42lg70 service

LCD TVSERVICE MANUAL

CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LA86A

MODEL : 42LG700H 42LG700H-UA

North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com

Internal Use Only

- 2 -Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ......................................................................... 3

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 9

TROUBLE SHOOTING ........................................................................... 15

BLOCK DIAGRAM.................................................................................. 20

EXPLODED VIEW .................................................................................. 25

SVC. SHEET ...............................................................................................

Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only- 3 -

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.

It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.

Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument'sexposed METALLIC PARTS

Good Earth Groundsuch as WATER PIPE,CONDUIT etc.

AC Volt-meter

IMPORTANT SAFETY NOTICE

0.15uF



CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.

General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power

source before;a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.

2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of itsassemblies.

4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.

7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.

Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the

unit under test.2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.

4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).

7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.

8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)

General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within therange or 500°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.

(500°F to 600°F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature

(500°F to 600°F)b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS



IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.

Removal1. Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the soldermelts.

2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.

Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and

solder it.3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as

possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.

Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit

board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.

Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as

possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit

board.3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.

Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.2. Securely crimp the leads of replacement component around

notch at stake top.3. Solder the connections.

CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.

Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.

At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).

1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.

At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.

1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.

1. Application rangeThis specification is applied all of the 32”, 37”, 42” LCD TVwith LA80A chassis.

2. Requirement for TestEach part is tested as below without special appointment.

1) Temperature: 20±5ºC2) Relative Humidity: 65±10%3) Power Voltage : Standard input voltage(100-120V~, 50/60Hz)

* Standard Voltage of each product is marked by models4) Specification and performance of each parts are followed

each drawing and specif ication by part number inaccordance with BOM.

5) The receiver must be operated for about 20 minutes prior tothe adjustment.

3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification

- Safety: UL, CSA, IEC specification- EMC: FCC, ICES, IEC specification

Model Market Appliance

42LG700H-UA North America Safety : UL1492, CSA C22.2.No.1

EMC : FCC Class B, IEC Class B



SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.

4. General Specification(TV)

No Item Specification Remark

1 Receivable System VSB/64& 256 QAM/NTSC-M

2 Available Channel VHF : 02 ~ 13

UHF : 14 ~ 69

DTV : 02 ~ 69

CATV : 01 ~ 135

CADTV : 01 ~ 135

3 Input Voltage AC100-240V~, 50/60Hz

4 Market North America

5 Screen Size 42 Inch

6 Aspect Ratio 16:9

7 Tuning System FS

8 LCD Module EAJ41862301 V4 LC420WXN LGD

EAJ57858701 V4 LC420WXN

9 Operating Environment Temp : 0 ~ 40 deg

Humidity : ~ 80 %

10 Storage Environment Temp : -20 ~ 50 deg

Humidity : 10 ~ 90 %



5. Component Video Input (Y, CB/PB, CR/PR)No Resolution H-freq(kHz) V-freq.(kHz) Proposed

1 720*480 15.73 60 SDTV ,DVD 480I

2 720*480 15.73 59.94 SDTV ,DVD 480I

3 720*480 31.47 60 SDTV 480P

4 720*480 31.47 59.94 SDTV 480P

5 1280*720 45.00 60.00 HDTV 720P

6 1280*720 44.96 59.94 HDTV 720P

7 1920*1080 33.75 60.00 HDTV 1080I

8 1920*1080 33.72 59.94 HDTV 1080I

6. RGB Input (PC)No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

PC DDC

1. 640*350 31.468 70.09 25.17 EGA X

2. 720*400 31.469 70.08 28.32 DOS O

3. 640*480 31.469 59.94 25.17 VESA(VGA) O

4. 640*480 37.861 72.80 31.50 VESA(VGA) O

5. 640*480 37.500 75.00 31.50 VESA(VGA) O

6. 800*600 35.156 56.25 36.00 VESA(SVGA) O

7. 800*600 37.879 60.31 40.00 VESA(SVGA) O

8. 800*600 48.077 72.18 50.00 VESA(SVGA) O

9. 800*600 46.875 75.00 49.50 VESA(SVGA) O

10. 1024*768 48.363 60.00 65.00 VESA(XGA) O

11. 1024*768 56.476 70.06 75.00 VESA(XGA) O

12. 1024*768 60.023 75.02 78.75 VESA(XGA) O

13. 1280*768 47.776 59.870 79.5 CVT(WXGA) O

14. 1280*768 60.289 74.893 102.25 CVT(WXGA) O

15. 1360*768 47.712 60.015 85.50 VESA (WXGA) O

16. 1280*1024 63.981 60.020 108.00 VESA (SXGA) O

17. 1280*1024 79.976 75.025 135 VESA (SXGA) O



7. HDMI input (PC/DTV)No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

PC DDC

1 640*350 31.468 70.09 25.17 EGA X

2 720*400 31.469 70.08 28.32 DOS O

3 640*480 31.469 59.94 25.17 VESA(VGA) O

4 800*600 35.156 56.25 36.00 VESA(SVGA) O

5 800*600 37.879 60.31 40.00 VESA(SVGA) O

6 800*600 48.077 72.18 50.00 VESA(SVGA) O

7 800*600 46.875 75.00 49.50 ESA(SVGA) O

8 1024*768 48.363 60.00 65.00 VESA(XGA) O

9 1024*768 56.476 70.06 75.00 VESA(XGA) O

10 1024*768 60.023 75.02 78.75 VESA(XGA) O

11 1280*768 47.776 59.870 79.5 CVT(WXGA) O

12 1360*768 47.712 60.015 85.50 VESA (WXGA) O

13 1280*1024 63.981 60.020 108.00 VESA (SXGA) O

14 1280*1024 79.976 75.025 135 VESA (SXGA) O

DTV

1 720*480 31.47 60 SDTV 480P

2 720*480 31.47 59.94 SDTV 480P

3 1280*720 45.00 60.00 HDTV 720P

4 1280*720 44.96 59.94 HDTV 720P

5 1920*1080 33.75 60.00 HDTV 1080I

6 1920*1080 33.72 59.94 HDTV 1080I



ADJUSTMENT INSTRUCTION

1. Application RangeThis specification sheet is applied for all of the LCD TV withLA80A chassis.

2. Specification(1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolationtransformer will help protect test instrument.

(2) Adjustment must be done in the correct order.(3) The adjustment must be performed in the circumstance of

25±5°C of temperature and 65±10% of relative humidity ifthere is no specific designation.

(4) The input voltage of the receiver must keep 100~120V,50/60Hz.

(5) The receiver must be operated for about 5 minutes prior tothe adjustment.* After RGB Full White in HEAT-RUN Mode, the receiver

must be operated prior to the adjustment.* Enter into HEAT-RUN MODE

1) Press the POWER ON KEY on R/C for adjustment.2) OSD display and screen display 100% full WHITEPATTERN.

* Set is activated HEAT run without signal generator in thismode.

* Single color pattern (RED / BLUE / GREEN) of HEATRUN MODE uses to check panel.

* Caution: If you turn on a still screen more than 20minutes (Especially digital pattern, cross hatch pattern :13CH), an after image may be occur in the black levelpart of the screen.

3. Method of PTC MICOM Download3.1. Connection of MICOM JIG

(1) Connect port(3) with Power Code (2) Connect jack(1) with PTC Micom.(3) Connect USB Cable to the computer (4) Download Program execution (SAP Configuration)

* Notice!Because PTC Download JIG has internal memory, it cansave download fi les using download program (SAPConfiguration). Push the START button (4) after file saving,then it execute download.

3.2. Execution of download program(SAP Configuration)

3.2.1. Execution of SAP Configuration

(1) Select HCS12(2) Target Frequency Settings :

1) Checking the factor -> Use Specif ied TargetFrequency…, Unsecure target….

2) Insert Target Bus Frequency -> 7372800(3) Specify Algorithm: 9S12dt128_128k .12P(4) Specify S Record: select download file. (5) Checking factor: Erase Device, Blank Check Device,

Program Device, Verify Device * Notice!

Don’t check other checking boxes. You must follow fig.(6) Push the ‘Save Image to Cyclone PRO’ button, files

transfer from PC to the Download JIG.

4. Start button

3. Power

1. Connect to Micom port of TV board. 2. Connect to computer.

3 4

1

2

5

6

- 10 -

4. Method of CPLD Download

- Using equipment : PC, download JIG cable(Altera Byteblaster cable)

(1) Connect the JIG cable between computer and Mainboard(P1500)

(2) Connect the power cable of Main board and Turn on theMain power.

(3) Launch the download program(QuartusII 6.1 programmer)in the Computer.

(4) Setting the environment feature of the download program

(5) Click the “Add File...” menu and select the downloadfile(dvi_12to24.pof) in your PC.

(6) Check the “Program/Configure” and “Verify” box and thenclick “Start” button

(7) Without any problem, you can see the normal status of theprogress bar



Main B/D

JIG cable(CPLD D/L)

- 11 -

5. Adjustment of ADC on PCB Ass’yLevel

5.1. Method of adjustment through RS-232C- System control RS-232 Host should be “PC” for adjustment.

Refer to the “6.1.2 Procedure of Adjustment” and adjustthree items of ADC on PCB Ass’y level through the RS-232C.

** ADC adjustment RS232C Protocol Ver 1.0

* Baud Rate : 115,200 bps* RS232C Host : PC* echo : None

(1) Requirement for Adjustment- Pattern Generator : MSPG-925FA- Adjust 480i Comp1(Model : 209, Pattern : 65)- Adjust 1080p Comp1 / RGB(Model : 225, Pattern : 65)

(2) Adjustment Procedure- ad 00 00 Entering ADC Adjustment Mode- kb 00 04 Component1 Input Change- ad 00 10 Adjust 480i Comp1- kb 00 06 RGB-DTV Input Change- ad 00 10 Adjust 1080p Comp1/RGB- ad 00 90 Finish adjustment

5.2. MAC Address DownloadFor downloading the MAC address which be allotted on eachLAN Card.

(1) Adjustment Method1) Connecting the TV set and the PC which has MAC

Address Writing program through the RS232C cable.2) Editing the macaddress.txt

(Inserting start MAC address at top low.Inserting start MAC address at bottom low.Launch MAC Address Writing program and set just likebelow picture. - (1)

3) Click the LOAD button for reading the MAC address.- (2)(SAVE : Saving the current MAC AddressCLEAR : Initializing the space which insert MAC Address.

4) Click the “MAC Address writing” button to write currentMAC Address.- (3)

5) In case of being downloaded normally, you can see the“OK” message in the window. - (4)

6) In case of being downloaded normally, MAC addressincreased one by one automatically. So the next set, justclick the “MAC Address witing” button after connectingthe port.(Whenever be finished, the program saves the MACAddress in “macaddress.txt” file automatically.)

5.3. PING Test* For confirm works normally the LAN card through PING TEST.

(1) Adjustment Method (PCB Ass’y Level)1) Connecting the LAN to Ass’y and then turn on the Power.

(Default IP Setting is “Automatic setting” and allocatedthe IP from Router each Power ON time automatically.)

2) Press the ADJ Key in the adjustment remote controller.3) Press the “11. ACAP PING TEST” in EZ ADJUST menu

to check the Network works well. In case of normal status, you can see the “Networ isnormal” message. And abnormal case, you can see “Networ is not normal”message.



480i Component 1080p Component / RGB

MSPG-925FA Model No : 209 Pattern No : 65

Model No : 225 Pattern No : 65

Procedure Command Set Act

1. Entering ADC mode ad 00 00 d 00 OK00x

2. Input change kb 00 01 b 00 OK01x (Adjust RF and Video)

kb 00 04 b 00 OK04x (Adjust 480i Comp1)

kb 00 06 b 00 OK06x (Adjust 1080p Comp1/RGB)

3. Start ADC ad 00 10

4. Result return OKx (Success)

NGx ( Fail )

5. Data read ( main) (main)

ad 00 20 000000000000000000000000007c007b006dx

( sub ) (Sub)

ad 00 21 000000070000000000000000007c00830077x

6. Data confirm ad 00 99 NG 03 00x (Fail)

NG 03 01x (Fail)

NG 03 02x (Fail)

OK 03 03x (Success)

7. Finish ADC ad 00 90 d 00 OK90x

(1)

(2)

(3)

(4)

- 12 -

(2) Adjustment Method (Ass’y Line Level)1) Connecting the LAN port in SET to the PC which has the

PING Test program through a Cross LAN Cable. (PCLAN IP setting : 12.12.2.3)

2) Launch the PING Test program and confirm the programSetting.(Checking the TV’s IP is set 12.12.2.2 in program. Don’tcheck the Modem.)

3) Press the Power Only Key in the adjustment remotecontroller. (Setting the TV IP)

4) Click the “RUN” button of program, and then programdisplay “OK” or “NG” like a below picture.

* For clear the IP setting after the adjustment, press theINSTOP button.

6. Assembly Line Level Adjustment

6.1. Adjust Component / RGB with remotecontroller.

(1) Required Equipment- Remote controller for adjustment - AV Pattern Generator: 801GF(802B, 802F, 802R), Master

(MSPG-925FA), etc(Which has 480i/1080p Horizontal 100% Color BarPattern with 0.7±0.1 Vpp level. See Fig. 1)

- It is very import to use correct adjustment pattern likeFig.1.

(2) Method of Adjusting 480i Comp1, 1080p Comp1 / RGBColor Balance1) Checking the connection of TV set and Pattern

Generator. -> MSPG-925FA, Model No : 209, Pattern No: 65

2) Set the TV source to Component and input the 100%Horizontal Color Bar Pattern(HozTV31Bar), and finallyselect picture mode to ‘Normal’(standard).

3) After receiving the signal, Press ADJ key on R/C foradjustment.

4) Select the 1. Adjust 480i Comp1 and press the G(Vol. +)or Enter key operate to set, and then it becomesautomatically.

5) “ADC Component1 Success” means completedadjustment.

6) If abnormal case, TV display the message “ADCComponent1 480i Fail”

7) Checking the connection of TV set and Pattern Generator.-> MSPG-925FA, Model No : 225, Pattern No: 65

8) Set the TV source to Component and input the 100%Horizontal Color Bar Pattern(HozTV31Bar) of 1080pmode, and finally select picture mode to ‘Normal’(standard).

9) After receiving the signal, Press ADJ key on R/C foradjustment

10) Select the 2. Adjust 1080p Comp1 / RGB and pressthe G(Vol. ±) or Enter key operate to the set, and thenit becomes automatically

11) In case of normal status “ADC Component1 Success”means completed adjustment.And abnormal status “ADC Component1 1080p Fail”

12) After adjusting the Comp1, TV source will be changedRGB DTV mode. Then Adjustment will be automatically done.

13) “ADC RGB 1080p Success” means completedadjustment.

14) After finish adjustment, press the ADJ key and quit theadjustment menu.

7. EDID / DDC INPUT

7.1. EDID(The Extended Display IdentificationData)/DDC(Display Data Channel) download

(1) Required Test Equipment1) Adjusting PC with S/W for writing EDID Data.2) A Jig for EDID Download3) Cable: Serial (9Pin or USB) to D-sub 15Pin cable, D-sub

15Pin cable, DVI to HDMI cable.

(2) Setting of device

1) When input HDMI EDID data through RGB or HDMIjack, writing 8bits of the data at every turn with “DDC2B”protocol.



<Fig. 1. Adjust Pattern : 480i/ 1080p 60Hz pattern>

<Fig. 4 Connection Diagram of DDC download>



(3) Data of EDID for 42LG7DC-UA1) DDC data of Analog-RGB

2) DDC data of Digital-HDMI 1

3) DDC data of Digital-HDMI 21

* Before adjustment of white balance, should be executedthe “color balance adjustment”.

8. Adjustment of White Balance

8.1. Required Equipment1) Remote controller for adjustment 2) Color Analyzer ( CA-210 or same product )3) Auto W/B adjustment instrument(only for Auto adjustment)4) Use inner(SELF) Pattern

* When adjust White Balance automatically *- Through the power only key on the R/C, operate the auto

adjustment- Setting the Baud Rate : 115200

- Wb 00 00 white balance auto adjustment start- Wb 00 10 gain adjustment start (inner pattern)- Ja 00 ff adjustment data- Jb 00 c0- ···¶- Wb 00 1f gain adjustment finish- * If occurs abnormal case, adjust the offset.(wb 00 20(start),

wb 00 2f(finish))- Wb 00 ff white balance auto adjustment finish(disappearance

the inner pattern)

* Caution) Adjustment Map

8.2. Adjustment of White Balance(For Manual adjustment)

Set TV input to RF.Operate the zero-calibration of the CA-210, Ch.9. Then stick sensor to LCD module surface when you adjust. For manual adjustment, it is also possible by the followingsequence.

(1) Select white pattern of heat-run mode by pressing poweron key on remote control for adjustment then operate heatrun more than 5 minutes.

(2) Enter the White Balance adjustment mode by pressing theADJ key (5. White Balance) on R/C.

(3) Stick sensor to center of the screen and select each itemsusing F/G(CH +/-) key on R/C.

(4) Adjust G Gain / B Gain using D/E(VOL +/-) key on R/C.(5) Adjust it until color coordination becomes as below.

By controlling G, B GAIN, adjust X, Y target value. R Gain fixed at cool, normal, warm mode.But, Control the R GAIN, unless it has correct value

(Initially, R/G/B gain and R/G/B offset values are fixed as below.)Red Gain: 192 Green Gain: 192 Blue Gain: 192Red Offset: 64 Green Offset: 64 Blue Offset: 64

RS-232C COMMAND MIN CENTER Max

[CMD ID DATA] (DEFAULT)

Cool Medium Warm Cool Medium Warm

R Gain jg ja jd 00 184 192 192 192

G Gain jh jb je 00 187 183 159 192

B Gain ji jc jf 00 192 161 95 192

R Cut 64 64 64 127

G Cut 64 64 64 127

B Cut 64 64 64 127

RS-232C COMMAND Meaning

[CMD ID DATA]

wb 00 00 White Balance adjustment start.

wb 00 10 Gain adjustment star (Inner white pattern)

wb 00 1f Gain adjustment finish.

wb 00 20 Offset adjustment start (Inner white pattern)

wb 00 2f Offset adjustment finish

wb 00 ff White Balance adjustment finish(disappearance inner pattern)

- 14 -

* Taget value

(6) When adjustment is completed, Exit adjustment modeusing EXIT key on R/C.

9. Checking the EYE-Q operation.Step 1) Press the EYE Key on the Adjustment remote

controller.Step 2) Screen the Eye Q sensor in front of the TV by hands,

and keep up about 6 seconds.Step 3) Checking “Raw Data(R: G: B: )” value are changed

less than “10”, or not. If the values are not changed,exchange the sensor unit by soldering.

Step 4) Pull out the hands, keep up about 6 seconds.Step 5) Checking “B.Light(XXX)” value increase from “0”, or

not. If the values are not changed, exchange thesensor unit by soldering.

10. GND and Inspection for againstPressure

(1) GND & Auto Inspection for against surge voltage-Confirm that the power cord is inserted TV SET perfectly.

(2) Operation the GND & Auto Inspection for against surgevoltage1) The TV set is entered auto inspection Line. Undoubtedly

the TV set is confirmed that Power cord, Tuner cable,A/V cables are inserted perfectly.

2) Connect the D-terminal AV JACK tester.3) Turn on the Auto controller (GWS103-4)4) Operate the GND test5) If case of NG, the BUZZER will be alarmed.6) Case of OK, the process will be changed Inspection for

against surge voltage automatically.(Disconnect the cord, A/V from AV JACK box)

7) Start the Inspection for against surge voltage TEST8) If case of NG, the BUZZER will be alarmed.9) Case of OK, GOOD LAMP will be turned on and the TVmoved next process.

(3) Caring Items1) TEST Voltage

- GND : 1.5KV/min at 100mA- SIGNAL : 3KV/min at 100mA

2) TEST time : 1 second3) TEST POINT

- GND TEST = POWER CORD GND fl‡ SIGNALCABLE METAL GND

- Inspection for against surge voltage test = Power cordGND fl‡ live & neutral

4) Leakage Current : Setting less than 0.5mArms

11. IR IN/Out, Lodgenet Check

11.1. Check Order “OK” Judgment(1) The method of Cable connecting from jig to TV.

1) Power Cable is connected to jig for supplying voltage.(as below picture point2)

2) Phone jack is Connected for IR out test from TVREMOTE CONTROL OUT(JK900) to jig. (as belowpicture point1)

3) In the right side of check jig, 11pin SPI/MPI signal cableis connected to MPI dummy board. (as below picturepoint3)

(2) Test sequence1) Press EYE using adjust remote-control.2) Then, tuning the channel 96- 1.(Lodgenet digital1.)

automatically.3) Check it whether the video is clear and 1~5 factor “OK”

like below picture.(IR IN / IR OUT / SPI TEST / MPI TEST / 12V IN)If you find any problem, press <Eye> button and retest.

11.2. Need JIG & Equip & Cable(1) adjust remote-control(2) commercial check jig & adapter(3) 11 pin cable(4) Phone jack Cable

12. Auto camport testAfter D-box on, AC power Off and On.When available AV signal comes to side AV jack, input modechanging to AV2 automatically.



X Y Temp(∆uv)

Cool 0.276±0.002 0.283±0.002 11,000K(0.000)

Medium 0.285±0.002 0.293±0.002 9300k(0.000)

Warm 0.313±0.002 0.329±0.002 6,500K(0.003)

<Step 1>

<Step 4> <Step 5>

<Step 2> <Step 3>

1. Power-Up Boot Fail

2. No OSD

- 15 -

TROUBLE SHOOTING



Check P800 AllVoltage Level (5V, 12V, 16V).

Check power connector andRL_ON signal OK ?

Replace Power board.

Y

N Y

Check IC1301 RESET andUPDATE pin.

Check switch SW1300, SW1301.

Y

N

Check X1300 Clock7.37MHz.

Check X1300 application circuitor Replace X1300.

Y

N

Check IC1300 IICcommunication state.

Check IIC line or replace IC1300.N

Check IR input state of IC130123pin.

Check IR board.N

Y

Re-download PTC Micom.

Y

Check LVDS Cable.

Check LCD ModuleControl board.

Y

Replace Cable.N

Check P800 AllVoltage Level (5V, 12V, 16V)

Check power connector andRL_ON signal OK ? Replace Power board. N Y

Check Q401 outputVoltage(12V)

Y

Check Q401 application circuitor replace Q401.

N



3. Analog RF Video

Check TU1001 Pin16(Video output)Can you see the normal signal?

Check the input(Pin1) of LPF(IC1000).Can you see the normal waveform?

YES

NO Could you measure voltage of TU1001 & IIC lines?Are they all normal?

Check the output(Pin8) of LPF(IC1000).Can you see the normal waveform?

Check the input(PinAN16) of BCM3563(IC101).Measure waveform at C626 because it’s more easy to check.Can you see the normal waveform?

NO You should check power line& IIC lines.

YES

You should replace TUNER.

NO After checking video signal line & the Power of LPF you should decideto replace item or not.

NOAfter checking the Power of LPF you should decide to replace LPF or not.

YES This board has big problem because Main chip(BCM3563) have some troubles.After checking thoroughly all path once again, You should decideto replace BCM3563 or not.

YES

YES

4. Digital RF

Check RF Cable

Check IIC SignalTU1001 #7, 8 Pin

Check IIC line and level shifter circuit.

Check LGDT3304 OutputClock(R1052), Data(R1049),

Sync(R1048)

Y

Y

N

Check Tuner 5V PowerIC801

Replace IC801.

Y

N

Y

Maybe LGDT3304(IC1001) hasproblems.

N

Check IC1202 power andapplication circuit

Check IF SignalTU1001 #10, 11 Pin

Check tuner application circuit orreplace tuner.

N

Y

Replace IC1201 or X1200.N

Check IC902 digital output signal. Check IC902 application circuit orreplace IC902.

N

Y

Replace IC101

Y



5. AV Video

Check JK702, JK703.Can you see the normal waveform?

NO

JK702,JK703 may have problem. Replace this Jack.

Check the input (Pin AN17,AM19) of BCM3563(IC101).Measure waveform at C623,C624 because it’s more easyto check. Can you see the normal waveform?

YES This board has big problem because Main chip(BCM3563) have some troubles.After checking thoroughly all path once again, You should decide to replaceBCM3563 or not.

YES

6. Component Video

Check JK701.Can you see the normal waveform? JK701 may have problem. Replace this Jack.

Check the input (Pin AL21,AM21,AN21) of BCM3563(IC101).Measure waveform at C616,C617,C618because it’s more easy to check.Can you see the normal waveform?

This board has big problem because Main chip(BCM3563) have some troubles.After checking thoroughly all path once again, You should decide to replaceBCM3563 or not.

YES

YES

NO

7. RGB-PC Video

Check JK700.Can you see the normal waveform?

YES

JK700 may have problem. Replace this Jack.


YES

NO

Check the input (Pin AK16,AN15,AM15,AH16,AJ16)of BCM3563(IC101).Measure waveform at C613,C614,C615 and R755,R759because it’s more easy to check.Can you see the normal waveform?

8. HDMI Video

Check input connect JK600,JK601Can you see the normal waveform?

Check DDC communication lines(IC601, IC602)

Check the output of PI3HDMI341ART(IC603, IC604). Can you see the normal waveform?

After checking the Power of this chip, you should decide to replace this or not.

Check HDCP communication lines(IC100) After checking the Power of this chip, you should decide to replace this or not.

YES

YES

YES

NO

NO

YES This board has big problem because Main chip(BCM3563) have some troubles.After checking thoroughly all path once again,You should decide to replace BCM355x or not.

JK600,JK601 may have problem. Replace this Jack.NO



9. Analog RF Audio

Check TU1001 Pin14(SIF)Can you see the normal signal?

Check the input (Pin AN23) of BCM3563((IC101).Measure waveform at C636 because it’s more easy to check.Can you see the normal waveform?

YES

NO Could you measure voltage of TU1001 & IIC lines?Are they all normal?

NO You should check power line & IIC lines.

YES

You should replace TUNER.

NOAfter checking audio signal line, you should decide to replace item or not.

10. AV/ Component/ RGB-PC Audio(in)

Check JK702, JK703, JK701, JK700.Can you see the normal waveform?

NOJK702, JK703, JK701, JK700 may have problem. Replace this Jack.

Check the input (Pin 21,22,11,12,7,8,9,10) of CS5345(IC500).Can you see the normal waveform?

NO

YES

After checking audio signal line, you should decide to replace item or not.

YES

Check the Output (Pin 41,42,43) of CS5345(IC500).Can you see the normal waveform?

NO After checking the Power & MLCK & reset of this chip,you should decide to replace this or not.

YES

Check the input (Pin AH24,AJ24,AK24) of BCM3563((IC101).Measure waveform at R511,R512,R525because it’s more easy to check.Can you see the normal waveform?

NOAfter checking audio signal line, you should decide to replace item or not.

11.HDMI Audio(in)

Check input connect JK600,JK601.Can you see the normal waveform?

Check DDC communication lines.(IC601, IC602)

JK600,JK601 may have problem. Replace this Jack.

Check the output of PI3HDMI341ATR(IC603, IC604). Can you see the normal waveform?

After checking the Power of this chip, you should decide to replace this or not.

Check HDCP communication lines(IC100). After checking the Power of this chip, you should decide to replace this or not.

YES

YES

YES

NO

NO

NO

NO After checking the Power & Select Pin & Etc of this chip, you should decide to replace this or not.



12. Audio out

Check the output (Pin AK25,AL25,AJ25) of BCM3563(IC101).Measure waveform at R669,R670,R671 because it's more easy to check.Can you see the normal signal?

Check the input (Pin 17,18,19) of NTP3000((IC501).Can you see the normal waveform?

YES

NO

NO

This board has big problem because Main chip(BCM3563) have some troubles.After checking thoroughly all path once again, You should decide to replace BCM3563 or not.


YES

Check the output (Pin 30,31,36,37,47,48,53,54) of NTP3000((IC501).Can you see the normal waveform?

NO

YES

After checking the Power & I2C & Reset of this chip, you should decide to replace this or not.

Check the speaker output wafer P500.Can you see the normal waveform?

NO

YES


Check the connector & Speaker

13. SPDIF Audio

Check the output (Pin AP11) of BCM3563(IC101).Measure waveform at R680 because it’s more easy to check.Can you see the normal signal?

Check the input of J500.Can you see the normal waveform?

YES

NO

NO



YES

After checking the Jack, you should decide to replace item or not.



TU

NE

R(T

DV

H-H

15

1P

)

VS

B/Q

AM

De

mo

d.IF

_N/P

SIF

IF_A

GC

TU

NE

R C

VB

S

DD

R 1

Co

nrt

oll

er

Up

to

25

6M

B

SIF

DD

R1

(32

M X

16

)X

4 =

25

6M

B

DD

R1

(8M

X 1

6)

X 2

= 3

2M

B

DD

R 1

Co

nrt

oll

er

Up

to

12

8M

B

I2C

_M0

(5

V)

SID

E_A

V /

SID

E_A

V_D

ET

RE

AR

_AV

CO

MP

RG

B EE

PR

OM

M_D

DC

H/V

SY

NC

EE

PR

OM

EE

PR

OM

TM

DS

/DD

C(5

v)H

DM

I R

X0

CE

C0

HD

MI_

0/D

DC

0(3

.3v)

HD

MI

RX

1

HP

D_0

,PW

R_0

GP

IO

TU

NE

R C

VB

S

LV

DS

WX

GA

LV

DS

FH

D

LV

DS

_0

LV

DS

_1

BC

M7

41

2

FL

AS

H(3

2M

B)

ET

HE

RN

ET

(RT

L8

10

0C

L)

EB

I/P

CI

/SY

S_R

ES

ET

SY

S_R

ES

ET

/SY

S_R

ES

ET

CL

K B

UF

.P

CI_

CL

K_O

UT

PC

I_C

LK

_IN

DDR1(8MX16)X2=32MB

PR

OiD

IOM

SY

S_R

ES

ET

CP

LDHD

_DV

I(1

2b

)

HS

X

PK

TS

eri

al T

P

Dig

ita

l In

pu

t

HD

_DV

I(2

4b

)

PT

C

UA

RT

[0-

2]

UA

RT

1

UA

RT

0R

S-2

32

I2C

_M1

(5

V)

I2C

_M1

AU

DIO

AD

C

MC

LK

I2S

AM

PI2

S

SP

DIF

MN

T O

UT

AM

P

VS

B(L

GD

T3

30

4)

TU

NE

R(T

DV

F-H

07

1P

)IF

_N/P

BC

M3

56

3

BLOCK DIAGRAM1. Main



MP

EG

4B

CM

7412

TU

NE

R

BC

M35

63T

EA

6420

S/W

MC

3307

8O

P-A

MP

CS

5340

AD

C

TP

A60

11

Rea

r_A

V

Sid

e_A

V

Com

p

RG

B

NT

P30

00

CS

5345

-AD

C

SIF

IF_N

/ IF

_P

BU

FH

DM

IT

MD

S_R

XC

_BC

M

TE

A64

20_L

_OU

TT

EA

6420

_R_O

UT

MC

3307

8_L_

OU

TM

C33

078_

R_O

UT

CS

5340

_I2S

_DA

TA

_OU

TC

S53

40_I

2S_S

CLK

_OU

TC

S53

40_I

2S_L

RC

LK_O

UT

TP

BC

M_L

_OU

T1

BC

M_R

_OU

T1

BC

M_L

_OU

TB

CM

_R_O

UT

BC

M_L

_OU

T2

BC

M_R

_OU

T2

MN

T_L

_OU

TM

NT

_R_O

UT

SP

EA

K_O

UT

_L-

SP

EA

K_O

UT

_L+

BU

F

MU

TE

2A

udio

_MN

T_M

UT

EM

UT

E2

Aud

io_M

NT

_MU

TE

MU

TE

1A

udio

_AM

P_M

UT

E

BC

M35

53_I

2S_D

AT

A_O

UT

BC

M35

53_I

2S_S

CLK

_OU

TB

CM

3553

_I2S

_LR

CLK

_OU

T

BC

M35

53_A

UD

_MC

LK

BC

M35

53_A

UD

_MC

LK

BC

M35

53_S

PD

IF_O

UT

2. AUDIO



LD11

17D

T18

TR

LCD

MO

DU

LE

P_1

2V

P_1

6V

RT

L810

0(E

ther

net C

trl)

2.5V

3.3V

EP

M24

0F10

0(C

PLD

)3.

3V

MC

9S12

E12

8(P

TC

)5V

AS

M3P

623S

(CLK

_Gen

)3.

3V

5VT

DV

F-H

071P

(Tun

er)

SI4

925D

Y(P

ower

FE

T)

DC

/DC

CO

NS

C45

19(3

A)

DC

/DC

CO

NS

C45

19(3

A)

NT

P30

00(A

udio

Am

p)

1.8V

3.3V

16.5

V

TP

S20

52(P

ower

Dis

trib

utio

n S

/W)

5V

ST

_5V

5V

1.2V 1.2V

2.6V

2.6V

3.3V

1.8V

12V

ICL3

232

IC40

2(R

S-2

32C

)5V

SI4

925D

Y(P

ower

FE

T)

16.5

V

ST

_5V

Sw

itchi

ngF

ET

DC

/DC

Con

vert

er

Reg

ulat

or

CS

5345

(Aud

io A

DC

)3.

3V

5V

(1.5

A)

(410

mA

)

(1.7

5A)

(1.0

8A)

DC

/DC

CO

NM

P23

05

5V

(100

0mA

)

(700

mA

)

(500

mA

)

(135

mA

)

SC

1565

15M

(300

mA

)

(183

5mA

)

(1.0

14A

)

(546

mA

)

(337

mA

)

(277

mA

)

(MA

X20

mA

)

(500

mA

)

(306

6mA

)

Mai

n_P

WR

_ON

Mai

n_P

WR

_ON

Mai

n_P

WR

_ON

MP

I(1

2V/1

A)

SI4

925D

Y(P

ower

FE

T)

TD

VH

-H15

1P(T

uner

)5V

Mod

ule_

PW

R_O

N

TP

A60

11(E

xt_S

PK

_Am

p)5V

DC

/DC

CO

NLT

3479

DC

_DC

_EN

BC

M_P

WR

_ON

Sta

ndby

DC

/DC

CO

NS

C45

19(3

A)

DC

/DC

CO

NS

C45

19(3

A)

(52m

A :

W/O

EX

T S

PK

)

(730

mA

)

(483

mA

)

(2.0

2A)

(1.7

A)

(486

mA

)

(462

mA

)

(500

mA

)

BC

M35

631.

2V

2.6V

3.3V

EP

1C12

F25

6(P

ro:id

iom

)3.

3V

BC

M74

121.

2V

2.6V

3.3V

3.3V

LGD

T33

04(V

SB

)1.

2V

3.3V

3.3V

S29

GL2

56(F

LAS

H)

3.3V

SY

S_

RE

SE

T

RE

SE

T_

AU

DIO

SY

S_

RE

SE

Tb

3.3V

_RE

SE

T

(720

mA

)(2

.52W

)(3

.56W

)

(1.1

1A)

(4.4

8W)

(5.4

8W)

(0.9

1W)

(1.1

4W)

(230

mA

)

3. POWER



BC

M35

63S

GP

IO0

: AD

29S

GP

IO1

: AD

30

SG

PIO

2 : A

E31

SG

PIO

3 : A

E32

SG

PIO

4 : A

D6

SG

PIO

5 : A

D5

SG

PIO

6 : A

E4

SG

PIO

7 : A

E3

LGD

T33

04IC

1001

TD

VH

-15

1PT

U10

00

CS

5345

IC50

0P

ro:id

iom

IC12

02N

TP

3000

IC50

1

EE

PR

OM

HD

MI H

DC

PIC

100

EE

PR

OM

NV

RA

MIC

103

SC

L0_5

VS

DA

0_5V

I2C

RP

T_S

CL_

3304

_5V

I2C

RP

T_S

DA

_330

4_5V

SC

L1_5

VS

DA

1_5V

SC

L2_3

.3V

SD

A2_

3.3V

SC

L3_3

.3V

SD

A3_

3.3V

M31

M32

BS

C_S

_SC

LB

SC

_S_S

DA

Brig

ht S

enso

r

AL1

AK

4D

DC

0_S

CL_

BC

MD

DC

0_S

DA

_BC

ME

EP

RO

MH

DM

I JA

CK

EE

PR

OM

HD

MI J

AC

K

SC

L_H

DM

I_1

SD

A_H

DM

I_1

SC

L_H

DM

I_0

SD

A_H

DM

I_0

PT

CIC

1301

EE

PR

OM

NV

RA

MIC

1300

0X97

0X54

R

5V

R

TD

VF

-H

071P

TU

1001

L/S

5V_T

UN

ER

I2C

RP

T_S

CL_

3304

I2C

RP

T_S

DA

_330

4

R

R

D3.

3V_3

304

RR

R

5V_T

UN

ER

R

5V

R

R

D3.

3V

RR

R

D3.

3V

RR

R

R

5V

HD

MI S

/WIC

603

RR

R

5V HD

MI_

PO

WE

R_0

_GP

IO

RR R

RR

R

5V HD

MI_

PO

WE

R_1

_GP

IO

R

R

ST

_5V

R

5V

1.5K4.7K

4.7K

4.7K

4.7K

4.7K

22Ω

22Ω

22Ω

22Ω

22Ω

22Ω

22Ω

22Ω

0Ω

0Ω

0Ω 0Ω

4.7K

4.7K

10K

100Ω

100Ω

100Ω

4.7K

4.7K

10Ω

10Ω

4.7K

R

4. IIC



BC

M3

56

3

PT

C

RX

D0-

41

TX

D0-

42

RX

D0-

43

TX

D0-

44

RX

D1-

M2

8T

XD

1-M

29

TX

D0-

AE

32

RX

D0-

AF

33

FO

R M

PI

PT

C_D

EB

UG

_RX

PT

C_D

EB

UG

_TX

12

R1

OU

T1

3R

1IN

11

T1

IN1

4T

1O

UT

FO

R I

nit

ial D

ow

nlo

ad

PT

C_R

X_5

V

PT

C_T

X

PT

C_T

X_B

CM

BC

M_R

X

BC

M_T

X

PT

C_R

X_M

NT

PT

C_T

X_M

NT

BC

M3

56

3

PT

C

RX

D0-

41

TX

D0-

42

RX

D0-

43

TX

D0-

44

RX

D1-

M2

8T

XD

1-M

29

TX

D0-

AE

32

RX

D0-

AF

33

FO

R M

PI

PT

C_D

EB

UG

_RX

PT

C_D

EB

UG

_TX

12

R1

OU

T1

3R

1IN

11

T1

IN1

4T

1O

UT

FO

R I

nit

ial D

ow

nlo

ad

PT

C_R

X_5

V

PT

C_T

X

PT

C_T

X_B

CM

BC

M_R

X

BC

M_T

X

PT

C_R

X_M

NT

PT

C_T

X_M

NT

FO

RB

CM

De

bu

gin

ga

nd

P

TC

Do

wn

loa

d /

De

bu

gg

ing

an

dM

on

ito

rin

g

Do

wn

loa

d/d

eb

ug

gin

g

Co

mm

un

ica

tio

n

PT

C_R

X_B

CM

_3.3

V

bu

ffe

r

bu

ffe

r

UA

RT

_SW

A

FO

RB

CM

De

bu

gin

ga

nd

P

TC

Do

wn

loa

d /

De

bu

gg

ing

an

dM

on

ito

rin

g

Do

wn

loa

d/d

eb

ug

gin

g

Co

mm

un

ica

tio

n

PT

C_R

X_B

CM

_3.3

V

bu

ffe

r

bu

ffe

r

UA

RT

_SW

A

Co

mm

un

ica

tio

n

De

bu

gg

ing

TX

D2-

3R

XD

2-2

MO

DC

/TA

GH

I/B

KG

D

Co

mm

un

ica

tio

n

De

bu

gg

ing

TX

D2-

3R

XD

2-2

MO

DC

/TA

GH

I/B

KG

D

DC

10

10

01 01

DC

10

10

01 01

Le

vel

sh

ifte

r

op

tP

C_S

IMU

L

PT

C_T

X_1 P

TC

_RX

_BC

M_5

V

UA

RT

_SW

A

UA

RT

_SW

B

UART_SWB

5. UART

- 25 -Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes


804

805

802

803

801

806 55

0

821

822

521

540

530

820

400

900

300

200 12

2

120

121

500

510

91057

0

800

A2

A10

A9

LV1

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

Nov., 2008Printed in KoreaP/NO : MFL49487201

42lg70 service

Documents

special safety parts

exposedmetallic parts

mechanical parts

high temperature parts

ac plug prongs

ac source

fusible resistor

cominternal use