powerful administrative functions. real time alert systems (option): statistical systems: ict...
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Powerful administrative functions.
• Real time alert systems (option):
• Statistical systems:
• ICT console (option): • Remote access test results data and their statistic charts to support manager analyze production problems, adjust the engineering process or trace back fail components to meet the key issue, original problem solving strategy.• Edit and debug test program at remote side.
Automatic generate useful production administrative charts, such as components test value distribution charts, daily charts, period charts, test pins fails ranking, failure component ranking and test coverage rate analysis…etc.
PRG. DEMOPRG.
DEMO
Alert when meets criterion of test fails.
Board View functions.
• Physical tested board display on screen monitor.
• Board view functions:
• Pin edit function:Show the physical outline of fail pins and their relative circuit and components to find the failure points or components easily.
Support smart board view function for trouble shooting station needs. See demo program for details.
Support fail components physical outline on screen to make the trouble shooting work more easier.
PRG. DEMOPRG.
DEMO
Test program generator.
• Test Program Conversion:
• Auto learning functions:
Auto learning for items of Open/Short, Component, IC, TAJ, ECJ respectively, then generate test program and their guarding points up to 95% automatically. It can save huge test program debugging and tuning time.
ATPD: Automatic Test program Debug.
PRG. DEMOPRG.
DEMO
Direct import CAD data from FABMASTER or other ICT test program from TRI、 JET、 OKANO、 TESCON、 TCO-5….etc, and convert them to ICT360AT test program directly.
Unique test functions.
• TA Jet :
• EC Jet :
• 4 wires mini ohm measurement:
• Up to 0.05Ω,mini ohm grade measurement.
• Explosion free capacitor: 100% missing part and polarity reverse detect rate.
• Parallel capacitors: 100% missing part and polarity reverse detect rate.
• BGA IC test approach to 100% coverage rate.
• SMD Connector test approach to 100% coverage rate.
• Intel 845 north bridge approach to 100% coverage rate.
PRG. DEMOPRG.
DEMO
Compatibility
• TAJ / HPJ compatibility.
• ECJ Fixture :
• Test program conversion :
Import from TRI / JET / OKANO / TESTCON / TCO-5 test program or Fabmaster CAD data to generate ICT360AT test program directly.
Just remove the ribbon connector cable from MUX card of HPJ system and plug it into Switch Card connector of TAJ system.
Add 3rd pin on upper side of the fixture for contacted the surface of each electrolytic capacitors.
PRG. DEMOPRG.
DEMO
PRG DEMOPRG DEMOReview
• ICT360AT evaluations(Excel) EXITEXIT
Powerful administrative functions.
Trouble shooting auxiliary.
Excellent Compatibility.
Return from investment.
CompareCompare
Automatic test program debug.
Unique test function.P4 EVAL.P4 EVAL.
EC JetEC Jet
TA JetTA Jet
Evaluations
Evaluations
• Quality Alert system / Statistic system / Remote console.
• Board View function / Show No-Go parts on screen monitor. • Test Pin edit function.
• Import from other Test Program or CAD data from fabmaster.• Automatic test program learning.
• TA Jet / EC Jet / Mini ohm measurement.
• TAJ / HPJ compatibility / ECJ fixture / Test program conversion.
ICT360AT supports 7 kinds of charts:
Statistical charts.
Daily chart.
Period chart.
Distribution chart.
IC measure value distribution chart.
Rank for bad pins of the bed of nails.
Rank for fail components.
Coverage rate analysis chart.
Statistical charts Performance.
Test program tuning as well as upper/lower limits setting for each test step.
Tested board quality monitoring and production problems real time tracking.
Components quality monitoring and problems trace back (ISO9001).
Test pins quality monitoring and probe replace indication of the Bed of Nails.
Fixture convert for TAJ and HPJ .
HPJ wiring. TAJ wiring
MUX CardMUX Card SWCSWC
Decoder Card
Decoder Card
Convert TAJ to HPJ: CASE 1
HPJ TAJ (HPJ fixture wiring application on ICT360AT.)
No such as Intel north bridge package IC, connector plug to SWCof ICT360AT directly. I.e. 100% HP pad compatible.
Convert TAJ to HPJ: CASE 2
HPJ TAJ (HPJ fixture wiring application on ICT360AT.
Board pasted with IC package such as Intel North bridge.
Drilling 3rd hole for TA pad application and pull HP pad downthen replace TAJ pad up. Then
i. Pin+ / Pin- connect to Decoder Card of ICT360AT.ii. Connect 3rd pin(Sync pin) connector to Switch Card of
360AT.
Convert HPJ to TAJ: CASE3
TAJ HPJ (TAJ fixture wiring application on HPJ fixture.
• Replace TAJ pad to HPJ pad.
• Connect TAJ pad Pin+ / Pin- fixture connector of ribbon cable to MUX Card connector.
• Leave 3rd Pin connector open circuit.
Test Programming PreparationThe preparation for fixture making
1. CAD file or Gerber file of DUT2. BOM of DUT3. Bare board and assembled board
(For high precision or multi-layer board, CAD file is recommend)
Check list for fixture making 1. The probe for ECJ test should be Spherical type with long stroke and low
spring force, the location of the probe should be precise.2. The pitch of probe tube and the connection of the array-pin for TAJ test
should be correct and can easily convert to HPJ test.
Test programming preparation
1. DUT: 1 bare board, 20 assembled boards. 2. Pins diagram of fixture3. BOM of DUT 4. DUT circuit diagram(Option) 5. The files at right should be provided by fixture maker.
*. DAT *.ICN *.ICP FORMAT.ASC NAILS.ASC NETS.ASC PARTS.ASC PINS.ASC
EC Jet
On board electrolytic capacitor polarity and
missing parts inspection.
ECPD Technology( Electrolytic Capacitor Polarity Discriminating Technology .)
The challenges on production line.
Traditional ICT test systems.
1. Very low Electrolytic Capacitor polarity discriminating rate(30%-50%) .
2. Unable to find out the capacitor miss part during the test.
Missing Parts.
Wrong Orientation.
Challenge on production line.
Inspecting by human eyes not only
waste of time and money but also un-
reliable as well.
Traditional ICT Electrolytic Capacitor discriminate method.
Traditional ICT Electrolytic Capacitor discriminate method.
2 Terminals Leakage Current detect Method.
2 Terminals Leakage Current detect Method.
3 Terminals impedance
detect method.
3 Terminals impedance
detect method.
HP TestJetInduce method.
HP TestJetInduce method.
+M
~
Z-Z++
I+
+
I-
+
Characteristics of EC Jet.
For EC Polarity Discriminating Rate = 100%.
Explosion free EC Polarity Discriminating rate = 100%.
Ultra High Speed, on board 50 Capacitors Test time < 2 sec.
Parallel EC missing part detective ability.
EC Jet know how.
~
Signal source Response Signal
BLACK
BOX
Un-know network analysis model.
~
M
T(time)
V source
T(time)
VResponse
FFTDFT
Principle of EC Jet technology.
DSP
Pattern Match
~
M
F(freq.)
V
F(freq.)
VDUT
STD
Digital Signal Processing.
T(time)
V Source
T(time)
VResponse
Principle of EC Jet capacitor miss detection.
DSP
Pattern Match
~
M F(freq.)
V STD
DUT
F(freq.)
V
n
n
CnCt1
Why parallel capacitors missing parts can not be found?
Tolerance of electrolytic capacitance = -20% ~ +50%
Vcc
C1 C2 C3 C4 Cn? ? ? nn CC ?
Test limitations of EC Jet.
Temperature.
Parallel Capacitor
Explosion free capacitor
DUT with normal temperature between 0° ~ 55°C , failure rate = 0, 100% able to test.DUT with temp > 80°C , failure rate : about 20%
DUT with temp >60°C , failure rate : less than 5%
Huge value of capacitor affect the testing time (15-20ms /PCS), due to sampling time is a little longer.
Explosion free capacitor needs long testing time.
Due to the polarity characteristics of explosion free capacitor is not so clear as normal capacitor.
Testing time as long as 200 ms/ pcs.
Benefits of EC Jet.
Use old ICT: JET300 TR518.
Use EC Jet.
Instead of human Eyes Inspection.
Getting higher quality.
Use EC TestJet
Save 2 ~ 3 Operators.
Less Effort.Less Effort.
Higher Quality.Higher Quality.
TA JetApply the theory of electrostatic
strength measurement to detect the solder joint’s open / contacted BGA
pins up to 100%.
What’s the difference between TA Jet & HP TestJet?
TA Jet HP TestJet
TheoryElectrostatic
measurement.Capacitor coupling.
Signal Processing. Through SW CARD Through MUX CARD.
No. of Test Terminals.
3 2
Sensing signal ratio of contacted/open. 20~30 times, High. 10~15times, Low.
Test Frequency.2K~10K automatic
adjustable.Only one frequency at
10KHz.
Cost USD3,000- USD10,000-
MUX Card cost. No USD100/ board.
Sensor pad price. USD35/set USD35-85/set.
Know how(I)
MUX CARD
M
(Current Pre. AMP.)
SWITCH CARD
M
(Synchronous Detector AMP.)
HP TestJet
TA Jet
Know how(II)
HP TestJet
TA Jet εElectrostatic
strength. (V/m)
Measuring the capacitance between bonding line and HP sensor
pad. (fF)
Solder joints Contacted / Open sense level.
TA Jet testing ability is over 20 times of HP Test Jet.
SMD coverage rate.
FQFP, SOJ, SOP, PLCC
HP TestJet test results : good.
TA Jet test results : excellent.
BGA coverage rate.
HP TestJet
TA Jet
A
A
ε
ε Coverage rate up to
100%.
Unstable to test under 100fF level.
Normal IC
BGA
Intel 845(North Bridge) coverage rate.
HP TestJet about 10%
level.
Ad
d
ε
TA Jet coverage rate up to 100%.
r
SWITCH CARD
M DSP
Intel 845(North Bridge) Coverage Rate.
Intel 845(North Bridge) coverage rate.
TA Jet
SWITCH CARD
M DSP
V
F
Contacted
BGA845
NoiseOKopen
SMD
fs
SCSI / PCI SMD Connector.
HP TestJet
TA Jet
Benefits of TA Jet
• Up to 100% BGA pins of solder joint’s Contacted/ Open inspection.
• Up to 100% Intel 845 BGA pins of solder joint’s Contacted/Open inspection.
• Up to 100% SCSI / PCI SMD connector solder joint’s Contacted/Open inspection.
• Make sure where the true BGA failures are.
Parallel pins.
If circuit impedance small than 10ohms, the stimulus signal can not apply to almost a short circuit.
Logically BGA parallel pins are same circuit, we can not discriminate if one of them is open circuit.
Circuit impedance.
BGA relative components.
If the BGA relative component in O/S, missing part, wrong part fail, it may affect the test value of BGA.
Limitations of BGA Open/contacted test.
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