advisory board - electronics
TRANSCRIPT
Advisory Board - Electronics26. September 2019
The Faculty of Engineering
Agenda:
Welcome (Ib Christensen) Presentation of members
Information about the programmes (Ib Christensen) Uptake 2019 Drop-out rate - first year students Job guarantee (Christina Skytte Møller)
The MSc programme (with start in 2020)
AoB
Next Meeting:ThemesCompany Visit:
A look at the new CIE building
Uptake 2019 vs. 2018Applications – first priority
Uptake 2019 vs. 2018Accepted
Job Guarantee
Drop – out rate
Bachelor Programmes, up and running
3 years B.Sc.
+2 years M.Sc.Eng.or M.Sc.
Ph.D.3 years
3½ years B.Eng. incl.
½ year internship
First graduates expectedin January 2021
First graduates expectedin June 2022
Semester Electronics B.Eng (and BSc) STRUCTURE Autumn 2018
7. Final Project (External, oral)
6.Spring 21
Internship for B.Eng studentsBachelor project (External) EE-SAA (EXAM: Internal), MC-AEM (EXAM: Internal, P/F) and elective course for BSc
5.Autumn
21
MC-EXSExperts in Teams(EXAM: External)
EE-POE Power Electronics(EXAM: External)
ELECTIVE ELECTIVE
4.Spring 20
EE-DEADesign of Embedded Architectures
SPRO4E (EXAM: External)
MC-DSP Digital Signal
Processing (EXAM: Internal)
MC-DDS Digital Design and Signal
Processing (EXAM: External)
MC-COE2 Control Engineering 2
(EXAM: Internal) ELECTIVE
3.Autumn
20
EE-DIEDevelop Intelligent Dynamic Electronic Systems
(SPRO3E, ELTR3, CON1 EXAM: External)
MC-EDMElectrodynamics and Mathematics
(EDY External,3 hour written,MSS EXAM: External,3 hour written)
2.Spring 19
EE-BIEBuild Industrial Electronics
(SPRO2E, ELTR2, EMB2 EXAM: Internal)
EE-EMATSignals, Filters and Mathematics
(ASF, MATH2 EXAM: Internal)
1.Autumn
18
EE-DEDPDiscover the Electronic Development Process
(SPRO1E, ELTR1, EMB1 EXAM: Internal)
EE-PHYMPhysics and Mathematics
(ENPHYS*, MATH1 EXAM: Internal)
ECTS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
1st year-exam
EE-DEDP + EE-BIE + EE-PHYM
MUST PASS
MSc in Electronics
The Faculty of Engineering
Teoretisk ingeniørfaglig metode, avanceret matematik og fysik, projektledelse samt forsk-ningsbaseret viden inden for kompetenceområderne i en praksisnær kontekst og med inddragelse
af opgaver og problemstillinger fra erhvervslivet
Grundlag for tilegnelse a f kompetencer
½ års specialepraktik med udgangspunkt i forskning og erhvervssamarbejde
Distr ibuted Systems
Materials, Packaging and
Reliability
Data Communication
and IoT
Signal Processing
and Sensors
AdvancedEmbeddedSystems
Intelligent Control
EngineeringPower
Elect ronics
Modeling and Simulation
EMC and EMIAnalog and Digital Elect ronics
Civilingeniøruddannelsen i elektronikBacheloruddannelse (3 år) + kandidatuddannelse (2 år)
(SDU – Center for industriel Elektronik, Camp u s Sønderborg)
The Faculty of Engineering
The Faculty of Engineering
Materials, Packaging and reliabilityPower ElectronicsModelling and Control EngineeringControl of Grid Connected ConvertersModelling and Control of Electrical Machines
Software for Embedded systemsSignal- and Image ProcessingDistributed systems and IoTReal Time systemsHardware-Software Co-Design
Electronic Design and Build (project work)Scientific Methods used in PractiseIn Company PeriodMaster Thesis (30 or 40 ECTS)Electives
Academic Fields – MSc in Electronics
SemesterMaster of Science in Engineering – Electronics
Sønderborg
4.
Choose between:THS-U2 (30 ECTS) Master Thesis or
THS-U1 (40 ECTS) Master Thesis continued.
3.
MC-RTSReal Time Systems
EE-DITDistributed
Systems and IoT
EE-SIPSignal and Image
Processing
Choose between:VF-U1 (15 ECTS) In Company Period or
THS-U1 (40 ECTS) Master Thesis upstart andElective (5 ECTS) or
Electives (15 ECTS)
2.
MC-HSCODHW/SW Co-Design of
Embedded Systems
EE-MAT2Material Science,
Packagingand reliability of
Electronics
EE-CGCCControl of (grid connected)
converters
EE-POE2Advanced Power
Electronics
EE-EDB1Electronics Design and Build Project
1.
MC-SESSoftware for Embedded
Systems
EE-MAT1Material Science,
Packagingand reliability of
Electronics
EE-MCEMModelling and Control of Electrical
Machines
EE-POE1Power Electronics
EE-EDBElectronics Design and Build Project
ECTS POINT5 5 5 5 5 5
EE-MAT1, Material Science- Physics of Solids (Wave Function, Conduction Band, Valence Band, Effective
Mass, Free Electron)- Aspects of Materials Science (Phase Diagram, Lattice Site, Reciprocal Lattice, Binary
Phase Diagram, Ternary Phase Diagram- Engineering Electronic Structure (Valence Band, Band Structure, Interatomic
Distance, Atomic Orbital, Hybrid Orbital)- Crystal orientation, Charge carrier mobility and conductivity of Semiconductors- Defects in Semiconductors (Dislocation and critical thickness)- Amorphous Semiconductors (Solar Cell Dangling Bond)- Organic Semiconductors- Pn-junction- Electronic Devices (Band Edge, Minority Carrier, Depletion Region, Bipolar Junction
Transistor, Majority Carrier)- bi-polar and uni-polar Transistors- Power transistors- Introduction to Advanced Power electronics (silicon carbide, gallium nitride)- Material characteristics of WBG devices
EE-MAT2, Material Science- Semiconductors with wide bandgap (WBG)- SiC diodes and pin diodes- SiC-MOSFETS, IGBT- GaN devices: HEMTs and MOSFETs- Process technologies for WBG devices and Application examples- Introduction to thermal radiation, convection, thermal capacity and
thermal spreading- Thermal interface materials- Materials for packaging and housing- Electrical-thermal modelling- Effects on life time and reliability- Coatings, over-molds and protective materials, material properties- Failure mechanisms and Failure analysis:
- failure mechanisms caused by different environmental stresses- Basics of corrosion processes- Analysis and characterization methods
- One variable topic based on the current research (<10% of course content)
EE-MCEM, Modelling and Control of Electrical Machines- Rotating Machines
- DC- Synchronous type AC- Asynchronous AC
- Interfacing and control of the different machines- Stability and linear state-feedback control for DC Machines- State Space representations for continuous and discrete-time systems- Observability and state estimators/observers- Parameter estimation- Modelling and simulating linear and non-linear systems in Matlab/Simulink- Clarke and Park transform and Field Oriented Control of Synchronous Machines
(simulation)
EE-CGCC, Control of Grid Connected Converters- Advanced grid connected converter topologies for renewable energy conversion,
their control and synchronization to power grid, requirements and regulations.- The course contains theory, seminars and laboratory activities that cover the
design and control of grid connected power converters.
EE-POE1, Power Electronics 1- DC/DC converters (Topologies)- AC/DC Rectifier- DC/AC converter (Topologies)- Modulation strategies as single phase, three
phase, Space Vector 3- Design of power electronic converter
- Power devices and packages- Gate Driver1- Cooling1- Busbar and Capacitors, Stray inductance- Inductor- Current sensing- Voltage sensing- Isolation
EE-POE2, Power Electronics 2- DC/DC converters (Hard and soft switching, resonant
switching)- AC/DC converters (line commutated)- DC/AC converter (self-commutated)- Impact of converters to the grid- Power Electronic components- Silicon Carbide and Gallium Nitride Devices- Applications:
- Power factor correction (DC-DC converter)- Motor drives- Solar inverter (introduction to 3 Level Topologies)
- One variable topic based on the current research (<10% of course content)
EE-SIP, Signal and Image ProcessingSignal Processing Algorithms (FFT, DFT, Correlation, Convolution etc.)FIR and IIR filtersCore Algorithms in image processing, exemplified in relevant use cases.
MC-SES, Software for Embedded SystemsObject-oriented programming in C++ClassesInheritancePolymorphismTemplatesExceptions
MC-HSCOD, Hardware Software Co-DesignComputer Systems OrganizationThe Microarchitecture Level.The Instruction Set Architecture Level.Parallel Computer Architectures.Techniques for pipelining and improving performance in an embedded microcontroller.Design, modelling and Implementation of a pipelined Computer Architecture in a FPGA.
EE-DIT, Distributed Systems and IoTDatacommunication in generalSecuring safe transfer of dataArchitecture of industrial networksPerformance of industrial networksInternet of Things.
MC-RTS, Real Time SystemsScheduling of independent and dependent tasks.Scheduling schemes for handling overloadMultiprocessor scheduling.Joint scheduling of tasks and messages in distributed systemsExamples of different real-time operating systems, real-time languages and real-time middle-ware systems.
- Electives (max. 15 ECTS)- Project: State-of-the-art research in Power Electronics
and Embedded Control (10 ECTS)- In-Company Project (15 ECTS)- Thesis (30 or 40 ECTS)
AoB
Next Meeting:ThemesCompany Visit:
A look at the new CIE building