pcb design and fabrication trends –telecom, networking &...
Post on 17-Aug-2020
7 Views
Preview:
TRANSCRIPT
PCB Design and Fabrication Trends – Telecom, Networking & Computing
• Imaging accuracy• Plating quality• Etching accuracy• Lamination tolerance• Drilling tolerance• Registration & dimensional
tolerances• New process innovations• Cu surface & oxide treatments• Measurements
• Imaging accuracy• Plating thickness• Etching accuracy• Lamination tolerance• Soldermask• Chemistries• Chemical residue• Registration• New process innovations• Cu surface• Measurement methods
• Faster data rates • Wide frequency range • Hybrid stack ups• HDI & Anylayer technologies• Fine pitch for <0.5mm• PCB with cavities• High aspect ratio (1:20 – 1:25)• Stub length ≤6±4mil• Sub 3.5/3.5mil line/space• Impedance Zo control ±5%• Large format BGA (>70mmx70mm)• PAM-4 requires tight Z control (RL)
• Cu surface roughness • Extreme low loss (FR-4)
materials (Df<0.002)• Spread and low Dk glass• PTFE, LCP etc.• Flexible materials• Material properties and
tolerances (e.g. Dk, Df, thickness, TCDk etc. )
• Skew (e.g. spread glass)• Halogen free materials• Dimensional stability
• Inlay and different coin structures
• High thermal conductivity materials
• Heavy plated vias• Via farms• Flexes/rigid flexes• Hybrid constructions• New process & cooling
innovations
SI, PI & EMI Feature Thermal MGTRF Laminate
PCB designs heading towards convergence of RF & digital with a need for thermal management solutions
Shrinking geometries Tightening tolerancesLower noise budget Lower total loss budgetComplexity
PCB Design and Fabrication Trends – Smart Phone and Portable Devices
100µm 70µm 60µm 50µm 25µm 15µm
Microsecond FIR CO2 (High via density/high volume)
Nanosecond UV + CO2 process (Low via density/low volume)
Nanosecond UV lasers (Low via density/Flex & rigid flex)
2017 - 2019 2020+
Glass reinforced dielectrics
Non-reinforced dielectrics
Picosecond lasers (Ultra small via)
Femtosecond lasers (Ultra small via)
Today Development Future solution
USP technology enables smaller HAZ
75/75 50/50 40/40 35/35 30/30 25/25 20 15/15 10/10
PackageSLPHDI PCB
Patterning
Imaging
Subtractive Advanced subtractivemSAP Advanced mSAP
SAP (primer)/SAP (ABF)/SAP (Dry)Embedded trace, coreless, etc.
HDI/SLP – Laser Drilling
HDI/SLP Pattern Formation & Imaging
DI & LDI ExposureStepper exposureUltra thin dry film technology
Line [µm]
Key smart phone PCB miniaturization drivers are; Increasing complexity of the advanced semiconductor package technology , battery capacity expansion & antenna integration and placement
Portable PCB/SLP Technology Trends
PCB Design and Fabrication Trends – Automotive
RegistrationEtching
Surface treatments
LaminationDrilling
Cleanliness
Imaging Etching
Patterning
ADAS/Automated Driving Electrification Digitalization/Infotainment
Material Technology
Diversity – Functionality – Complexity – Miniaturization - Connectivity
Now 77 – 81GHz, Next Gen up to 140GHz) Cu surfaceHybrid stack-upHDI (≤0.4mm) & anylayer technologies
A few 100A and 400/800/1200VdcHeavy CuStandard HDICAF
25/56Gbps (13/28GHz)≤0.4mm pitchAdvanced HDI technologyNew Surface finishes
R E L I A B I L I TY T H E R M A L M A N A G E M E N T• Harsh environment • Longer T/H/B impact (>100000hrs)• Space between conductors (e.g. CAF)
• Increasing temperature load (up to 170C) and hotspots
• Local anisotropic heating e.g. power lines.
• Increasing temperature load (up to 170C) and hotspots
• High voltage CAF testing (+1000V)
• EV power train high voltage electronics
• Smaller feature size (hot spots)
top related