping

Senju Micro Ball Joint Experience

Paste Micro Ball Plating

Void ○ ◎ △

Coplanarity ○ ◎ ○

Repair × ◎ ×

Pitch size ○ ◎ ◎

Solder composition variation ○ ◎ ×

For Environment ○ ○ △

Operation cost ◎ ○ △

Advantage of Micro Solder Ball Bumping

0.1m

m

0.2m

m

0.3m

m

0.7m

m

0.8m

m

1.0m

m

Ball Diameter

BGA Ball

Senju Solder Ball Lineup

The diameter range of Senju solder products is from 40um to 1mm. Senju can supply various size of ball answering the needs of customer.

Micro Ball

0.04

mm

Senju standard Micro Ball tolerances is +/-3um.

Control Cpk, Cir Trend & SPC. at RFC, DRB, MRB System Completely

0.0001

0.00015

0.0002

0.00025

0.0003

0.00035

0.0004

Sig

ma(

Dia

)

3 6 9 12 15 18 21 24 27 30 33

Sample

Avg=0.000248

LCL=0.000123

UCL=0.000374

I nd ividua l Measurement of Sigma(D ia )

Diameter Diameter StdevStdev..

0.0695

0.06975

0.07

0.07025

0.0705

0.07075

AV

G(D

ia)

3 6 9 12 15 18 21 24 27 30 33

Sample

Avg=0.070169

LCL=0.069694

UCL=0.070645

I nd ividua l Measurement of AVG(D ia )

Diameter Mean.Diameter Mean.

1

2

3

4

5

6

CpK

(Dia

)

3 6 9 12 15 18 21 24 27 30 33

Sample

Avg=3.88

LCL=2.04

UCL=5.73

I nd ividua l Measurement of CpK(D ia )

* LAS M705 70um

Micro Ball Process Capability

2011 2012 2013

Micro Ball Manufacturing (HVM Method)45um 40um Under 30um

Micro Ball Technology (Special Method)20um Under 20um

Micro Solder AlloySAC,SC Low Temp.Bi,In,ZnSAC

New Micro Soldering Materials Cu,Ni core Ball

Senju Micro Solder Ball DevelopmentTechnical Roadmap

Aug. 2011

Micro Ball Recyclable PBF Package

Demand for LAS ( Low Alpha Solder ) Product

Wafer

Memory Cell

Soft error model chart

Alpha particleAlpha particle

Miniaturization and High density

Soft errorSoft errorITRS 2009 Edition

Year of production 2011 2012 2013 1014 2015

DRAM ½ Pitch(nm) 40 36 32 28 25

The alpha particle discharged from solder is an incidence in the memory cell. It ionizes and electron-hole pair is generated. The hole is pulled to the substrate side and the electron is pulled to the memory cell side. It is information 0 as for the state that the electron is filled in the memory cell part, the electron is information 1 in the memory cell part as for empty. The malfunction of information 1→0 occurs.

Substrate

Soft errorSoft error

⊕⊕ ⊖⊖

⊖ ⊖

Ionization effect is strong！

Solder

Senju LAS Materials

D50

5

10

15

20

25

5um

Targ

et

7um

Targ

et

9um

Targ

et

D 0

207

D 0

308

D 0

409

D 0

510

Raw

pow

der

Dis tribution

LAS Solder PasteFor fine pitch bumping for substrate, wafer

LAS Solder BallFor super fine pitch & stable volume bumping on substrate, wafer

LAS Super Fine Solder PowderFor flexible wiring, bumping, research material for future

Senju LAS Material

Senju LAS Micro Ball StandardDiameter and Tolerance : 40-110um ±3umAlpha count : 0.02cph/cm^2 or lessSolder Composition : M705(SAC305), M200(SnCu), SnPb

Senju Low Alpha Grade

( cph/cm^2 )0.0200.0100.002 0.005

G3(0.002<G3<0.005)

G2(0.005<G2<0.010)

G1(0.010<G1<0.020)

LASG4

(G4<0.002)

◆LACS-4000M(SUMIKA)Sample area：900～1000cm^2Counting time：72～99hourCounting gas：PR-10(Ar90%+CH410%)

LACS-4000M Model 1950

Gas Proportional Alpha Particle Counter

◆Model 1950(Alpha Sciences)Sample area：900～1000cm^2Counting time：72～100hourCounting gas：PR-10(Ar90%+CH410%)

Senju can provide low alpha solder material. We have many experiences of low alpha product manufacturing (Solder Ball, Solder Paste, Solder Powder, etc…).Raw materials may be sourced internally or externally to best meet customer’s preferred low alpha limitations.

HAS material

0

5

10

15

20

1 2 3 4 5 6 7 8 9 101112131415161718192021222324252627282930Lot No.

Alp

ha c

ount

, cph

/cm

2

HAS material

LAS material

0.000

0.005

0.010

0.015

0.020

1 2 3 4 5 6 7 8 9 101112131415161718192021222324252627282930Lot No.

Alp

ha c

ount

, cph

/cm

2

LAS material

Reference : HAS (Reference : HAS (HHigh igh AAlpha lpha SSolder) Materialolder) Material

Reference : LAS (Reference : LAS (LLow ow AAlpha lpha SSolder) older) MaterialMaterial『 Senju Product Standard 』

G1 : < 0.02cph/cm2

G2 : < 0.01cph/cm2

G3 : < 0.005cph/cm2

G4 : < 0.002cph/cm2

Ex. HAS SAC Solder

Alpha count revel→ about 7~12cph/cm2

Ex. 0.005cph/cm^2 grade of SAC Solder

Senju Low Alpha Control Ability

Selected RM group

LAS RM(With alpha count CofC)

Meltingblending

Ag, Cu

Rare Sn, Pb or alloy (Sn/Pb, SA,SAC..etc)

Puremetal

RM incoming Alloy casting

Alpha count inspection

Composition inspection

Inspection

OK

OK

LAS product manufacturing

MultiVendor

Sphere, powder, others

Solder Sheet

The Senju-LAS product is blended and inspected by itself.

LAS Blending, Inspection Flow

Micro Sphere & Powder Mfg and Develop’t Established on 2006/12/ 01

Manufacturing

Sales

HQ

Iwate Plant Iwate Plant (HVM Plant for BGA/CSP Sphere)

Tochigi Plant (R & D) Tochigi Plant (R & D) (Initial Sphere Build & Mother Plant)

Senju Senju GikenGiken, Miyazaki , Miyazaki (HVM Plant for Micro Sphere

SMIC has the Policy Securing Capacity at the HVM Factory SMIC has the Policy Securing Capacity at the HVM Factory Micro Ball Shall be Shipped from Tochigi or Miyazaki Micro Ball Shall be Shipped from Tochigi or Miyazaki

Akita

Senju System Technologies

Hanamaki

KoriyamaSendai

Hokuriku

Hiroshima

SaitamaTechnical Center

Fukuoka

Kansai

Miyazaki

Suwa

Kyoto

OsakaNagoya

Oita

Senju Micro Ball Business Continuity Plan

If you have any question for our products, please feel free contact us.

Thank you.

Contact Person:Sneju Taiwan BranchClement Chang (clement@senju.com.tw)Lewis Huang (lewis@senju.com.tw)

Senju Metal Industry Co., LTD.