advanced oatings - metalor...use of any product in a manner, process or formula not designed by...
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AdvAnced coAtings
precious Metalpowders and flakes
the AdvAnced coAtings Business unit
DISCLAIMERThis data sheet provides information concerning the properties, composition and use of Metalor’s products. The information is provided solely as a convenience to customers. Neither this data nor any advice concerning the selection and/or use of any product shall consti-tute a warranty of any type, whether express or implied. ALL WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT ARE EXPRESSLY DISCLAIMED. Nothing in this data sheet or in other information pro-vided by Metalor shall be construed as a recommendation or inducement toproduce or use any process or product in a manner that infringes any existing or future patents. All sales are made expressly subject to Metalor’s standard terms and conditions which are printed on the reverse side of each invoice. Metalor shall not be responsible for any liability arising out of the processing or use of any product in a manner, process or formula not designed by Metalor.
JApAnMetalor Technologies (Japan) Corporation9F, Shinagawa East One Tower2-16-1, Kohnan, Minato-KuTokyo 108-0075Phone +81 3 6863 3385Fax +81 3 6863 3565
Numazu Plant 678 Ipponmatsu, Numazu-CityShizuoka-Prefecture 410-0314 Phone +81 55 966 1080 Fax +81 55 967 2544
Mitomo Semicon Engineering Co. Ltd.Tsukuba Plant 25-3, Koshindiara,Bando-CityIbaraki-Prefecture 306-0608 Phone +81 297 36 8800 Fax +81 297 36 8802
KoreAMetalor Coatings (Korea) Corporation5F Suwon venture PlazaSamsung-ro 168-48 (Maetan-dong 413-3)Yongtong-gu, Suwon-si, Gyeonggi-do 443-803Phone +82 2 3453 4264Fax +82 2 3453 4147
netherlAndsMetalor Technologies (UK) Ltd.Netherlands BranchWeegschaalstraat 3NL-5632CW EindhovenPhone +31 40 291 1265Fax +31 40 291 [email protected]
singAporeMetalor Technologies (Singapore) Pte. Ltd.Surface Engineering Hub 8 Buroh Street #01-06 Singapore 627563Phone +65 6586 [email protected]
spAin Metalor Technologies (Ibérica) S.A.C/ Albasanz, 14 bis, 1°GE-28037 MadridPhone +34 91 375 7480Fax +34 91 304 [email protected]
sweden Metalor Technologies (Sweden) ABSagagatan 22S-506 35 BorasPhone +46 33 444 250Fax +46 33 444 [email protected]
chinAMetalor Technologies (Suzhou) Ltd.B building, 48 Dong Fu RoadSuzhou Industrial ParkJiangsu ProvinceP.R. China 215123Phone +86 512 6593 6181Fax +86 512 6593 [email protected]
Dongguan Branch Office Unit B213, Wanbao Cheng Dezheng E. Road, ChanganDongguan, Guangdong ProvinceP.R. China 523856 Phone +86 769 8544 3938 Fax +86 769 8544 3933
Metalor Coatings (Shanghai) Co. Ltd.No. 3 Building, 800 Shenfu RoadXinzhuang Industry Park, Minhang District Shanghai P.R. China 201108 Phone +86 21 5442 7450 Fax +86 21 5442 7451Phone +86 21 5442 3060 Fax +86 21 5442 0790
FrAnceMetalor Technologies (France) S.A.S.11, Rue Louis AulagneF-69600 OullinsPhone +33 4 72 66 32 10Fax +33 4 72 66 37 [email protected]
hong KongMetalor Technologies (Hong Kong) Ltd.Suite 1705-9 The Metropolis Tower10 Metropolis DriveHunghom, KowloonHong Kong – ChinaPhone +852 2521 4131-5Fax +852 2845 [email protected]
itAlyMetalor Technologies (Italia) S.r.l.Via G. Di Vittorio, 28I-20068 Peschiera Borromeo (Milano)Phone +39 02 5165 181Fax +39 02 5530 [email protected]
switzerlAndMetalor Technologies SARue des Perveuils 8CH-2074 MarinPhone +41 32 720 6111Fax +41 32 720 [email protected]
tAiwAn Metalor Technologies (Hong Kong) Ltd.Taiwan Branch6F, 101 Rei-Hu StreetNei-HuTaipei, Taiwan R.O.C.Phone +886 2 7720 7775Fax +886 2 7720 [email protected]
Metalor Coatings (Taiwan) Corporation16 East 7th StreetNan-Tze Export Processing ZoneKaohsiung, Taiwan R.O.C.Phone +886 7 368 0560Fax +886 7 365 3174
thAilAnd Metalor Technologies (Singapore) Pte. Ltd.Bangkok Representative Office335/43, 7th Floor, Prime State OfficeSirnakarin Road, Nongborn, Pravej DistrictTH-Bangkok 10250Phone +66 2366 0719Fax +66 2366 [email protected]
united Kingdom Metalor Technologies (UK) Ltd.74, Warstone LaneUK-Birmingham B18 6NGPhone +44 121 262 3088Fax +44 121 236 [email protected]
usAMetalor Technologies USA Corporation52 Gardner StreetUSA-Attleboro, MA 02703Phone +1 508 226 4470Fax +1 508 695 [email protected]
255 John Dietsch BoulevardUSA-North Attleboro, MA 02763Phone +1 508 699 8800Fax +1 508 695 4828
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Metalor Technologies SAAvenue du Vignoble, Case postale 9, CH-2009 NeuchâtelTel. +41 (0) 32 720 61 11, Fax +41 (0) 32 720 61 [email protected], www.metalor.com
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LBMAGood Delivery
Referee
LPPMGood Delivery
Referee
These are typical values obtained in our laboratory and do not represent any specification
PUPD4326PUPD4216 PUPD13710 μm SEM 2 μm SEM 2 μm SEM PUPT5061PUAU114 PUAU59420 μm SEM SEM 4 μm 2 μm SEM
Product Name
Description Tap Density
Surface Area
Particle Size Distribution (μm)
Application PDS
(g/cm3) (m2/g) 10 50 90
plAtinum powdersPUPT511 Deagglomerated powder 4.9 0.80 1.1 3.2 7.0
Fuel cells, gas sensors, compo-nent electrodes, termination inks
0393
PUPT514 Amorphous powder 1.7 24 0.74 2.0 7.9 Fuel cells and gas sensors 0394
PUPT551 Controlled porosity powder 3.7 25 Sensors, medical 0397
PUPT5061 Agglomerated spheres 2.1 0.80 0.80 1.5 3.5 General purpose, 3D printing 0400
PUPT5071 Flaked powder 5.8 0.80 1.0 1.8 3.3Fuel cells, gas sensors, compo-nent electrodes, termination inks
0401
gold powders And FlAKes PUAU114 Very high surface area, doped gold 1.2 4.8 Gas sensors 0760
PUAU458Dendritic, designed for high conduction with low charge
3.9 0.35 1.2 1.9 3.1 Adhesive pastes 0408
PUAU468Dendritic, designed for high conduction with low charge, deagglomeration treated
5.9 0.26 1.1 1.7 2.7 Adhesive pastes 0896
PUAU593Spheres flakes mix, deagglomeration treated
9.2 0.16 1.3 2.7 6.3 Thickfilm inks 0410
PUAU594Spheres flakes mix, deagglomeration treated
10 0.13 1.9 4.1 11 Thickfilm inks 0411
PUAU3335 Fine spheres, designed for compact firing 10 0.20 0.8 1.5 2.7 Thickfilm inks 0413
WA0400 Flaked powder 8.9 0.29 1.2 2.8 6.4 Adhesive pastes 0416
Product Name
Description Tap Density
Surface Area
Particle Size Distribution (μm)
Application PDS
(g/cm3) (m2/g) 10 50 90
pAllAdium powders PUPD184 Spherical powder 1.2 1.2 General purpose 0379
PUPD137 Spherical powder, retarded oxidation 2.8 0.40 1.6 4.4 12 High fire, MLCC 0385
PUPD186 Spherical powder 1.5 3.0 0.75 1.5 3.0 General purpose 1069
pAllAdium silver powders PUPD451
Amorphous, coprecipitated Pd/Ag ratio 56/44
1.6 1.5 1.1 2.6 6.2MLCC, components, thickfilm, resistors
0435
PUPD4216Coprecipitated, flaked and alloyed Pd/Ag ratio 20/80
1.8 1.3 1.2 2.4 6.7MLCC, components, thickfilm, resistors
0437
PUPD4326Deagglomerated, coprecipitated and alloyed Pd/Ag ratio 30/70
1.2 4.0 0.8 1.7 3.6MLCC, components, thickfilm, resistors
1210
PUPD4722Amorphous, coprecipitated Pd/Ag ratio 70/30
1.2 3.0 0.8 1.5 3.7MLCC, components, thickfilm, resistors
0441
AB-0222
These are typical values obtained in our laboratory and do not represent any specification
D-0138AB-5895 D-34435 μm SEM 5 μm SEM 5 μm SEM (A)P582-2C-0083P K-1081PSEM 5 μm 5 μm SEM SEM 5 μm
Product Name
Description Tap Density
Surface Area
Particle Size Distribution (μm)
Application PDS
(g/cm3) (m2/g) 10 50 90 100
silver processed powders D-2466P Ionically pure spherical ultra fine powder 5.1 0.35 1.9 4.0 7.6 13 Thickfilm 0806
C-1284PExcellent sintering behaviour to form highly dense, highly conductive deposits
2.3 1.51 0.5 0.8 1.5 4 Thickfilm 0794
C-0083PExcellent sintering behaviour. Excellent rheology modifier to increase thixotropy
2.5 1.62 0.5 0.9 1.6 5 Thickfilm 0735
(A)P582-2Processed powder with “G” coating, produced using caustic input powders
5.0 0.45 1.4 3.4 6.0 10.5 Thickfilm 1301
silver sphericAl powders K-0082P
Excellent sintering behaviour to form highly dense, highly conductive deposits
5.3 0.9 0.8 1.5 2.5 7.0 Thickfilm 0369
K-1081PHigh photovoltaic and low temperature ink applica-tions, excellent sintering behaviour
4.5 0.65 1.0 1.8 3.3 9.0 Thickfilm 0739
K-1321PPhotovoltaic and high temperature fired applications, excellent sintering behaviour
4.7 1.61 0.6 1.1 1.7 5.0 Thickfilm 0370
K-1322PHigh and low temperature applications, excellent sintering behaviour
4.5 2.1 0.6 0.9 1.7 3.0 Thickfilm 0740
K-1631PHigh temperature fired applications, excellent sintering behaviour
3.8 1.15 0.7 1.3 2.4 6.0 Thickfilm 0371
K-2081PHigh temperature fired and die attach applications, excellent sintering behaviour
4.6 0.64 1.0 1.8 3.2 9.0 Thickfilm 0753
P554-19 High and low temperature applications 4.2 0.52 0.9 1.4 2.1 4.0 Thickfilm 1316
Product Name
Description Tap Density
Surface Area
Particle Size Distribution (μm)
Application PDS
(g/cm3) (m2/g) fsss 10 50 90 100
silver FlAKes SA-0201
Designed for die attach, high and low tempera-ture PTF conductive paste applications
4.7 0.83 0.9 2.6 6.7 21 Adhesives 0375
MB-5891Flake with “J” coating, produced using caustic input powders
3.6 0.9 1.82 5.83 14.6 38.3 Adhesives 1299
EA-0295Designed for high and low temperature PTF conductive paste applications
4.3 0.56 1.7 5.8 14.2 32 Adhesives 0365
AB-5895Flake with “A” coating, produced using caustic input powders
3.4 0.55 4.8 14.1 27.3 65 Thickfilm 1298
AB-5894Flake with “A” coating, produced using caustic input powders
3.9 1.19 1.5 4.9 12.7 26 Thickfilm 1297
AA-4703Bi-modal, neutralized flake. For low tempera-ture conductive ink and die attach applications
3.5 1.01 1.2 4.4 12.2 28 Adhesives 0454
silver powdersD-3443
Mid-range particle size, agglomerated, amorphous powder
1.6 0.43 1.7General purpose
0804
D-0138Mid-range particle size, low surface area, agglomerated, amorphous powder
1.4 0.22 5.1General purpose
0803
D-0001Mid-range particle size, low surface area, agglomerated, amorphous powder
1.0 0.38 2.62General purpose
0801
C-0017Excellent sintering behaviour to form highly dense, highly conductive deposits
1.0 2.3General purpose
1300
C-0002Excellent sintering behaviour to form highly dense, highly conductive deposits
1.1 0.96 1.02General purpose
0667
These are typical values obtained in our laboratory and do not represent any specification
P668-2 P620-22(A)P665-25 μm SEM 5 μm SEM 1 μm SEM Ag-V03 Ag-R0220 nm TEM 20 nm TEM20 nm TEM Ag-D02
Product Name
Description Tap Density
Surface Area
Particle Size Distribution (μm)
Application PDS
(g/cm3) (m2/g) 10 50 90 100
Fine silver FlAKes AC-4048
Ultra-fine flake, specifically designed for PV, die attach, high and low temperature fine line printing
2.9 2.0 0.5 0.9 1.6 5.0 Thickfilm 1156
(A)P665-2Highly conductive, low aspect ratio and medium particle size flake with “V” coating
3.9 1.55 0.7 1.0 1.7 4.0 Thickfilm 1305
(G)P668-2High aspect ratio and medium particle size flake with “G” coating
3.8 1.6 0.59 1.08 2.0 4.4 Thickfilm 1317
(G)P683-2High aspect ratio and medium particle size flake with “G” coating
3.6 1.69 0.71 1.5 3.13 7.0 Thickfilm 1306
suB-micron silver powders P620-2 Sub-micron spherical powder with “A” coating 2.65 2.5 0.1 0.2 0.5 1.2 Thickfilm 1307
P620-7 Sub-micron spherical powder with “A” coating 2.65 4.0 0.1 0.2 0.5 1.0 Thickfilm 1311
P620-12 Sub-micron spherical powder with “A” coating 2.25 6.5 0.05 0.1 0.3 0.5 Thickfilm 1309
P554-3 Sub-micron spherical silver powder 2.6 1.5 0.4 0.7 1.1 1.9 Thickfilm 1310
Product Name
Provided as
Product available in following solvents
Description Composition Particle Size (nm)
Ag Content (%) in dry product
PDSAg
Content (%)Solvent
Content (%)
metnAno silver
Ag-V03 Ink additiveWaterEthanolEthylene glycol
Very well-dispersed solu-tions, low viscosity (<100 mPa.s at 50 % silver loa-ding in ethylene glycol)
10 - 70 30 - 90 13 - 201 92 - 95 1360
Ag-V03 Paste
Terpineol Butyl carbitolTexanolDipropylene glycol n-butyl ether
Very well dispersed solutions to paste
40 - 70 30 - 50 13 - 201 92 - 95 1364
Ag-V03 can be used as an additive or as a stand-alone product for low sintering applications. Provided mainly in ink formulation for inkjet and roll-to-roll printing. 1 9 % of particles have a diameter of 130 nm.
Ag-D02 PasteUndecane Terpineol
Paste with decantation1 74 - 88 5 - 20 2 - 20 93 1347
Ag-R02 Paste
Carbitol acetateCarduraTerpineol2-Butoxyethyl ether acetate
Paste with decantation1,2 76 - 85 5 - 20 5 - 15 90 1359
Ag-D02 and Ag-R02 can be used as additives or stand-alone products for low sintering applications. They are provided in paste form only. 1 Low dust: product is a suspension/paste. No emission of nano Ag powder to be expected.2 After reception at customer: the material must be redispersed using high speed mixer or ultrasonication.On request other solvents can be tested to disperse these nanoparticles.