8 - maxim integrated · validate performance with sc2200 evb on target pa x ensure that power...

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Validate

Performance with

SC2200 EVB on

target PA

· Ensure that power levels are

correct (RFIN, RFINDLY, RFFB,

RFOUT and coefficient levels)

using the GUI.

Refer to

“SC2200

Release Notes”

Integrate SC2200

in prototype, PVT

system validation

This document,

“SC2200 Release Notes”, SPI Programming Guide

· Select/place critical RF

components(Couplers,

Attenuators, Pre-Amplifier), Ensure

that power levels are correct over

PVT (RFIN, RFINDLY, RFFB,

RFOUT and coefficient levels)

using the GUI.· Place power supplies, decoupling

and select regulators.

· Select/place the clock reference

circuit (crystal or external clock).

· Place non critical signals (digital

control signals…).

Qualification, field

trial...

Down

converters and

ADC’s

Digital Signal

Processor

Datapath A

RFSP

PA

RFINA

RFOUTA

To RxCORR

Monitor Path

Datapath B

RFSP

PA

RFINB

RFOUTB

RFFBB

To RxCORR

ANTA

ANTB

SC2200

RFFBA

d

+

+

PDET

PDET

RFINDLYA

RFINDLYB

d

Att.

Att.

PA Driver

PA Driver

SC2200 Reference Design

XTALI

RFINA

RFINB

EXTCLK

SP

I

INT

RN

XTALO

MS

0

MS

1

RE

SE

TN

DV

DD

IO,

DV

DD

18

,

AV

DD

18

5V

Regulator

RF delay is

optional

RF delay is

optional

Host

NC

5dB

Coupler

5dB

coupler

Optional

Crystal

1.8V

Pre-amp

Pre-amp

-5dB

-2dB

-5dB

-2dB

Att

Attenuation

Att

Attenuation

·

o

o

o

·

o

o

o

RFINARFOUTARFAUXA

RFFBA

RFFBB

RFAUXB RFOUTB RFINB

Crystal (Optional)

SC2200 IC

With Delay Line

section

No Delay line

section

3ns RF Delay Lines

Down

converters and

ADC’s

Digital

processor

Datapath A

RFSP

PA

RFINA

RFOUTA

To RxCORR

Monitor Path

ANTASC2200

RFFBA

+

PDET

RFINDLYA

Att.

PA Driver

-2dB

Datapath B

-5dB

+10dB typ.

RF

delay

-5dB@

2700MHz

5dB

coupler

39Ω To PA input

197Ω

From RFPAL RFOUT output

NTC pi - attenuator

197Ω

R_NTC

Figure 5: NTC Attenuator

·

·

nd

·

FILTCFILT

RF FILT FILT

Transmitter

wanted

signal (fRF)

RFOUT

signal

power

Transmitter

noise and

residual IM +

SC2200 noise

(fNOISE)

SC2200 LO

leakage (fLO)SC2200 VCO

leakage (fVCO)

SC2200 digital

noise and

external power

supply leakage

(fLF)

Frequency

1

LF

LO RF

NOISE RF

Noise

RF VCO

RF

RF

RF

MIN MAX

LO MIN MAX

VCO

RFOUT

signal

powerSC2200 LO

leakage (fLO)

SC2200 VCO

leakage (fVCO)

Frequency

Scanning

spurs

fMIN fMAX

MIN MAX

MIN MAX

LO

VCO

RF

RF

RF

5.1.1. SMT Component Size Selection

1 Measured at RFOUT output

FR406 – 14 +/- 1mil

FR4-Pre-Preg

FR406 – 14 +/- 1mil

62 +/- 10%

Layer1

Layer2

Layer4

Layer3

Figure 10: PCB Fabrication Layer Stack

5.2.1. Layer 1: RF and Signals

5.2.2. Layer 2: Ground Plane

·

·

·

·

·

·

·

·

(a)

(b)

(c)

(d)

(a) Poor: trace cuts ground plane and prevents direct returns(b) Better: Perimeter trace avoids cutting ground plane. Best solution is not signal trace in ground plane(c) Poor: slot cuts ground plane and prevents direct returns(d) Better: via string maintains ground plane continuity

5.2.3. Layer 3: Power Supply Plane

VDD18 Power Plane

(1.8V)

DVDDIO Power plane

GND Via Array under

SC2200

5.2.4. Layer 4: Ground Plane and signals

SC2200Solder

PCB

Via

Case temperature

measurement point

Heat transfer

· JC

·

·

·

·

·

·

· PKPK

· PKPK

· PKPK

·

·

·

·

Ω

·

·

PKPK

PKPK Ω Ω PKPK PKPK

OUT

R2XTALI

XTALO (do not connect)

R1

R2

81 GND paddle

SC2200 C1Zout

EXTCLK

Clock buffer

µ

·

·

·

·

Ω

o MAX SPI SPI

o SPI MAX

MAX

o MAX

DVDDIO

MS1MS0 SSDI

SSCLKINTRN

SSSN0

SSDORESETN

1 23 45 67 89 10

11 12

13 1415 16

J112

LOAD

LOAD

HOST

SCLKSDISDOSSN0

10k

DVDDIO

SSN1SSN2CLOAD

SC2200

SSCLKSSDI

SSDOSSSN

SC2200

SSCLKSSDI

SSDOSSSN

SC2200

SSCLKSSDI

SSDOSSSN

Optional buffer(a)

0 Ω

SCLK

SDI

SDO

SSSN

0 Ω (unloaded)

0 Ω

12 pin connector recommended for debug with Scintera GUI

...

·

Page 26 of 29

PK-PK

PP

Page 27 of 29

Page 28 of 29

Ω

Ω

Page 29 of 29

Ω

Ω

Ω

Ω

This document contains confidential information proprietary to Maxim Integrated Products, Inc., and is provided under a non-disclosure agreement. Unauthorized copying or distribution is prohibited. Maxim Integrated and Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. All other trademarks are the property of their respective owners. No circuit patent licenses are implied. Maxim Integrated Products, Inc. reserves the right to change its product specifications at any time. © 2016, Maxim Integrated Products, Inc. All Rights Reserved.