amd world’s first hbm-powered product sk hynix 3d tsv high-bandwidth memory 2015 teardown reverse...

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Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

September 2015 – Version 1 – Written by Romain Fraux

http://www.systemplus.fr/index.php?lang=ge&page=home.php

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

mailto:[email protected]

AMD High Bandwidth Memory

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Glossary

1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 7

– AMD

3. Physical Analysis 12

– Synthesis of the Physical Analysis

– Physical Analysis Methodology

– Graphic Card 15

– Graphic Card Opening

– Package 18

– View, Dimensions & Marking

– Dies Size

– HBM Logic & DRAM Dies 22

– View, Dimensions & Marking

– µBumps & TSVs

– Package Cross-Section 33

– Package Cross-Section

– PCB & Frame Cross-Section

– Interposer Cross-Section

– GPU µBumps Cross-Section

– HBM Stack Cross-Section (Side Mold, µBumps,

Underfill, TSV)

– Comparison with Samsung 3D TSV DRAM Stacking 67

4. Manufacturing Process Flow 70

– Global Overview

– GPU Process Description & Foundry

– Interposer Process Flow & Foundry

– HBM Stack Process Flow (TSV & TCB) & Foundry

– Flip-Chip & Stacking Process Flow & Assembly Unit

6. Cost Analysis 94

– Main steps of economic analysis

– Yields Hypotheses

– GPU Front-End & Die Cost

– Interposer Wafer Cost

– Interposer Wafer Cost per Process Steps

– Interposer Die Cost

– HBM Front-End Cost (DRAM + Logic)

– HBM TSV Manufacturing Cost

– HBM TSV Manufacturing Cost per Process Steps

– HBM Micro-Bumping Manufacturing Cost

– HBM Micro-Bumping Cost per Process Steps

– HBM Dies Cost (DRAM + Logic)

– HBM Stack Cost

– Final Assembly Manufacturing Cost

– Final Assembly Manufacturing Cost per Process Steps

– Final Component Cost

Contact 120


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the AMD advanced packaging process used for the Radeon

R9 Fury X.

• Featured in the latest AMD graphic card Radeon™ R9 Fury X, it is the world’s first HBM integrated

on chip. The HBM delivers 60% more memory bandwidth, 3x the performance per watt and

consumes 94% less PCB area than GDDR5 according to AMD.

• Led by AMD and SK Hynix, this 3D component integrates HBM memories (connected with via-

middle TSV and micro-bumps) and GPU stacked onto a silicon interposer (including also via-middle

TSV).

• The report include a complete physical analysis of the 3D packaging process, with details on all

technical choices regarding process and equipment (wafer bonding, via etching, via filling, bumping,

underfill…).

• Also, it identify the complete manufacturing supply chain (GPU foundry, Interposer foundry, HBM

Foundry, Substrate manufacturer, OSAT) in order to provide a detailed description of the

manufacturing process with manufacturing cost calculation.


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• Component Manufacturing Supply Chain:


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Thermal Paste

AMD Radeon Fury X with HBM & GPU


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• The dies marking includes the logo of AMD and:

2014

2V5-086203-00

Logic Die Marking


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

o Consulting and Specific Analysis

– North America: Steve LaFerriere, Business Development Manager, Yole IncEmail: [email protected]

– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]

– RoW: Jean-Christophe Eloy, President & CEO, Yole DéveloppementEmail: [email protected]

o Report business

– North America: Steve LaFerriere, Business Development Manager, Yole IncEmail: [email protected]

– Europe: Jérôme Azemar, Business Development Manager, European OfficeEmail: [email protected]

– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]

– Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]

o Financial services

– Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]