active pixels for a new inner vertex detector for star
DESCRIPTION
Active Pixels for a new Inner Vertex Detector for STAR. H. Wieman, F. Bieser, S. Kleinfelder, H. Matis, P. Nevski, N. Smirnoff, G. Rai and F. Retiere 6-June-01. Outline. D mesons, motivation for an additional inner vertex detector at STAR Active Pixel Sensor (APS) concept under consideration - PowerPoint PPT PresentationTRANSCRIPT
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Active Pixels for a new Inner Vertex Detector for STAR
H. Wieman, F. Bieser, S. Kleinfelder, H. Matis, P. Nevski, N. Smirnoff, G. Rai
and F. Retiere
6-June-01
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Outline
D mesons, motivation for an additional inner vertex detector at STAR
Active Pixel Sensor (APS) concept under consideration
R&D effort
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The STAR detector at RHIC
Inner micro-vertex detector for inside SVT
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Motivation for an inner tracker
Measure D mesons, charm quark production Emphasized in the long range plan for STAR
» Window to early hot parton phase– Large mass, c quarks less less likely from later mixed
phase and hadron phase– More restrictive than measure of strange quark
production– Augments measurements of multi-strange particles, -
– Calibration of J/ suppression
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Technical Challenge of D mesons
Topological separation of D vertex from primary vertex with thousands of tracks» D+K-+ + 8% c = 320 m» D0 K- + 3.65% c = 125.9 m
Require microscopic vertex resolution» minimum coulomb scattering» Minimum distance to interaction to improve pointing
resolution– Therefore need excellent two track resolution
» excellent position resolution
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CCD - VXD3 at SLACa model for our approach
Very thin, 0.4% radiation length
High resolution» pixels - 20 m cubes
» surface resolution < 4 m
» projected impact parameter resolution 11 m
Close to beam, inner layer at 2.8 cm radius
307 million pixels, < 1 cent/pixel
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VXD3 almost the solution Limitations
» Slow readout – 200 ms» Radiation hardness may be a problem in the RHIC
environment. 2 kRad per year Investigating use of thinned Active Pixel
Sensors (APS) in CMOS in place of CCDs» CMOS design freedom should allow faster readout
solution» APS will have better radiation hardness since
unlike CCDs does not need long charge transport path through silicon.
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8 cm
5.6 cm
Active Pixel Sensor (APS)
20 m square pixels
5 chips per slat
90 million pixels
40 m thick chips
760 m Be beam pipe
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Can D0 be resolved?
Preliminary analysis, K-+ channel» Multiple and single coulomb scattering (full
Molière)» Impact parameter cut > 100 m from
primary vertex» p 700 MeV/c» 760 m Be beam pipe 2.2 cm radius» 40 m inner Si layer at 2.8 cm radius
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Isolating the primary vertex
Simulated pointing resolution of the Micro-vertex detector
100 m exclusion cut
xy projection (m)
simulation
gaussian fit
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Invariant mass reconstruction of D0s k (preliminary simulation)
250,000 events 5 D0s in –1<<+1 Would need 6X106 if
1 D0
» This is 2 weeks running
M (GeV)
D0
2s
BN
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Operating in the RHIC environment
Very central collision dN/d = 700 Resulting hit density on inner vertex:
14 hits/cm2
Fraction of pixels filled in a single central event at the inner radius = 0.05%
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False rejection by pileup
design luminosity, 200 ms readout» 400 hits/cm2
» 1.4% pixels filled» false rejection 0.5%
10 X design luminosity, 200 ms readout» 4000 hits/cm2
» 13% pixels filled» false rejection 11%
SVT
real hits
pileup hits
primaryvertex rejectioncut
tracking in cone of uncertainty
pileup causing false rejection
innervertexdetector
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Inner Vertex Detector Requirements
Most Critical» Must be thin < 0.2% X0
» Must be low power < 100 mW/cm2, gas cooling to be thin» Must be minimum distance from beam, excellent two
track resolution» Must survive 1 year, 2 kRad
Desirable» Readout fast enough to keep up with other detector read
out, 10 ms now, less later No interest
» Use in a trigger is not being considered
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R&D effort focusing on APS in CMOS
Can be thinned like CCDs Better radiation hardness (TSMC 0.25 m CMOS is
good to 40 MRad) Potentially faster readout and lower power since zero
suppression can be done on the detector chip Design freedom with standard industry process LEPSI demonstrated technology with minimum
ionizing particles No CMOS APS detectors operating in an experiment MIP detection depends on a feature of the CMOS
process that could disappear
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Electronics R&D plan
Copy LEPSI style APS Using what is learned from the copy
investigate possible readout schemes for power and speed» Possible directions: full fast data read vs
on chip zero suppression
Next a look at the LEPSI MIMOSA APS design
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A Monolithic Active Pixel Sensor for Charged Particle Tracking and Imaging using Standard
VLSI CMOS TechnologyJ.D. Berst et al.
LEPSI, Strasbourg
LEPSI APS» 20 m square pixels
» 64X64 array MIMOSA 1, 0.6 m CMOS MIMOSA 2, 0.35 m CMOS
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MIMOSA CHIP by LEPSI
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Properties
Chip MIMOSA I MIMOSA II Ours
Technology AMS
0.6 m
AMS
0.35 m
TSMC
0.25 m
Epi (m) 14 5 8-10
MIP from Epi (e/h) 1100 400 640-800
Cn (fF) 11 7.1 5
Gain (V/e) 15 23 32
Leakage I (fA) 27 0.25 ?
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MIMOSA Readout and noise reduction
Read out all pixels, 12 bit ADC MIMOSA I at 2.5 MHz MIMOSA II at 10 MHz Correlated Double Sample (CDS) offline
to remove Reset thermal (kTC) and Fixed Pattern noise
Average baseline subtraction to remove leakage current pedestal
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Performance
Chip MIMOSA I MIMOSA II
Pixel Noise (e rms) 11.9 9.2
S/N measured 42 22
S/N expected 31 14
S/N improvement 1.3 1.5
Spatial resolution (m) 1.4 2.2
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APS development by Stuart Kleinfelder
Previous experience» SCA for EOS, NA49 and
STAR» ATWD for Amanda and
KamLAND, 1 GHz FADC - for just milliwatts of power
» 10,000 Frame/sec video chip (thesis project)
1st step – reproduce LEPSI results
10,000 fps, every 4th frame displayed propeller speed ~ 2000 rpm
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First chip submission
128X128 pixels0.25 m CMOS2.5 voltTSMC through MOSIS
n well collection nodes
4 styles
column selection shift register
row selection shift register
S. Kleinfelder
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SK chip design
4 pixel styles Added FET acts as
» Sample and hold (off or on) or
» Capacitance isolator (TX held constant at intermediate voltage)
Copy of MIMOSA style
capacitance isolator
Cd Cg
Cd
Cg
Vsg drops to Vthreshold and any additional charge spills to drain (Cg).Only Cg is reset
Vsg
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Status of our LEPSI copy
We have chips back from MOSIS Howard Matis has first version of DAQ
ready for testing Fred Bieser is programming the readout
board which is back ready for stuffing We will test with sources and in ALS
electron beam
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Readout options depend on chip performance
If the following noise sources are low compared to the signal then simple threshold zero suppression can be used» reset kTC noise (thermal)» reset fixed pattern noise » diode leakage current
Expected MIP signal 640 e
Expected reset kTC noise: 30 to 40 Expected reset fixed pattern ? Diode leakage current 0.25 fA to 29 fA
e
kTCd
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APS Readout with Zero Suppression if noise permits
CMOS APS ARRAY
READOUT WITH EMPTY ROW DETECTION
AND COLUMN-WISE ZERO SUPPRESSION.
SE
QU
EN
TIA
L R
OW
SE
LE
CT L
OG
IC
APS COLUMN READOUT WITH CDS
THRESHOLD DISCRIMINATION
SPARSE DATA ZERO SUPPRESSION
CONTROL AND SEQUENCING LOGIC
EXTERNAL INTERFACE
•Readout of each row followed by threshold discrimination and zero suppression in columns.
•No additional logic in pixels.
•Minimal periphery in one dimension allows close abutting.
S. Kleinfelder
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Zero suppression if only reset fixed pattern noise is a problem
When a trigger occurs a CDS is done with a reset between samples. This removes reset fixed pattern noise, but not reset kTC noise.
Reset is done one row at a time. Could have a separate readout on each column.
APS PIXELRESETACESSPOWER
BIAS
I-BIAS
SAMPLE 1
SAMPLE 2VOUT1
VOUT2
APS PIXELRESETACESSPOWER
BIAS
I-BIAS
VREF
S1
S2
S3
VCDS
C1
C2
VCDS=(C1/C2)VSIG+(1+C1/C2)(VOFF/(1+A))
VOFF, A
BASIC APS READOUT WITH CORRELATED DOUBLE
SAMPLING.
APS READOUT, CDS WITH SUBTRACTION AND OP-AMP
OFFSET CANCELLATION.
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Zero suppression if large pixel to pixel variation and large reset noise
(the heroic solution)
Full independent CDS on each pixel before doing threshold check
Do by continuous digitization and store into on chip dynamic RAM in a few ms for all pixels
On trigger digitize and subtract memory value to obtain CDS for threshold check
Dynamic RAM only 1/10 pixel area Need power analysis, but experience
suggests 100 mW/cm2 limit possible
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Alternative readout mode
Full pixel readout - continuous 20 – 40 ms per read (slower than other detector
readouts) Off chip correlated double sampling Chip design may be simpler, but enhancements
required like column parallel operations etc. Complicated DAQ and data processing Filled pixels still < 3% at 10 X design luminosity Should be able to stay in 100 mW/cm2 power budget
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Mechanical Possibilities beyond VXD3 ?
Material VXD3 APS
(m) % X0 (m) % X0
Be Beam Pipe 760 0.22 600 0.17
Silicon 180 0.16 40 0.037
Kapton 0.05 0.05
Copper 17.8 0.09
Aluminum 28 0.023
Be substrate 380 0.11 40 0.011
Total 0.63 0.3
VXD3 Ladder
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Development tasks
Simulations (H. Matis, N. Smirnoff, P. Nevski) Test new chip (S. Kleinfelder, H. Matis, F. Bieser,
F. Retiere) Explore readout options (S. Kleinfelder) Develop mechanical supports and interconnects
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Conclusion
New challenging technology with unknowns
Significant potential gains Important for STAR Long Range Plan
» Could benefit other RHIC experiments and heavy ion program at LHC
~Cost 3.25 M$ ~Time 3-4 years
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APS Readout
APS PIXELRESETACESSPOWER
BIAS
I-BIAS
SAMPLE 1
SAMPLE 2VOUT1
VOUT2
APS PIXELRESETACESSPOWER
BIAS
I-BIAS
VREF
S1
S2
S3
VCDS
C1
C2
VCDS=(C1/C2)VSIG+(1+C1/C2)(VOFF/(1+A))
VOFF, A
BASIC APS READOUT WITH CORRELATED DOUBLE
SAMPLING.
APS READOUT, CDS WITH SUBTRACTION AND OP-AMP
OFFSET CANCELLATION.
S. Kleinfelder