Activité LPNHE en 2012 et 2013

G.Calderini

Tracker upgrade

IBL Phase-0- Simulations of sensors and evaluation productions (during the last few years, now over for IBL)- Testbeams- IBL stave loading, testing and commissioning at Uni-GE and CERN - Mechanics (see Didier’s transparencies)

Phase-2 and core R&D- Development of sensor simulations models- Edgeless sensors- Testbeam organization- Electronics and R&D on interconnections- ATLAS Track trigger (AM chip)

The LPNHE group is involved both in Phase-0 (IBL)and Phase-2 activities

Phase-2 and core R&D

Device simulations (Silvaco)General expertiseDevelopment of specific modelsWork to extend to n-in-p sensors the model of interface defect traps developed for n-in-n devices

Insertion of intermediate levels in the gap to reproduce theSi/SiO2 interface defectsAfter radiation and better describe the leakage currentand breakdown behavior

Good agreement with Measurements on ourn-in-p device production

Edgeless sensors with DRIE (FBK/LPNHE project)

Deep trench diffusion(to prevent electricalfield on the damagedcut)

Cut line

Trench definition is critical:- aspect ratio: 20:1- deep etching: 200-230um- trench width: 8-12um

● Goal: make the rim zone equipotential● How: DRIE as for 3D process● Trench doped by diffusion

Electronics

Interest for 65nm electronicsLPNHE is also part of the AIDA EU project(providing a number of IP blocks for WP3)

Expertise in radiation tests from previous experiments of people (BaBar / ILC)

Fastening to shuttle

TOP

BOTT

OM

Support card for OmegaPix irradiation tests

Contributions to OmegaPix2 chips

One slide on track trigger FastTracKer : a hardware track finder for ATLAS

Trigger

Full silicon detector acceptance, pT > 1 GeV

Tracks with ~offline quality reconstructed parameters available to level-2 processors FTK reads hits at L1 rate and reconstructs the

event in ~100 μs Two step algorithm:

Pattern recognition with Associative Memory (ASIC)

Linear PCA-based track fit with FPGAs

Associative Memory (AM) ASIC: the core processor of the pattern recognition stage.

Evolution of the AMchip03 of SVT (CDF)Current prototype AMchip04 done and

under testing: 65 nm technology (SVT chip was

180 nm) 8k patterns/chip (5k patterns/chip) Ternary logic for variable resolution

(new feature)AMchip05 (FTK final chip candidate): 32k – 64k patterns Serial links

Persons involved at LPNHE T.Beau (MdC, P7)M. Bomben (CDD-HN)G.Calderini (DR2 CNRS)J.Chauveau (PR, P6)G.Marchiori (CR2 CNRS)P.Schwemling (PR, P7)

D. Laporte (IE, CNRS)F. Crescioli (IR, CNRS)F. Dematos (IR, CNRS)O.Le Dortz (IR, CNRS)J.F. Genat (IR, CNRS)

Funding / support expected/obtained from: ATLAS and laboratory (IN2P3)EUDET and AIDA EU projectsEmergence (UPMC Project)EU FP7 (IAPP already approved project)

L. Bosisio (invited from Univ.Trieste)R. Kass (invited from Ohio State U.)

2) Phase-2 achievements using funds

3 KE FE-I4 wafer procurement4 KE Thin detector production (MPI)10 KE Semiconductor parameter analyzer

(cards still to buy)

FBK sensor production support Participation to n-in-p slim productions (MPI, down to 150um) as support for interconnectionstudies (see Abdenours’ talk)

Total of 22KE engaged out of 21 received

Funding requests for 2013 1) ATLAS related general needs

0 KE2) Strictly IBL-related

5 KE cleanroom ordinary metabolism

(+ 18KE asked to Christophe to equip the Semiconductorparameters analyser with SMUs)

Funding requests for 2013 3) More general R&D 5 KE support interconnections (see Abdenour’s talk)30 KE edgeless R&D (bump-bonding of produced devices, already mentioned last year)5 KE SIMS on produced devices4 KE Support to ATLAS track trigger work 4 KE Mechanics

TOTAL: 55KE

4) Participation in RD502 KE participation

(Missions not dicussed here)

backup

• Installation of a 4th pixel layer inside the current pixel detector:

• performance of current pixel detector will degrade before main tracker upgrade (Phase 2)

• maintain physics performance in high occupancy environment (higher granularity, r/o bandwidth)

• increase radiation hardness (IBL fluence ~ 5x B-Layer fluence)

• Insertable B-Layer

• 250 Mrad TID and 5x1015 neqcm-2

• installation originally planned for 2015-2016… advanced (in 2011) to 2013 (Fast-track IBL)

• IBL mounted on new beam pipe• Length: ~64cm • Envelope: Rin = 31mm, Rout=40mm• 14 staves, 32 pixel sensors / stave.• Front-end chip:

• FE-I4 (IBM 130 nm CMOS tech.)

• 50μm x 250μm• 80(col) x 336 (rows) = 26880

cells.• 2cm x 2cm!

IBL

Pixel

A word on RD50

We have been contacted several times and invited to join the RD50 collaboration

We think that this point has to be discussed more generally at ATLAS (/IN2P3) level.

The fee is ~negligible (1400 CHF/year/group) but then sooner or later we will need to contribute to at least some of the RD50 detector productions (each time the contribution is typically of order of 5-10KE)

Scientifically it would probably be worthwhile, but the funding aspect has to be discussed in ATLAS