implementing electrical and simulation rule checks to ensure signal quality

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Join Matthew Harms as he discusses a unique multi-tiered strategy to board analysis & verification designed to enable designers of all skill levels to analyze their PCB designs early in the development cycle when the cost of change is the lowest. Matthew will show how Cadence has created a multi-tier analysis environment that lets designers start with a set of pre-defined Electrical Rule Checks (ERC) that can be run on the board to quickly identify areas of interest or concern all without the need for any complex models or configurations. Based on these initial 1st order results Matthew will show how design teams can then effectively target critical nets with 2nd order (Simulation Rule Checks) and 3rd order (Power Aware Signal Integrity) analysis as needed to simulate with greater detail and achieve complete electrical design signoff.

TRANSCRIPT

OrCAD Now! AnaheimSignal Integrity Presentation

Matthew Harms

Field Applications Engineer

matthewh@ema-eda.com

Advanced layout check

Coupling

overlay in

layout

Coupling plot

Coupling table

ERCElectrical rule check

SRCSimulation rule check

• SI metrics check is a simulation-based PCB check

• It can be done at 3 levels, based on considerations of trace/via couplings and non-ideal PDN effects

Three levels of SI/PI simulations

SI / PI

simulation

level

Trace coupling Via coupling Power-aware(non-ideal PDN)

SI/PI effects captured

Level 1 NoWithin pair trace coupling

for diff pairs included

NoWithin pair via coupling

for diff pairs included

No

Delay;

Reflection;

Loss

Level 2 Yes Yes No Crosstalk

Level 3 Yes Yes Yes

Return path

discontinuity;

SSO

Electrical Rule Check (ERC)

ERC – Electric rule check

• ERC is a power-aware PCB check in geometry

domain for

– Electrical length

– Trace impedance

– Trace coupling

– Trace upper/lower layer, and coplanar references, or the

lack thereof

– Differential routing in phase, or out of phase

– Via coupling

August 19, 2014 ••© 2014 Cadence Design Systems, Inc. All rights reserved.5

Two trace segments example

DRC – Simplified view

• 2 trace segments, same trace width, same impedance

trace9048

August 19, 2014 ••© 2014 Cadence Design Systems, Inc. All rights reserved.6

Two trace segments example

• DDR3 SODIMM

• 2 trace segments for net DQ0 on

layer3

trace9047 trace9048

Zoom in on 2 trace

segments on

Layer3

August 19, 2014 ••© 2014 Cadence Design Systems, Inc. All rights reserved.7

Two trace segments example

If you look close enough…

• Trace9047: one uniform

impedance section

• Trace9048: 4 impedance

sections

trace9048

Signal layer + plane

layers directly above

and below

August 19, 2014 ••© 2014 Cadence Design Systems, Inc. All rights reserved.8

Two trace segments example

ERC – Impedance

• ERC results also shows

trace9047 has one

impedance section

• But trace9048 actually

has 5 impedance

sections when all layers

are considered

1

2

3

4

5

August 19, 2014 ••© 2014 Cadence Design Systems, Inc. All rights reserved.9

Two trace segments example

ERC – Trace coupling

• Trace9047

broken into 5

sections based

on trace coupling

1

2

3

4

5

1

23

4

5

August 19, 2014 ••© 2014 Cadence Design Systems, Inc. All rights reserved.10

Two trace segments example

ERC – Trace upper/lower layer reference

• Based on upper/lower layer

references

– Trace9047 one section

– Trace9048 5 sections

trace9048

August 19, 2014 ••© 2014 Cadence Design Systems, Inc. All rights reserved.11

Two trace segments example

ERC – Trace coplanar reference

• Both trace do not

have coplanar

reference shapes trace9048

August 19, 2014 ••© 2014 Cadence Design Systems, Inc. All rights reserved.12

Two trace segments example

From 2 trace segments to entire board

Oh, no!

• If ERC results are useful, can you image doing that for the

entire PCB?

• At larger scale, you will need ERC to help you

August 19, 2014 ••© 2014 Cadence Design Systems, Inc. All rights reserved.13

Whole board ERC does not get any easier

1. Load spd file

2. Select option ‘Check all nets’

3. Run simulation

(cont.)

1

2

3

As easy as

Results in 6 tables

ERC with NetGroups

Impedance/Coupling PlotCollapsed

18

Impedance/Coupling PlotExpanded

19

Simulation Rule Check (SRC)

1. Comprehensive and practical for board level electrical design check

2. Easy and fast setup– Simple Tx voltage stimulus and Rx termination models

– Net groups are automatically generated for different interfaces

3. Simulation levels: level1 to level3

4. Results automatically post processed– Rx/Tx/FEXT/NEXT waveform results

– SI performance metrics (using Rx and FEXT waveforms)

– Check report (files, setup, and results)

Simulation Rule Check Overview

Example:

• 1 CPU

• 4 memory channels,

• 8 DIMM

• 420 nets

• Setup time 3 min with 8

automatically generated net

groups

• A DDR design is used in this tutorial– Controller U0, 4 DRAMs U1-U4

Board for tutorial

SRC – Simulation Rule Check

Time-domain waveforms

• The ckt and waveforms and ckt

Rx/Tx/FEXT/NEXT

waveforms

August 19, 2014 ••© 2014 Cadence Design Systems, Inc. All rights reserved.23

• Waveforms

Rx waveform

FEXT waveform

xtkIntISIInt

sigIntratioSN

xtkIntISIIntsigIntdifferenceSN

dttfextxtkInt

dttRxdttRxISIInt

dttRxsigInt

t

i

t

t

t

t

t

__

__

____

)(_

)()(_

)(_

max

max

2

1

2

1

0

0

)()(

)()(

tnexttNEXT

tfexttFEXT

i

i

• SI metrics are defined using magnitudes

of Rx and FEXT

SRC – Simulation rule check

SI metrics

August 19, 2014 ••© 2014 Cadence Design Systems, Inc. All rights reserved.24

SRC – Simulation rule check

Net-level performance ranking

Ranking by SI

Metrics

Ranking by xtalk

levels

August 19, 2014 ••© 2014 Cadence Design Systems, Inc. All rights reserved.25

General SI Workflow

General SI Simulation (GSI) workflow is a newly introduced general purpose Level-1 and Level-2 SI analysis workflow

• Layout based

• Ideal power/ground

• Easy to set up

• Fast simulation

ASI16.63 new: General SI Simulation workflow

How GSI workflow works

• Enable all nets except power net VTT_REF

• Check diff pairs and polarities

Step 1: Select Nets

• Assign power nets voltage

• Voltages for gnd nets are assumed to be 0v

Step 2: Assign power net voltage

• About a component and its models– Component name (from layout file)

– Component part name (from layout file)

– Component types (auto assigned, user can re-assign it)

– Component models (user assigned)

Step 3: Assign component models

Step 4: Set up SI simulation options

• Un-select waveform at driver pins (all pins for U0)

• Leave all receiver pins at DRAMs selected

Step 5: Set up probes

• Check ‘Shape Processing’ if shown– If not shown, the shapes have been

processed and saved

• Check ‘Error Checking’

Step 6: Save

• Layout and simulation setup is loaded to simulator spdsim

• After trace/pad parameters extraction, simulation will start one net/pair at a time– A differential pair is handled in one simulation

Step 7 Running Simulations

• Both pin and pad waveforms are available

Step 8: View results

Simulation considering non-ideal PDN

• SI metrics check is a simulation-based PCB check

• It can be done at 3 levels, based on considerations of trace/via couplings and non-ideal PDN effects

Three levels of SI/PI simulations

SI / PI

simulation

level

Trace coupling Via coupling Power-aware(non-ideal PDN)

SI/PI effects captured

Level 1 NoWithin pair trace coupling

for diff pairs included

NoWithin pair via coupling

for diff pairs included

No

Delay;

Reflection;

Loss

Level 2 Yes Yes No Crosstalk

Level 3 Yes Yes Yes

Return path

discontinuity;

SSO

• Large signal degradation due to non-ideal PDN effect

• Level-2 simulation failed to show it

AddCmd results @U103

Level-1

Level-3

Level-2

Power Integrity Analysis

current density with temperature

awareness

temperature due to Joule (copper) and component heating

PowerDC

• Electrical resistance increases at higher temperatures

• Component leakage power dissipation increases at higher temperatures

Iterate

until

converged

Thermal Simulationtemperature

Electrical Simulationcurrent density

• Copper (Joule) heating will affect temperature distributions

PowerDCIntegrated Electrical & Thermal Co-Simulation

41

Electrical Results

42

• OptimizePI is a highly

automated board AC

frequency analysis

solution

• Supports pre and

post-layout decap

studies and identifies

impedance issues

• Decap

implementations are

optimized for

performance and cost.

OptimizePIOverview

Original Design

Scheme29 (15cents

saving)

78mV

68mV

12% noise

improved

21% cost

saving

Correlation to Time DomainBetter performance at less cost

44

• PowerSI is an

advanced signal

integrity, power

integrity and

design-stage EMI

solution

• Supports S-

parameter model

extraction and

provides robust

frequency domain

simulation for entire

PCB design

PowerSIOverview

45

• Identify impedance

“hot spots”

• Place decoupling

capacitors in areas

exceeding target

impedance

• Analyze power /

ground resonance

• Minimize

component costs

with optimized

decoupling

PowerSIAnalyze Decoupling Capacitor Selection and Placement

46

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