»PCIM Europe is an excellent conference in the area of power electronics because of its broad set of audi-ence, wide coverage of diverse topics and general ambience which stimulates exciting discussion and networking.«Tirthajyoti Sarkar, Senior Device Engineer, Fairchild Semiconductor,India

»Excellent conference in term of active participation of industry. Flawlessly organized and a great platformfor young engineers to interact and understand the requirements of the power industry.«Jitendra Solanki, Scientific Staff, University of Paderborn, Germany

»By far the leading forum for learning the latest inpower systems engineering.« Girvan Patterson, CEO, GaN Systems Inc. Canada

»For a young researcher like me, PCIM is a great event,which gives me the possibility for networking with colleagues and industries in the field.«Cam Pham, Academic Employee, Aalborg University, Denmark

Speakers statements

Call for Papers

Power for Efficiency

Nuremberg, 20 – 22 May 2014

International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management

pcim-europe.com

Advisory Board

Bodo Arlt, A Media, GermanyFrancisco Javier Azcondo, University of Cantabria, SpainMark-M. Bakran, University of Bayreuth, GermanyPaul Bauer, Delft University of Technology, The NetherlandsReinhold Bayerer, Infineon Technologies, GermanyWerner Berns, National Semiconductor, GermanyFrede Blaabjerg, Aalborg University, DenmarkSerge Bontemps, Microsemi PMP Europe, FranceEric Carroll, EIC Consultancy, FranceBruce Carsten, Bruce Carsten Associates, USADaniel Chatroux, CEA-LITEN, FranceSilvio Colombi, General Electric, SwitzerlandHilmar Darrelmann, Darrelmann+Partner Ingenieure, GermanyEnrique J. Dede, University of Valencia, SpainHans-Günter Eckel, University of Rostock, Germany

Advisory Board

Honorary Board

Helmut Knöll, UAS Würzburg-Schweinfurt, GermanyJean-Marie Peter, FranceGerhard Pfaff, University of Erlangen, GermanyAlfred Rufer, EPFL, Switzerland

Board of Directors

Leo Lorenz,ECPE, Germany

Consultatory Board

Jean-Paul Beaudet,Schneider Electric, France

Eric Favre, Norgren FAS, Switzerland

Johann Walter Kolar,ETH Zürich, Switzerland

Philippe Ladoux,University of Toulouse, France

Jose Mario Pacas,University Siegen, Germany

Friedrich-Wilhelm Fuchs,Christian-Albrechts-University of Kiel, Germany

Josef Lutz,Technical UniversityChemnitz, Germany

Uwe Scheuermann,Semikron Elektronik,Germany

Hans Ertl, Vienna University of Technology, AustriaJ. A. Ferreira, Delft University of Technology, The NetherlandsPetar J. Grbovic, Huawei Technologies, GermanySteffan Hansen, Danfoss Solar Inverters, DenmarkKlaus F. Hoffmann, Helmut-Schmidt-University, GermanyEdward Hopper, MACCON, GermanyIonel Dan Jitaru, Rompower Inc., USADaniel B. Jones, Incremotion Associates, USAUlrich Kirchenberger, STMicroelectronics, GermanyChristopher Kocon, Texas Instruments, USAJacques Laeuffer, Dtalents, FranceRomeo Letor, STMicroelectronics, ChinaAndreas Lindemann, Otto-von-Guericke-University Magdeburg, GermanyStefan Linder, ABB Switzerland, SwitzerlandMarco Liserre, Polytechnical University of Bari, ItalyMartin März, FhG-IISB, GermanyGourab Majumdar, Mitsubishi Electric, JapanKlaus Marahrens, SEW-Eurodrive, GermanyMike Meinhardt, SMA Solar Technology, GermanyYasuyuki Nishida, Chiba Institute of Technology, JapanYasuhiro Okuma, Fuji Electric, JapanNejila Parspour, University of Stuttgart, GermanyRobert J. Pasterczyk, Schneider Electric, FranceVolker Pickert, University of Newcastle, Great BritainBernhard Piepenbreier, University of Erlangen, GermanyMunaf Rahimo, ABB, SwitzerlandKaushik (Raja) Rajashekara, University of Texas at Dallas, USAChris Rexer, Fairchild Semiconductor, USAFranck Sarrus, Mersen France, FranceAndrew Sawle, International Rectifier, Great BritainAchim Scharf, Techmedia International, GermanyHubert Schierling, Siemens, GermanyManfred Schlenk, NMB-Minebea, GermanyManfred Schrödl, Vienna University of Technology, AustriaYasukazu Seki, Fuji Electric Europe, GermanyChristopher A. Soule, Thermshield, LLC., USAElmar Stachorra, KoCoS Power Grid Services, GermanyPeter Steimer, ABB Switzerland, SwitzerlandWolfram Teppan, LEM, SwitzerlandJoël Turchi, On Semiconductor, FranceYoshiyuki Uchida, Curamik Electronics K.K., JapanAlfredo Vagati, Politecnico di Torino, ItalyPeter Wallmeier, AEG Power Solutions, GermanyDehong Xu, Zhejiang University, ChinaPeter Zacharias, University of Kassel, Germany

General questions about the conference?Please contact: Mrs. Sonja SalmenPhone: +49 711 61946-43Fax: +49 711 61946-90Email: sonja.salmen@mesago.com

Organizer:Mesago PCIM GmbHRotebuehlstrasse 83 – 85, 70178 Stuttgart, Germanywww.pcim.depcim@mesago.comBoard of Management: Petra Haarburger, Johann ThomaAmtsgericht Stuttgart; HRB 720222

Questions about the abstract submission?Please contact: Ms. Kirsten HübnerPhone: +49 711 61946-972Fax: +49 711 61946-90Email: kirsten.huebner@mesago.com

Papers must be original material and not have been previouslypresented or published. The application of the presented solution is critical for the selection of the paper.

Oral presentationsWill be held within conference sessions addressing key elements of the same topic.

Poster presentationsAuthors will have the oppor tunity to present their posters during special poster/dialogue sessions.

Conference language English

Online submission of papersThe synopsis/abstract should be submitted at www.pcim-europe.com/callforpapers as pdf-file and should comprise2–3 pages. Deadline for submissions: 15 October 2013

Conditions of acceptanceAuthors are expected to secure registration fees of 290 EUR+ 19 % VAT (240 EUR + 19 % VAT for Students/University Staff),travel and accommodation funding through their spon soringorganizations before submitting abstracts. The speakers’ registration and payment is due after the acceptance of thesubmission.

Selection processAll submitted abstracts will be reviewed by the Advisory Boardto ensure a high-quality conference. Submitted abstracts may be selected for oral or poster presentation. Notificationabout acceptance is in January 2014. Submission of the fullmanuscript is due on 12 March 2014.

VenueConference Center Mitte, Nuremberg Messe, Germany

Submission Requirements Awards

Experts from industry and academia are kindly invited to present their latest developments and expectations forfuture trends at the PCIM 2014 conference.

PCIM Europe is one of the most leading conferences addressing the fields of Power Electronics, Intelligent Motion, Renewable Energy and Energy Management.

Here’s your chance to showcase your work, share your expertise and open a dialogue with the power electronicscommunity.

What’s new in 2014?All accepted papers will be included within the Scopus database.

All accepted papers will be listed in IEEExplore.

Invitation

Furthermore, all final papers will be included in the PCIM Europe proceedings and registered at .

1. Power Semiconductors

2. Thermal Management and Packaging

3. Control and Drive Strategies in Power Converters

4. Electronic Power Converters

5. Power Electronics in Automotive, Traction and Aerospace

6. Motors and Actuators

7. Control Techniques in Intelligent Motion Systems

8. Applications for Drives & Motion Control

9. New and Renewable Energy Systems

10. Energy Storage

11. Smart Grid & Communication

12. Power Quality Solutions

13. Power Factor, Harmonics and Flicker

14. Power Electronics in Transmission Systems

15. Software Tools and Applications

16. Passive Components and New Materials

17. Sensors

18. Metering and Diagnostics and Standards

19. System Reliability

All topics and subsections at www.pcim-europe.com/callforpapers

Topics of Interest

Focus of the yearWind and Solar – Integration, Challenges and Solutions 

Submit and win!Deadline for submissions: 15 October 2013

Young Engineer AwardsIf you are 35 or younger: Apply for a young engineer award. The awards for the three best

papers in this category are 1,000 Euros each.

Sponsors

Best Paper Award If you are best: Be invited to PCIM Asia 2015 inShanghai, including flight and accommodation

and receive 1,000 Euros on top.

Sponsors