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A First-Principles Approach to Opto- Electronic Link Optimization Krishna Settaluri, Prof. Vladimir Stojanovic E3S Seminar Nov 17, 2016 For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or Confidential Information.

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  • A First-Principles Approach to Opto-Electronic Link Optimization

    Krishna Settaluri, Prof. Vladimir Stojanovic

    E3S Seminar

    Nov 17, 2016

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or Confidential Information.

  • Outline

    • Motivation and importance of optical link communication

    • Introduce end-to-end optical link model for optimization• Fundamental theory-based analysis

    • Optimization results

    • Schematic-level results

    • Next generation performance limits

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or Confidential Information.

  • The Wire Problem

    Channel Loss =

    Power for fixed data rateFor Internal E3S Use Only. These Slides May Contain Prepublication Data and/or Confidential Information.

  • The Need for High Bandwidth Links In Data Centers

    Microsoft

    Facebook

    Oracle

    Increasing demand for high throughput links Contributors

    High Performance Computing 5G Mobile Market

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Silicon Photonics

    Luxtera OracleST

    Tight integration of photonics + CMOS shows promise for next generation optical interconnects Utilize existing CMOS process nodes for production Small interconnect capacitance

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Photonic componentsMicroring ModulatorPhotodiode

    Waveguides Grating Couplers

    Low loss on-chip waveguides ~2dB/cm loss

    Hochberg

    Couple light from off-chip to on-chip Edge couplers promise sub 1dB/coupler loss

    Wavelength (nm)1295.6 1295.8 1296 1296.2 1296.4 1296.6 1296.8

    Tra

    nsm

    iss

    ion

    (d

    B)

    -16

    -14

    -12

    -10

    -8

    -6

    -4

    -2

    0

    DataModel

    High optical bandwidth (~40GHz) allows fast ON/OFF modulation

    High Responsivity ~ 0.8A/W Ge PD show high BW (120GHz) [Vivien]

    Intel

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Opportunity for photonic link optimization

    What’s preventing better link performance?What are the fundamental limits to the best-case performance for a given data rate?

    Can we arrive in the vicinity of this global optimum quickly?

    Photonic microdevice design

    Macro-System Performance

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Photonic Link

    Electrical Digital

    Driver Photodiode

    Electrical Data

    E/O Conversion

    O/E Conversion

    Electrical Data

    Channel

    TX Macro RX Macro

    Optical Modulator

    TX Macro

    I/V Conversion

    Gain Stage

    RX MacroOptical Fiber

    Idealized

    Realistic

    Digital In Digital Out

    Digital In Digital OutFor Internal E3S Use Only. These Slides May Contain Prepublication Data and/or Confidential Information.

  • Optical Link Model

    Current to Voltage Conversion

    Transimpedance Amp (TIA)

    Voltage Amplification

    Rail-to-RailOutput Swing

    Digital Input

    Digital Output

    1. Truly End-to-End — From Digital to Digital2. Differs from previous link optimization literature

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Importance of Link Optimization

    • Energy split between TX and RX dictate best link E/B• Extreme 1: All energy in TX, none in RX• Extreme 2: All energy in RX, none in TX

    • Global optima somewhere in the middle and heavily data rate dependent

    • Noise and swing affect link performanceFor Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Optimization Approach

    RX Macro

    N

    Transimpedance Amplifier (TIA) Voltage Amplifiers StrongArm Sense Amplifiers

    All stages defined by input FET width, which defines gm, Cox, and Id

    RFB, N, and M also optimization parameters

    M

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Optimization FlowData Rate + Technology

    Per Stage Bandwidth

    Parameterized N, M, etc. Topology

    End-To-End Gain + Noise

    Input Sensitivity

    Link Energy/bit

    Per Stage Gain

    Best topology parameters for given data rate

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or Confidential Information.

  • Block-Level BW Requirement

    fs fs fs

    BW Requirement(0.7*fData)

    Minimum required per-stage bandwidth

    *Stage Count, N, Dependent

    fs – per stage BWfdata – is the data rate

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Prerequisite Technology-Dependent Factors

    Load amplifier with replica of itself

    fa is technology and topology dependent:Common-Source — fa = 0.36*fT for 65nm CMOS (Miller Effect)

    Cascode — fa = 0.4*fT for 65nm CMOS (no Miller Cap)

    β is technology and topology dependent:Common-Source — β=0.29 for 65nm CMOS (Miller Effect)

    Cascode — β=0.4 for 65nm CMOS (no Miller Cap)

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Analog Front-End Chain

    fs fs fs

    GBW of a stage can now be written in terms of technology metrics and width of input FET:

    DC Gain (BW = fs):

    Optimization parameters

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • TIA Analysis

    IPD

    Vo

    Gain

    Bandwidth

    A is inverter gain, gmro

    Back calculate RFB requirement from per stage Bandwidth

    IPD

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • StrongArm Sense AmplifierReset FETs Reset FETsLatching FETs

    Integration Phase

    Regeneration Phase

    Latching Phase

    Sample the input and integrate difference on output cap

    Cross-coupled inverters activate and regenerate output to rail-to-rail

    Fixed time after regeneration to latch data

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • StrongArm Sense Amplifier #2

    CP CQ

    CXCY

    Integration PhaseDischarge CP,Q first then CX,Y

    Integration Gain (Vint,final / Vin, diff)

    Regeneration Time Constant

    Total Sampler GainRegeneration Time

    (1)

    (2)

    (1) (2)

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Putting it all together…Swing Sensitivity

    RX Macro

    N

    TransimpedanceAmplifier (TIA) Voltage Amplifiers StrongArm Sense Amplifiers

    Rtot GSA

    Input Sensitivity to Overcome Swing

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Noise Sensitivity

    Major Noise Sources1. TIA Resistor Noise2. TIA Transistor Noise3. AFE Transistor Noise4. Sampler Noise

    Input referred resistor noise

    Input referred TIA FET noise

    Input referred AFE noise

    Sampler Voltage Noise(approximation from Nuzzo’s work)

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Total Rx Sensitivity

    Total Link Energy Per Bit:

    Path inefficiencies(couplers, laser efficiency, modulator loss)

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Link Parameters and Optimization Variables

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Simulation Results –Restrict # of samplers to 1 (M=1)

    65nm Heterogeneous Integration Platform

    • 10% wall plug efficiency

    • 3.5dB/coupler loss

    • 0.8A/W responsivity

    • 5dB Modulator IL

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Simulation Results –Unrestricted # of samplers

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Simulation-Inspired Points and Circuits

    FET sizings and bias currents outputted from simulationSchematic design based on these sizings/biasing

    Minimal size adjusting for proper DC operating points

    5Gbps RX

    5Gbps RX w/ CTLE

    25Gbps DDR/QDR

    25Gbps QDR w/ Switching

    65nm Heterogeneously Integrated CMOS

    Low Data Rate Regime

    High Data Rate Regime

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • 5Gbps RX

    Double Data Rate Receiver Pseudo—Differential Architecture Single Gain Stage proceeding TIA

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • 5Gbps Results

    As expected, front-end noise sensitivity dominates

    Noise Sensitivity Breakdown

    RFBTIA FET

    Other

    50% of total noise from RFBFor Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • How to reduce RFB noise contribution?

    Noise from RFB inversely proportional to RFB But increasing RFB reduces BW

    Solution: Keep RFB large, while retaining BW with CTLE

    TIA BandwidthNoise

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • 5 Gbps Rx With CTLE

    TIA

    CTLEIncrease RFB and compensate with

    follow-on zero

    zero

    Result: Large RFB and High Bandwidth

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • 5Gbps Rx With CTLE Results

    Swing and Noise Sensitivities are Comparable

    RFB contribution lowered

    RFB

    TIA FET

    Other

    Noise Sensitivity Breakdown

    15% of total noise from RFBFor Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • 25 Gbps DDR/QDR

    High Data Rate RegimeM = 2 for DDRM = 4 for QDR

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • 25Gbps DDR/QDR Results

    Going from M=2 to M=4 increases sampler gain exponentially.

    Sampler swing requirement more than order of magnitude smaller.

    Rx Power Constant; Tx Power Drastically ReducedFor Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • 25Gbps QDR w/ Switching

    Alleviate swing requirement by loading 1 sampler

    Imperfect junction caps not taken into account — accurate assumption for reasonable # of samplers

    Reduce Load Capacitance Increase AFE Gain

    Reduce Sampler Noise

    AFE “sees” loading from 1 sampler only

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • 25Gbps QDR w/ Switching Results

    Sampler noise contribution decreases

    Overall sensitivity improved

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Future Technology Performance?

    Current Platform

    Order of magnitude improvement with realistically better photonics

    Performance dominated by “weakest link” technology Improved photonics – CMOS dominant performance

    Best Photonics

    Wall plug efficiency: 10%Coupler Loss: 3.5dBPD Responsivity: 0.8 A/WModulator IL: 5dB

    Wall plug efficiency: 30%Coupler Loss: 1dBPD Responsivity: 0.8 A/WModulator IL: 3dB

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Future Technology Performance?

    Current Platform Best Photonics Best Photonics + CMOS

    Order of magnitude improvement with better CMOS

    Improved photonics + CMOS – power struggle Equal split in performance

    fT = 1THzfT = 150GHz

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Concluding remarks

    Introduced fundamentals-motivated analysis of optical links

    Validated analysis with schematic-level results

    Presented next-generation performance metrics and importance towards link performance

    Next step… Layout-automation and generation to provide realistic

    performance numbers

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.

  • Acknowledgments

    • Work done in collaboration with Chris Keraly, Eli Yablonovitch

    • Yue Lu and Prof Elad Alon for helpful discussions

    • teamVlada for helpful discussions

    • DARPA, E3S for funding and resources

    For Internal E3S Use Only. These Slides May Contain Prepublication Data and/or

    Confidential Information.