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    Procedia Engineering 25 (2011) 535 538

    1877-7058 2011 Published by Elsevier Ltd.

    doi:10.1016/j.proeng.2011.12.133

    Available online at www.sciencedirect.com

    Proc. Eurosensors XXV, September 4-7, 2011, Athens, Greece

    Magnetic accelerometer from polymer

    J. Li, W.K. Schomburg a*

    RWTH Aachen University, Konstruktion und Entwicklung von Mikrosystemen (KEmikro), Steinbachstrae 53 B, 52074 Aachen,

    Germany

    Abstract

    An acceleration sensor from polymer has been developed which balances a proof mass by magnetic forces. The sen-

    sor is fabricated from a polyimide membrane with conductor paths from gold patterned by photolithography and etch-

    ing, a frame manufactured by ultrasonic hot embossing, and permanent magnets fixed to the frame. All components

    are assembled on a planar substrate and then the frame is kinked forming the desired three-dimensional structure.

    2011 Published by Elsevier Ltd.

    Keywords: acceleration sensor; magnetic; ultrasonic hot embossing; polymer

    1.IntroductionUsually acceleration sensors are made of silicon. Either the deflection of a seismic mass against the

    elastic force of a bending beam is measured [1] or it is held in its idle position by a force balancing the

    acceleration [2]. The big advantage of employing silicon technology is that the mechanical element of the

    sensor can be integrated with the electronics required for amplification and analysis of the signal.

    Nowadays, however, there are emerging technologies allowing integrating electronics into polymer

    substrates [3, 4]. Therefore, it is interesting to investigate whether acceleration and other sensors can be

    fabricated from polymer as well. This could allow employing cheap polymer fabrication processes for

    sensor applications.

    Since polymers tend to creep and their properties are a strong function of temperature, a polymer beam

    appears to be no good elastic element in a sensor. However, if a seismic mass is balanced against the

    acceleration force, the characteristic curve of the sensor is no longer a function of the properties of the

    * Corresponding author. Tel.: +49-241-80-28444; fax: +49-241-80-22440.

    E-mail address: [email protected].

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    536 J. Li and W.K. Schomburg / Procedia Engineering 25 (2011) 535 538

    beam supporting the mass. Thus an acceleration sensor from polymer was designed with a seismic mass

    balanced by magnetic forces (Fig. 1).

    Fig. 1. Magnetic micro acceleration sensor from polymer. Fig. 2. Schematic view of the magnetic micro acceleration sensor.

    2.Sensor designFig. 2 shows the sensor schematically. A rigid frame from the polymer polyvinylidenefluoride (PVDF)

    carries 8 pairs of permanent magnets. Between the magnet pairs there is a polyimide (PI) foil with

    conductor paths from gold. The conductor paths form an electromagnetic coil in the field of the magnets.

    On the side of the foil opposite of the coil there is glued an aluminum plate stiffening the foil.

    Tongues on the left and the right of the foil are bent down and fixed at the substrate. Near the fixation

    point of the tongues there are strain gauges from gold which are combined to a Wheatstone bridge detect-

    ing the position of the seismic mass. A base and clampers from polymethylmethacrylate (PMMA) are

    used to fix the frame and provide electronic connection.

    When the sensor is accelerated, the tongues of the foil are bent. This deformation is detected by the

    strain gauges and the output signal from the bridge is controlling a feed back circuit driving the coil on

    the foil such that the foil is pulled back to its idle position. The driving voltage of the coil is a measure of

    the acceleration. The applied magnetic force is equal to the inertial force, thus this senor is a force balanc-

    ed acceleration sensor.

    The characteristic curve is not a function of the properties of the movable parts of the sensor such as

    Youngs modulus, Poissons ratio, length, width, and thickness of the tongues etc. Therefore, geometrical

    changes caused by the creep of polymers do not affect the sensor.

    Compared to an open loop acceleration sensor the useful bandwidth of a force balanced sensor is in-

    creased by a factor equal to the loop gain, thus the trade-off between sensitivity and speed can be relieved

    significantly [5, 6]. Besides this benefit, the deflection of the seismic mass is reduced considerably, which

    means that nonlinear effects from squeeze film damping and the mechanical suspension system are reduc-

    ed obviously.

    3.FabricationThe magnetic micro acceleration sensor is fabricated by surface micromachining and ultrasonic hot

    embossing [7]. The core component of the sensor is a polyimide foil with a coil, strain gauges, and a

    conductive path, which is shown in Fig. 3. It is made by sputtering of 220 nm gold, multiple-layer photo-

    lithography and etching on a PI foil, 50 m in thickness.

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    537J. Li and W.K. Schomburg / Procedia Engineering 25 (2011) 535 538

    Due to the available in-house equipment it was not possible to generate conductor paths for strain

    gauges and coil with a width of less than 100 m. The size of the entire foil is limited by the achievable

    line width. I.e., with a reduced line width the sensor could be decreased significantly.

    The frame (cf. Fig. 4) was fabricated by ultrasonic hot embossing [7], because, this way, complex

    micro structures from polymer are manufactured in seconds. The inverse of the micro structures requiredfor the frame were milled into the surface of an aluminum plate, 5 mm in thickness, to fabricate a molding

    tool. A stack of 5 PVDF foils, each 100 m in thickness was placed on the tool followed by the PI foil

    shown in Fig. 3 and another two PVDF foils. Then the sonotrode of an ultrasonic welding machine

    pressed the entire stack onto the tool, heated it up by ultrasound, and released the work piece again within

    2.35 s.

    Then the not embossed rim and center parts of the PVDF were cut off resulting in the work piece

    shown in Fig. 4. The frame can be kinked at hinges formed by ultrasonic hot embossing. An aluminum

    plate 12 mm, 8 mm, and 300 m in length, width, and thickness, respectively, was glued on the back of

    the PI foil as a seismic mass.

    Similarly two magnet holders were fabricated of PVDF foils by ultrasonic hot embossing.

    The permanent magnets (Q-05-1.5-01-N from Supermagnete, Germany) were glued attractively posi-tioned into the magnet holders. Then, the two holders were glued on upper and bottom surfaces of the

    PVDF frame to generate a uniform magnetic field across the coil on the PI foil. The PVDF frame was

    kinked at the hinges forming the desired three-dimensional suspending structure and fixed to the base by

    two clampers with four screws. At the development stage, base and clampers are made by milling, but in

    mass production injection molding would be more efficient. In each clamper there are three copper tapes

    which provide the electric contact between gold pads on the PI foil and wires soldered to the tapes.

    4.ExperimentsThe sensor was characterized in two ways: It was tilted in the gravitational field and swinging mounted

    at the end of a pendulum. The characteristic curve of the sensor was measured by tilting it (Fig. 5). Two

    measurements resulted in nearly the same curve.

    The pendulum was equipped with an angular position sensor and the acceleration sensor was mounted

    parallel to the pendulum, thus measuring tangential acceleration. Fig. 6 shows the results obtained when

    the pendulum was lifted up to 45 and then released. The signal from the bridge of the strain gauges is

    constant in certain limits because the coil pulls the seismic mass back into its idle position while position

    and acceleration are changing.

    Fig. 3. Polyimide foil with coil, strain gauges, and conductive path. Fig. 4. PVDF frame with PI foil.

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    538 J. Li and W.K. Schomburg / Procedia Engineering 25 (2011) 535 538

    Fig. 5. Characteristic curve of the sensor tilted in the gravi-

    tational field of the earth.

    Fig. 6. Signal from the bridge containing the strain gauges,

    position of the pendulum, and voltage supplied to the coil.

    5.ConclusionsAn acceleration sensor from polymer was built and tested successfully. This shows that even inertial

    sensors can be fabricated from polymers if the design is adapted to the special needs of this material class.

    In this case the acceleration was balanced by the magnetic force of a coil in the field of permanent mag-

    nets and the electrical current necessary for balancing is a measure of the acceleration.

    Ultrasonic hot embossing was employed for fabricating the sensor from a stack of polymer foils

    allowing cheap fabrication of the sensing element. It appears to be possible that in future even the control

    electronics could be integrated into polymer sensors.

    References

    [1] L.M. Roylance, J.B. Angell, "A Batch-Fabricated Silicon Accelerometer", IEEE Trans. Electron Devices ED-26 (1979)

    1911 - 1917.

    [2] L.A. Rocha, E. Cretu, R.F. Wolffenbuttel, Pull-in Dynamics: Analysis and modeling of the transitional regime, Proc.

    MEMS04, (2004) 249-252, ISBN 0-7803-8265-X.

    [3] F.J. Touwslager, N.P. Willard, D.M. Leeuw, I-line lithography of poly-(3,4-ethylenedioxythiophene) electrodes and

    application in all-polymer integrated circuits, Appl. Phys. Let. 81 (2002) 4556 - 4558.

    [4] P. Khuntontong, T. Blaser, W.K. Schomburg, Fabrication of Molded Interconnection Devices by Ultrasonic Hot

    Embossing on Thin Polymer Films, IEEE Transactions on Electronics Packaging Manufacturing 32 (2009) 152 156.

    [5] M. Elwenspoek, R. Wiegerink, Mechanical Microsensors, Springer-Verlag (2001) p. 143, ISBN 3-540-67582-5

    [6] S. Beeby, G. Ensell, M. Kraft, N. White, MEMS Mechanical Sensors, Artech House (2004) p. 177, ISBN 1-58053-536-4.

    [7] W.K. Schomburg, K. Burlage, C. Gerhardy, Ultrasonic hot embossing, Micromachines 2 (2011) 157 166, ISSN 2072-

    666X, doi:10.3390/mi2020157.