rescoll - metalmorphosis€¦ · dynamometers (static and fatigue, 100n to 250kn) metravib dma+150....
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RESCOLL
Leading to competitiveness trough innovation in materials and processes
About RESCOLL
RescollA group of service companies performing R&D, manufacturing, analysis and characterisationto support the industry with competitive innovation
MARKET SEGMENTS
25% 10%
55% 10%
HEALTH
AEROSPACE ENERGY
OTHERS
Define specifications & suggest partners
Develop your product in laboratory
Validate materials, processes and products
Pilot & Manufacture
Quality control
3 TRL 9
Wich is our global offer?
RESCOLL GROUP
ADVANCEDCOATINGS AND GLUES
INNOVATIVE MACHINED PRODUCTS
Machining
Innovative formulations (high TRL)
Diversification in the medical field
TRL 3 TRL 6 TRL 9
MAINTENANCE AND ELECTRONICS
ONGOING MERGER
Increase the range of
characterizations
Industrialization internal R&D
RESCOLL IN FIGURES
7000m²
15 M€ 150
INVESTMENT / YEAR
TURNOVER ENGINEERS & TECHNICIANS
FACILITIES
1.5 M€
>15%
ANNUAL GROWTH
FOR THE LAST 3 YEARS
CAPACITIES
Synthesis lab
Extrusion, compounding, formulation
Composites prototypes manufacturing
Machining
Coatings & adhesives
Thermo-mechanical Analysis
Chromatography & TOC
Spectrometry
Components robustness
VibrationFire testing
Mechanical characterisation of coatings
Mechanical testing
CAPACITIES
Regulatory issues
LCA, Eco-design, ETV
CAPACITIES
CONFIDENTIAL 10
And CERTIFIED: ISO 9001 (all activities) ISO 17025 (for Analysis and Characterisation) ISO 13485 NADCAP ISO 17020 (for Environmental Technology Verification ETV)
QUALIFIED by:
QUALITY MANAGEMENT SYSTEM
Bonding Technologies Surfaces
Adhesives
FUNCTIONS
Process
Aging
Testing, and validation and qualification
Training
BONDING – CHALLENGING INNOVATIONS
Increasing use of joining of dissimilar materials in new industrial developments:
• Lightness• Better load distribution (compared to other joining techniques)• Less impact on substrates (curing temp, no drilling)• Good sealing
Bonding is a key solution identified in technological roadmaps of major aircraft manufacturers, since bonding means
But several challenges exist• E&T conduction• Debonding on Demand• Limited temperature resistance (polymeric materials)• NDT• Vibroacoustic damping• Surface treatments• Durability and roboustness
Anticorrosion
Bio-active
SURFACE Technologies -
COMPETENCES MAIN EQUIPMENT
Synthesis labFormulation and application labs20L double-walled thermostated reactorClean roomAutoclave reactorSchlenk linePlanetary mixerCoating characterization equipment(surface profilometry, nanoscratch, nanoindenter, hazemeter, surface thermodynamics, fire behavior, aging…)
Adhesion
RESEARCH AREAS
Protection
Deposition techniquesSurface pre-treatment (sanding, degreasing, plasma, laser …)Coating (spin-coating, dip coating, spraying)Polymerisation kinetics(temperature, IR, UV)
Surface functionalizationSurface treatmentVarnish and paint formulationSol-gel synthesisPrimers
Catalysis
Anti-fingerprint
Sustainable chemistry
Optics
Mechanics
Anti-scratch
Our core expertise
Top CoatChromated Primer
OAC
Hand operatingspraying
Electrostaticspraying
SURFACES TechnologiesCorrosion Protection coating
Why:- Be compliant with REACH and replace Chromium Cr(VI) based treatment- Ensure a corrosion protection of Aluminium/CFRP assemblies- Act as primer
Durability
Processes
ADHESIVES TEAM
COMPETENCES MAIN EQUIPMENTBonding and surface preparation labsTable-top surface treatment stations (chemical) and plasma activation systemsPlanetary mixers (2x250g and 2x830g capacity)Dissolvers equiped with vaccuum chamber3-roll millBonding jigsDosing and adhesives dispensing systemsCuring ovensUV Fusion benchDynamometers (static and fatigue, 100N to 250kN)METRAVIB DMA+150Climatic chambersUltrasonic NDT
Adhesion
RESEARCH AREAS
Biobasedmaterials
Benchmarking & Processdevelopment
Benchmark and selection of best bonding solutions
Production of bonded assemblies (test coupons and products)
Development & qualification of bondingsystems and processes
Formulation
Established expertise in debonding on demand
Development of customizedformulations (conductive, fireresistant, REACh compliant, biosourced)
Structural adhesives NDT
Debonding on demand Smart adhesives Structural Health
Monitoring
REFERENCES IN THE AUTOMOTIVE SECTORMICHELIN, VALEO, COOPER AUTOMOTIVE, PLASTIC OMNIUM AUTO EXT, FIAT AUTO
ADHESIVE TechnologiesConductive structural adhesives
Why? The increasing use of functionalised composites: ESDLightning protection, Heat dissipation
Rescoll developed structural adhesives ensuring the same functionality as those of the materials they have to assemble, i.e. electrical or thermal conductivity.
Industrial structural adhesives with disassembling function
3 Temperature ranges
Compliant with several adhesivenatures
INDAR (INnovative Dismantling Adhesives Research)
More details: JEC COMPOSITES MAGAZINE – ISSUE #46 –January-February 2009
Industrial structural adhesives with disassembling function
INDAR (INnovative Dismantling Adhesives Research)Development of a structural debondable adhesive for ground testing of GAIA SiC structuree
Thermal activation of the bonded
system
Training -Transfert Process qualification and ground testing
Industrial structural adhesives with disassembling function
Development of a structural debondable adhesive for: • LEAP (Leading Edge Aviation Propulsion) and • Open Rotor projects
Industrial structural adhesives with disassembling function
Debondable structural Assembly of Ti/Composite
BONDING – Electrical and/or Thermal conductivity
Adhesives : insulative materials
Formulation mandatory to get electrical or thermal conductivity
Numerous products available on the market but they are :• Expensive (costs of fillers)• Dense (fillers)• Not suitable for use in structural applications
There is a need for new cheap adhesives, with lower density and bettermechanical strength
THERMAL CONDUCTIVITY
BONDING – Electrical and/or Thermal conductivity
BONDING – KEY PROJECTS
E&T CONDUCTIVITY
24
BONDING – KEY PROJECTS
E&T CONDUCTIVITY - Requirements
2 adhesive formulations validated by end usersand now part of STRUCTIL’s port-folio
Electrical ConductivityS/cm
Thermal ConductivityW/mK
Lap Shear StrengthMPa
Specs for Thermal Adhesive 1.10E-5 to 1.10E-3 >4 >9
Base Material (unmodified adhesive) 1E-15 0.2 24
Thermal Adhesive 6 4.4 10
Electrical ConductivityS/cm
Thermal ConductivityW/mK
Lap Shear StrengthMPa
Specs for Structural Adhesive
>100 >0.8 > 15
Base Material (unmodified adhesive)
1E-15 0.2 24
Structural Adhesive 300 1 19
BONDING – LARGE SERVICE TEMPERATURE
Development of Room Cure 2 Component Epoxy Adhesives with Extended Service Temp
Adhesives are polymers: limited high temperature resistanceGenerally , the higher the curing temperature the higher the thermal resistance (Tg)
However:• Several components of top class epoxy formulations may not be REACH compliant
in the near future• Many applications allow limited temp curing (<80°C), especially in ASD but wide
service temperature range (eg: -90 to +150°C)
Need for better understanding of the interaction between curingconditions, adhesive composition and final thermomechanicalproperties
New adhesive formulations based on up-to-date components (resins, hardeners, tougheners, etc.)
BONDING – KEY PROJECTS
Development of Room Cure 2 Component Epoxy Adhesives with Extended Service Temp
Study on « Tougheners » :Core-Shell RubberBlock Copolymers (CTBN and others) Nanosilica
Relationship between network chemical structure and thermomechanical properties of the epoxy adhesives:
-Curing conditions: 23°C / Température impact on thermomechanical properties
-Components Resins : DGEBA, novolacs, … Hardeners : polyamidoamines, polyetheramines, …
0
5
10
15
20
25
-90°C 25°C 90°C
LSS
(in M
Pa)
Testing Temperature
LSS after 7 days @ 23°C
Non modifiéRenforcé
15
20
25
30
35
1,00 2,00 3,00 4,00
LSS
(in M
Pa)
Crosslinking Density (mol/kg)
Lap Shear Strength after 1h @ 150°C
BONDING – KEY PROJECTS
Development of Room Cure 2 Component Epoxy Adhesives with Extended Service Temp
Example of Results
-Curing conditions: 23°C / Température (<80°C)
-Gel Time >60min @ Room Temp
- Typical peel resistance >50N/cm @ Room Temp
-LSS > 10MPa between -70 and +150°C (on chemically etched 2024 Al)
0
5
10
15
20
25
30
35
-100 -50 0 50 100 150 200
LSS
(in M
Pa)
Temperature (in °C)
Curing: 1h @ 80°C
Energy - H2 Storage & Oil Transport
Other Applications - Small Aircraft Transport
BONDING – Novel Quantitative NDT
Laser Shock NDTGeneration of localized traction loads• Quantitative NDT• Detection of kissing bonds
Time
COMPOSITE COMPOSITEJOINT
Shock
Traction
LASER
ShockWave
Free Surface
• Strong interface No damage• Weak interface Interface failure
Experiments
1. Identification of debondinglevels
2. Characterization of the assemblyresponse
SIMULATIONS
1. Validation of models
2. Complete understandingand control of phenomena
OPTIMISATION
1. Definition of optimum shock configurations per assembly
2. Definition of laser parameters
CONCLUSIONS
BONDING: a key technology for joining of dissimilar materials
But new assemblies need to optimize synergies of materials benefits (strength, lightness, conductivity, fatigue resistance, etc.), adhesives needs to be multifunctionnal
Stronger regulation pressure on materials manufacturers, especially adhesive formulators. Riskof obsolescence of old high performance formulas in the near future
More regulatory pressure on goods manufacturers regarding end of life• Needs for recycling, especially new and widespread dissimilar assemblies• Easier recovery/maintenance of parts is targeted to extend product life span
Debonding on command gives an open choice to engineers and designers for materialsassembling: adhesive may be considered for applications where lack of reversibility is a No-Go
In a few words, future multifunctionnal structural adhesives will bringmore service performance/reliability and complete loss of adhesion by thepush of a button!
For further information:
RESCOLL Research Company of Materials
Konstantin Sipos
e-mail: sipos@rescoll.fr
www.rescoll.fr
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