abb linpak 1700v 2x1000a power module · 2019-03-06 · linpak 1700v igbt module from abb with...
TRANSCRIPT
The market for power modules will have a7.6% compound annual growth rate(CAGR) from 2017 to 2023, reaching$5.5M in 2023. The power module marketplays a key role in several industrialapplications from electric and hybridelectric vehicles (EV/HEV) and motordrives, to megawatt (MW) solutions likeconverters for wind turbines, which havea standard power range from 100kW to8MW.
The power module packaging materialbusiness is worth $1.2B, which representsabout a third of the existing powermodule market. Yole Développementpredicts that this power modulepackaging material market will have aCAGR for 2017-2023 of 8.2%, approaching$2B in value by 2023.
Module packaging currently has severalcritical technical aspects, such as molding,high temperature die attach andconnection. It must combine goodthermal and electrical efficiency whilekeeping low mass and volume. Also, toremain competitive, power modulemakers must deliver high reliability whileremaining cost efficient.
In the second quarter of 2017, ABBpresented its new LinPak line that offersinnovative solutions for all powerconversion applications. It enables thedesign of converters with the lowestoverall inductance. Fast, low switchingloss chip-sets can therefore be used forthe first time in high-current applications.ABB’s LinPak modules’ low inductanceleads directly to their lowest switchinglosses and excellent robustness.
The 5SNG 1000X170300 is a uniqueLinPak 1700V IGBT module from ABB with
ultra-low inductance, configured in acompact design, phase-leg topology. Thismodule uses the latest ABB Soft PunchThrough (SPT++) silicon IGBT and diode.
System Plus Consulting analyses the 5SNG1000X170300 module and its cost indepth. Supported by a full teardown ofthe module’s components and housing,this report reveals the innovative assetsthat enable ABB to assemble its SPT++chipsets in the LinPak package.
This report provides insights into thestructure, technical choices, design,processes, and supply chain positions. Italso estimates manufacturing cost of allthe module’s components and analyses itsselling price. It also includes a detailedcomparison with the CAS300M17BM21700V SiC power module from Cree. Thiscomparison highlights differences in theelectrical parameters, dies, packaging andproduction costs.
COMPLETE TEARDOWN WITH
• Detailed optical and SEM photos
• Precise measurements
• Materials EDX analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
• Comparison with 1700V SiC power module from Cree
The unique LinPak 1700V power module from ABB for industrial applications hasan innovative, fast and rugged SPT++ chipset.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: ABB Module 5SNG 1000X170300
Pages: 140
Date: March 2019
Format: PDF & Excel file
Price: EUR 3,990
ABB LinPak 1700V 2x1000A Power Module
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
• Executive Summary and Market
• Reverse Costing Methodology and Glossary
Company Profile
• ABB Profile, ABB Module Portfolio
• Supply Chain
Physical Analysis
• Overview of the Physical Analysis, Physical Analysis Methodology
• Product Datasheet
• Package Analysis
• LinPak Technology by ABB
o Package view and dimensions, package opening, package cross-section
• Silicon IGBT Die
o IGBT die view and dimensions, IGBT die process and IGBT die cross-section
• Silicon Diode Die
o Diode die view and dimensions, diode die process and diode die cross-section
Manufacturing Process
• Die Process Flows and Fabrication Unit, Module BOM and Package Process Flow
• Final Test and Packaging Fabrication Unit
AUTHORS
Cost Analysis
• Overview of the Cost Analysis, Yield Explanations and Hypotheses
• IGBT Die
o IGBT front-end cost, IGBT wafer cost per process step
o IGBT die probe test and dicing, IGBT die cost
• Diode Die
o Diode front-end cost, diode wafer cost per process step
o Diode die probe test and dicing, diode die cost
• Packaging Cost
o PCB cost calculation, module BOM cost and package assembly cost
• Complete Module
o Final test cost, final module cost
Price Analysis
• Definition of Prices and Estimation of Module Selling Price
Comparison
• Comparison with Cree 1700V Power Module
ABB LINPAK 1700V 2x1000A POWER MODULE
RELATED REPORTS
Mitsubishi J1-Series 650V High-Power Modules for AutomotiveThe first power module with 7th-gen CSTBT IGBT and an innovative integrated substrate.October 2018 - EUR 4,990*
Automotive Power Module Packaging Comparison 2018A cost-oriented review of power module packaging technologies for the automotive market.July 2018 - EUR 4,490*
CREE 1700V SiCModuleA specific SiC epitaxy with a dual layers structure for a very low Rdson of 8mΩ.March 2015 - EUR 3,490*
Amine Allouche is part of System PlusConsulting’s Power Electronics andCompound Semiconductors team.Amine holds a Master’s degreefocused on Micro and Nano-technologies for integrated Systems.
Yvon Le Goff has joined System PlusConsulting in 2011, in order to setupthe laboratory of System PlusConsulting. He previously workedduring 25 years in Atmel NantesTechnological Analysis Laboratory asfab support in physical analysis.
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REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTABB LINPAK 1700V 2x1000A POWER MODULE
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