micro systems engineering gmbh - electronica

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Your Partner and Specialist for Advanced Microelectronics

Micro Systems Engineering GmbH

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• MST Group Slide 03

• Micro Systems Engineering GmbH Slide 07

• Design support Slide 15

• Substrate manufacturing Slide 17

• Advanced assembly Slide 24

• Packaging Slide 28

• Analytics Slide 32

Content

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Micro Systems Technologies Group Profile

Companies │ Products │ Services

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Germany

• LTCC substrates

• Advanced assembly

• Semiconductor packaging

• Development and manufacturing of electronic modules

• SMD assembly

Micro Systems Technologies Group• 4 highly innovative technology companies with more than 1100 employees• Solutions for high-reliability applications from concept to serial production

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• High-end flex PCBs

• Rigid-flex PCBs

• Rigid PCBs

• LCP substrates

• Packaging substrates

Switzerland

• Batteries and battery packs for medtechimplants

Germany USA

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Industries Served

Healthcare & Life Sciences Aerospace & Aviation Communications Industrial & Commercial

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Your Miniaturization Specialist …

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Your Miniaturization Specialist …

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… and ONE STOP SHOP, w/• Packaging (organic & ceramic substrate + chip on board + transfer

molding)

• Interconnect (PCB & LTCC)

• Advanced assembly

• Li-I, Li-MnO2 and Li-CFx batteries and battery packs

• Electronic Modules

• Design and development services

• Contract manufacturing and supply chain, full MES control

• Test, validation and qualification services

_

SMALL, SMALLER,

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Value Contribution for Implant Electronics

All mission critical components and services are part of the group.

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Micro Systems Engineering GmbH

Customized solutions in microelectronics

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• We specialize in customized solutions in microelectronics

• We transfer our customers’ design input and requirements to high-level manufacturing processes

We focus on

• Excellent quality

• The right balance of quality, reliability and costs

• Technological leadership

Our Mission

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• 1984 Setting-up of Micro Systems Engineering GmbH (MSEB) in Berg (Northern Bavaria) by Prof. Dr. Max Schaldach, founder BIOTRONIK group

• 1995 Start of LTCC process development

• 2003 Introduction of an automated assembly line for Flip Chip and CSP mounting

• 2007 Prize Winner “Bayerns Best 50”, awarded by the Bavarian Secretary of Commerce

Move into additional building with another 600 sqm clean room and 400 sqm office space

• 2012 Start of SDBGA process development including transfer molding

• 2015 Additional automated SMD assembly line

Extension of production building by 200 sqm clean room

• 2016 Inauguration of latest 800 sqm clean room extension

History

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• Founded in 1984

• 300 employees

• Development and manufacturing of LTCC (Low-Temperature-Co-fired-Ceramics) substrates

• Volume production of sophisticated electronic modules based on organic and ceramic substrates

• Fully automated as well as manual assembly technologies

• A broad variety of semiconductor packaging options

• ISO 9001:2015 and 13485:2016 certified

Facts and Figures

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Covering the full range

• From substrate manufacturing

• Over packaging

• To advanced assembly

Supported by

• Design and engineering

• Comprehensive test and analytics services

• Global material procurement and supply chain management

Business Model

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• 6,000 m2 production facilities in total

• 2,700 m2 dedicated to production – 95% clean room area

• Three SMT assembly lines

• Packaging line

• Several production centers

Production Facilities

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Medical & Healthcare

• Active implants

• Sensors

• External medical devices

• Detectors

Aerospace & Defense

• Radar modules

• TRM modules

• Controller modules

• Processor modules

Microwave & RF applications

• Communication links

• Transceivers

• Voltage controlled oscillators

• Filters

Industrial electronics

• Sensor modules

• Controllers

• Imaging modules

Business Segments

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Product Examples for Various Applications

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Design Support

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Design systems and interfaces

Design Support

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Concepts and design support for the following technologies

• LTCC* Low Temperature Co-fired Ceramic

• Thick film*

• HTCC High Temperature Co-fired Ceramic

• HDI PCB High Density Interconnect Printed Circuit Board

• Rigid-flex PCB

• Full-flex PCB

• Thin film

• MCM Multi Chip Modules

• SiP System in Package

* Substrates manufactured by MSE

• Altium Designer

• CAM 350

• Gerber + aperture table

• Extended Gerber preferred

• DXF

• HPGL

• Graffy/Hyde

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Substrate Manufacturing

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Ceramic Substrate Manufacturing

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Thick FilmLow Temperature

Cofired Ceramics (LTCC)

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Schematic LTCC Process Flow

Via punching > Via filling > Layer printing > Optical inspection

Via punching > Via filling > Layer printing > Optical inspection

Via punching > Via filling > Layer printing > Optical inspection

Via punching > Via filling > Layer printing > Optical inspection

Sta

ckin

g

Lam

inat

ion

Sin

tering

Test

ing

High speed precision puncher

Screen printer AOI Laminationpress

Flying probe tester

>>>>

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LTCC – Fine Line Resolution by Screen Printing

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Whole Area Selected

>>>

Down to 30µm L/S 80µm Lines/Spaces

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LTCC – Integrated Passive Components

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Capacitors Inductors Resistors

• Embedded

• Multilayer

• Up to 20pF/mm²

• 3D

• Planar

• Post-fire (7 decades)

• Buried co-fire

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LTCC – Metal Brazing

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Metal plates Frames Pins

• Housing

• Heatsinks /thermal management

• Hermetic packages

• Shielding

• Connectors

• Board connection

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LTCC – Cavities and Windows

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Windowsrectangular, stepped

Laser cutting / scribing in green state

Machining after firing

Accuracy ± 0,130 mm Accuracy ± 0,010 mm

X ± 0.01

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Advanced Assembly

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Three automated SMD assembly lines

• Any board material• Plasma & IPA cleaning available• 01005 up to 85x85 mm2

• Flip chip / CSP capability

Advanced Assembly – SMT

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Die attach

• Gluing (epoxy printing/dispensing, pre-forms, stamping)

• Soldering (solder printing/dispensing, pre-forms)

• 6 high precision die bonder systems, fine placer

Wire bonding

• Thermosonic Au wedge/wedge

• Ultrasonic Al thin/thick wire

• Thermosonic Au ball/wedge

• Special wires

Advanced Assembly – Die Attach and Wire Bonding

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Au wire ball wedge bonded

Finepitch 60µm Al wedge/wedge bonded

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Die Protection / Encapsulation

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Technologies

• Glob top (Temp./UV-Curing)

• Underfill (LTCC, PCB)

• Junction coating

• Transfer molding

• Soldering/gluing (cover, lid)

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Packaging

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Packaging

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I/O-configurations• Ball• Land Grid Array• Castellation• SIL/DIL• QFP

BGA Packages

• Stacked die BGA (double and triple stack)

• High voltage BGA (800V) isolation

Housing

• Non-hermetic(Plastic/metal cover,organic coating)

• Hermetic (soldering)

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Transfer Molding and Laser Marking

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Laser marking• Codes marking & scanning:

1D, 2D, BMP, JPG

• PCB fiducial recognition and positioning

Transfer molding FICO MMS-W• Mold thickness 650µm or 900µm,

other mold sizes on request

Molded substrates Wire bonded substrates loaded

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System provides multiple operations• Strips supplied in magazine

• Dicing

• Cleaning

• Top side AOI

• Bottom side AOI

• Sort to JEDEC trays or bins

Dicing Fico ISS Package Saw

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Analytics

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Analytics

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X-Ray and CT

• 01005 and fine-pitch inspection

• Combined 2D / 3D CT-operation

• Solder joint analysis

• Package inspection

Scanning Acoustic Microscopy

• Detection of delamination, cracks, voids and porosity

CT of a triple stack GE PHOENIX Nanome|x

SonoScan D9500 C-SAM of a double stack

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Internal services

• Optical surface scan

• Cross sectioning

• Temperature cycling

(-65°C/+250°C)

• Hermeticity test

External services

• SEM/EDX

Analytics

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• Wire pull test

• Component shear test

• Flying probe tester

• Contamination measurement

• X-ray fluorescence method

Cross section of a triple stack

Wire pull test

SEM analysis

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Quality Management

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ISO 9001:2015Design and manufacturing of microelectronics circuits for high-reliability applications

Valid thru 2021

First certificate: ISO 9002:1990 in 1993

DIN EN ISO 13485:2016Design, development and production of microelectronic circuits for medical devices

Valid thru 2021

First certificate: DIN EN 46002:1992 in 1993

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Research and Development

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MSE has been participating in various government funded research and development projects to maintain its leading position in the electronics world.

In addition to other projects, we currently work on

Miniaturized and energy autonomous sensor elements based on complex 3D-shaped LTCC substrates to facilitate real time supervision of wind turbine shaft systems

Multi material systems for enhanced sensor integration and miniaturization based on ceramic substrates by additive manufacturing processes

Plastic films by combining printing technologies

BiSWind

MultiMat3D

MecDruForm

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Selected References

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• BIOTRONIK, Germany

• Brookhaven National Laboratory, USA

• DIEHL BGT Defence, Germany

• KETEK, Germany

• MEDEL, Austria

• ROHDE & SCHWARZ, Germany

• RUAG Space, Sweden

• SAAB, Sweden

• SEW Eurodrive, Germany

• Siemens, France

• TESAT, Germany

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www.mst.com

info.msegmbh@mst.com

Micro Systems Engineering GmbH

Thank You for Your Attention

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