4ff: the next generation uicc

4FF: The next generation UICC Source: Research In Motion UK Limited

Submission Date: March 26, 2012

Document Number: SCP(12)000070

ETSI SCP Plenary #54 | Sophia Antipolis, France | March 29-30, 2012

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Apple

SCP(12)000007 Motorola, Nokia, RIM

SCP(12)000008

Two 4FF Candidates

SCP #54 Sophia Antipolis | March 29-30, 2012

The joint 4FF proposal

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This 4FF proposal is a compromise that enables new features (pick-

out, retention feature, single header row, physically significant

orientation mark) while maintaining existing manufacturing

processes.

Assembly of the joint 4FF proposal

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Milled out or plastic molded cavity

Module drop-in


Multiple Form Factor Card Distribution

• ID-1 + Plug-in + Mini-UICC punch out cards have caused terminal returns by causing PIN stubbing (See C6-100233).

• In the Apple proposal, based on thickness requirements, a Triple Punch-out is feasible which would continue this card distribution trend.

• No UICC vendors would confirm at SCP TEC that they would not manufacture such cards.

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• RIM considers all double or triple punch out cards non-compliant to the ETSI and ISO specifications due to the punch out gaps.

Predicted Result • Reader size and cost will increase in order to safely

accommodate the non-standardized gaps introduced by these cards.

Use of Adaptors

Situation: User has a phone which uses the Apple proposed 4FF, changes to a new phone which uses Plug-in or Mini-UICC and inserts the Apple proposed 4FF UICC using an adaptor.

Known Issues • Adaptors with a UICC inserted have always proven to be thicker and out of spec.

• Adaptors don’t hold the SIM card securely enough (contact bounce).

• Adaptors can cause reader pin stubbing when being inserted or removed.

Predicted Result • Increased device returns where the root cause is determined to be users

changing to a device compatible with a larger form factor SIM Card.

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Tray-style reader lock-in • Large majority of devices using 3FF readers incorporate a tray or drawer as part of

their design. This is because the small size makes the card difficult to manipulate with precision.

• The Apple proposal does not showcase any usability improvements over the previous form factors to enable a variety of reader implementations.

• Lacks a pick-out feature such as the extra plastic that users pull on 2FF or the fingernail slot provided in the RIM/Nokia/Motorola 4FF proposal.

• The retention feature in the RIM/Nokia Motorola proposal enables push-push readers and increases reliability of small parts with generous tolerances.

• The 3x2 pad of the Apple’s proposal has the exact same footprint as the 3x2 pad in a 6 pin 2FF or 3FF reader.

Predicted Result • Apple’s proposal will lock reader design down to the costly drawer or tray-style

reader for the whole industry.

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Terminal Miniaturization

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C4/C8 staggering feature.

Estimated minimum logical board reader footprint for an 8 pin USB capable card (red)

Estimated minimum logical board reader footprint for a 6 pin card (blue)

Apple RIM, Nokia, Motorola


• The joint proposal brings real miniaturization to terminal vendors.

• The joint proposal enables the use of a single row header-style reader. This reader design significantly reduces the footprint on the logical board compared to the status quo footprint proposed by Apple.

• While both proposals require an additional row of pins to support USB, the RIM/Nokia/Motorola proposal has an efficient staggered pin layout to enable an efficient reader design

Advantages of the joint RIM/Nokia/Motorola Solution

• The RIM/Nokia/Motorola solution would provide for rapid market adoption and transition from the 2FF/3FF to the 4FF.

• RIM’s solution allows for a wide variety of UICC reader solutions including the least expensive header and block style reader designs as indicated in SCPTEC(11)0175.

• The RIM/Nokia/Motorola solution is designed to maintain the current UICC manufacturing processes and keep down costs for both the terminal and card vendors.

• Allows the module “drop-in” and “glue-on” manufacturing process currently in use by all UICC vendors.

• The RIM/Nokia/Motorola solution adds usability features to the UICC. The Apple proposal adds cost and risk to the terminal.

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Annex: Current proposals

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Apple 4FF Proposal JAMMING

• No feature to aid in

removing card from reader

SIM BOUNCE

• No retention feature to prevent card

from shifting when under impact or

vibration

SAME READER FOOTPRINT

• Reader contact pad footprint

the same as 2FF or 3FF ones

with six-contacts

DEVICE RETURNS

• Quasi-compatibility with 2FF

and 3FF lead to problems –

cutters, adaptors, etc…

REQUIRES TOOLS

• Push-push and push-

pull readers not feasible.

• Will require a drawer-

style reader (with tool) to

be usable.

CARD THICKNESS

• Combined with 6 pin

compatibility enables

problematic adaptors


ORIENTATION CORNER

• The dimension of the chamfer

corner is less than the

dimension of the contacts. Only

prevents incorrect insertion in a

drawer-style reader

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Pick-out feature allows easy removal

without tools or drawers Pick-out feature easily

implemented using existing

stamping or milling processes

Retention feature

prevents card from

bouncing due to impact

or vibration

Retention feature:

• enables push-push reader

• removes need for locking door

Contacts in a single row enabling

header-style reader

• significantly shrinks PCB footprint

• optimal staggered placement of

optional USB contacts

RIM/Nokia/Motorola 4FF Proposal

Chip and module drop in allows

reuse of existing manufacturing

processes

Key-cut front corner

• physically prevents incorrect insertion


4ff: the next generation uicc

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