sst-1 data acquisition & control
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SST-1 Data Acquisition & Control
H D Pujara
Institute for Plasma Research
pujara@ipr.res.in
Institute for Plasma ResearchInstitute for Plasma Research
Plan of the Talk
Brief Introduction of SST-1
Objective of data acquisition and Control
Timing System
PXI & CAMAC based Data Acquisition system
Major Constituents of Control systems
Software aspects
ADITYAADITYA SINP SINP TokamakTokamak Major Radius R0 0.75 m 0.30 m Minor Radius a 0.25 m 0.075 m Toroidal Field BT 1.50 T 2.00 T Plasma Current Ip 250 kA 75 kA Pulse Duration 250 ms 20-30 ms Plasma Cross-section Circular Circular Configuration Poloidal Limiters Poloidal Limiters Coils Type (TF & PF) Copper Water cooled Copper Current Drive & Heating Ohmic Transformer Ohmic transformer
(Air Core) (Iron Core) Vacuum vessel Vessel with Electrical break Conducting Shell Design & Fabrication Indigenous M/S Toshiba, Japan Installation 1989 1987
Indian Tokamaks
ISOMETRIC CUT- VIEW OF SST-1
SST1 MACHINE PARAMETERS
MAJOR RADIUS : 1.1MMINOR RADIUS : 0.2 MELONGATION : 1.7-2TRIANGULARITY : 0.4-0.7TOROIDAL FIELD : 3TPLASMA CURRENT : 220 kA. ASPECT RATIO : 5.2SAFETY FACTOR : 3AVERAGE DENSITY : 1X 1013cm-3
AVERAGE TEMP. : 1.5 keV
PLASMA SPECIES : HYDROGEN
PULSE LENGTH : 1000s
CONFIGURATION : DOUBLE NULL: : POLOIDAL DIVERTER
HEATING & CURRENT DRIVE: LOWER HYBRID : 1.0 MWNEUTRAL BEAM : 0.8 MWICRH : 1.0 MWTOTAL INPUT POWER : 1.0 MW
FUELLING : GAS PUFFING
CRYOSTAT
VACUUM VESSEL
LN2 PANELS AND SHEILDS
VACUUM SYSTEM
TF M AGNETS16 SUPER CONDUCTING
PFM AGNETS9 SUPERCONDUCTING
SUPERCONDUCTINGM GNETS
TR1 OR CENTRAL SOLENOID TR2 TR3
OHM IC TRANSFORM ER VERTCAL FIELD COILVF1, 1 PAIR OF COILS
OUT SIDE COILS
RADIAL AND VERTICALCONTROL COILS
PF6 M AGNET
INVESSEL COILS
COPPER M AGNETS
M AGNET SYSTEM
LIQUID NITROGEN SYSTEM
LIQUID HELIUM SYSTEM
CRYGENIC SYSTEM
M ACHINE SUPPORT STRUCTURE
CENTRAL SUPPORT STRUCTURE
TF SUPPORT STRUCTURE
SUPPORT STRCTURE
ICRH
ECRH
NBI
AUXILARY HEATING SYSTEM
DIAGONATICS
DATA AQUISISION AND CONTROL
POW ER SUPLY
SST-1
MAJOR RADIUS = 1.1m MINOR RADIUS = 0.2 m
ASPECT RATIO = 5.5 ELONGATION = 1.7-2
TRIANGULARITY = 0.4-0.7 TOROIDAL FIELD = 3T
PLASMA CURRENT = 220 kA
AVERAGE DENSITY = 1X 1013cm-3
AVERAGE TEMP. = 1.5 keV
PLASMA : HYDROGEN
PULSE LENGTH : 1000S
MACHINE PARAMETERSMACHINE PARAMETERS
Vacuum Subsystem
Vacuum Vassal made up of
16 Wedge shape sections
16 Interconnection ring
• Cryostat
• Pumping system
• Gas Feed System
• VESSEL SECTOR : 1
• INTERCONNECTING RING : 1
• TOP VERTICAL PORT : 1
• BOTTOM VERTICAL PORT : 1
• RADIAL PORT : 1
• RADIAL PORT FLANGE : 1
• RADIAL PORT BLANKING
FLANGE : 1
VACUUM VESSEL MODULEVACUUM VESSEL MODULE TOP PORT
RADIAL PORT
VESSEL SECTOR
VESSEL RING
BOTTOM PORT
BLANKING
FLANGE
PORT FLANGE
SST1 CRYOSTAT
Cryostat Parameters:
Vertical Height : 2.6 m
Outer Diameter : 4.4 m
Inner Diameter : 0.355 m
Wall Thickness : 10 mm
Total Surface Area : 59 m2
Total Volume : 39 m3
Total Weight : 4520 kg
Material : SS 304L
SST-1 MAGNET SYSTEM
Supercondcting Magnets:
• Toroidal Field (TF) Coils : 16 Nos.
• Poloidal Field (PF) Coils : 9 Nos.Copper Magnets (Water Cooled) :
• Ohmic Transformer (TR) Coils : 7 Nos.
• Poloidal Field (PF ) Coils ( in-Vessel): 2 Nos.
• Position Control Coils ( in-Vessel) : 2 Nos.
Requirements:
• Confinement, Shaping and Equilibrium Fields
• Ohmic Flux Storage
• Feed-Back Control
Coil type
#
coils
Coil
Radius (m)
Vertical Location
(m)
Winding Cross-section (mm2)
#
turns
PF1 1 0.45 0.0 71x320 80 PF2 2 0.45 0.43 71x163 40 PF3 2 0.50 0.93 136x380 192 PF4 2 1.72 1.03 85x136 40 PF5 2 2.01 0.65 85x136 40 PF6 2 1.35 0.35 100x100 16
SST-1 Poloidal Field CoilsSST-1 Poloidal Field Coils
Design Drivers:Design Drivers:
•Support single & double null equilibria with wide range of Triangularity ( 0.4-0.7), Elongations ( 1.7-1.9), li (0.75 -1.4), p ( 0.01-0.85) & slot divertor configuration
• Limiter operation during Plasma current ramp up
Parameters of PF Coils
Gas feed System
• Plasma of Hydrogen gas• Gas fueling during normal operation of
1000 sec.• Uniform gas distribution. • 28 pizo electric gate valve around the
machine.• Plasma Density control for constant density• Online feed control by adjusting gas flow.
Auxiliary Heating system• Lower hybrid current drive (LHCD) system. - Responsible for driving the plasma and maintain
current for 1000 sec.-One Megawatts of CW power at 3.7Ghz-Two High Power Klystron, each delivering 500KW
- Ohmically driven Ip (110KA to 220Kam) will be Taken over by LHCD
- Circular plasma will be shaped with PF coils- Will be lunched through redial port to a grill of 64
wave guides- Pressured transmission line to avoid the Breakdown
Ion Cyclotron Resonance Freq.• Tetrode based 1.5 MW ICRF system. • Frequency of operation 20 to 92 MHz• Temp of 1.0KeV• Lunched through radial port, four antennas 375Kw
each • Pressurized 90 meter long & 9 inch dia 50 ohm
transmission line• Online stub and frequency matching for optimum
power transfer.• Reflected power will be compensated with hike in
input RF power.
Electron Cyclotron Resonance Freq. Heating.
• Gyrotron Based 200KW CW @ 84GHz
• Focused Microwave beam of 18 mm radius.
SST1 ECRH SST1 ECRH SYSTEMSYSTEM
Main Parameters Main Parameters
• Gyratron Frequency : 82.6 GHz
• Output Power : 200 kW CW
• Output Mode : HE-11
• Operating TF Field :
• Fundamental : 3 T
• 2nd Harmonic : 1.5 T
• Exit dimensions of Waveguide : 63.5 mm
Objectives:Objectives:
• Pre-IonisationPre-Ionisation & Plasma start up& Plasma start up
• Electron Cyclotron Heating to assist Current drive during LHCDElectron Cyclotron Heating to assist Current drive during LHCD
Frequency : 3.7 GHz.Power ( 2 klystrons each of 500 kW CW): 1 MWAntenna type : Grill# of subwaveguides : 32 x 2rowsPeriodicity (with 2mm thick septa) : 9 mmSubwaveguide opening : 76 x7 mm2
Design NII (at 90o phasing) : 2.25
NII variation (from 40o to 60o phasing) : 1.0 - 4.0
Klystron input power : 10Watt
SST-1 LHCD SYSTEMSST-1 LHCD SYSTEM
Plasma Facing Components of SST-1
Design Drivers:
• Steady state heat and particle removal
• 1 MW power Input
• Surface temperature 1000 0C
• Baking up to 350 0C
• Electromagnetic forcesss during VDE, disruptions and halo currents
• Modularity
• Isostatically pressed, low ash content,Graphite
• Tiles mechanically attached to High strength copper alloy (CuZr & Cu CrZr) backplate;
• Cooling tubes (SS304) embedded in & brazed to the back plates.
PLASMA FACING COMPONENTS OF SST-1
SST-1 is a steady state device…
The system must capable enough to acquire all required physics information..
Due to continuous nature of operation … no physics information should be lost..
And no unnecessary data should be acquired.
If required … must offer lossless acquisition..
Provide support for real time visualization of data.
On line processing for Physics Information.
Remote operation, processing and viewing…
GUI based local and synchronous operations.
Tagged with events for post processing and viewing.
Distributed DAS for batter data managements
Objective and Requirements of DAS
Concept of event for data reduction, Scheduled and un scheduled events.
performance enhancement with growing tech
Most of the Tokamak operates in pulse mode
Discharge duration could be few seconds
Captures data during discharge.
Retrieves it later on for analysis
Display of data as a single trace.
Do not demand any need of viewing data during discharge since discharge is limited for few seconds
Generates manageable data during shot-10Mb or so
How SST-1 DAS Differs
However SST1 will be operated under steady State for 1000 Seconds
Generates large amount of data
Demands online viewing 1000 seconds20 minutes, can’t wait till end of the pulse
Online processing to infer physics parameter like Density, Plasma current
Demands large local buffers for storage
Demands transfer to host-as fast as possible for loss less acquisition
Storage for post processing
These all puts significant effect on acquisition instruments
Tagging of events and time
Large amount of data
Network load increases substantially
Storage requirements grows enormously
Processing needs also grows and demands faster CPUs
Large buffers or Multi buffer schemes
Deterministic nature of network and minimum latency
Here the root cause is LARGE AMOUNT OF DATA
Above requirements poses many Technical problems
How one can reduce the data? – EVENT DRIVEN SAMPLING
Acquire data at lower sampling rate during low activity period
Change Sampling rate as and when important event occurs
Revert-back to normal sampling rate after /\ t
If everything is sequential and pre determined ---window based acquisition
Event driven sampling
Depends on number of events, duration of events. Sampling rate during event. Base level Sampling rate. Depends on diagnostic and its needs.
How much reduction in data one can achieve in Event base triggering?
Selection of digitizer which can accepts such events triggering. Time tagging of events while storing the data. Event recording- Sampling rate, event etcs needs to be stored for post archival.
What are the problems caused by event driven sampling Scheme?
Each diagnostic has to identify the events, its duration and required Sampling rate.
Each sub-system like NBI, LHCD, ICRH etc. Has to identify events.
Generation of events- Electronics hardware.
Encoding of events- numbering of events.
Distribution of events to various sub-systems and digitizers,
Its Time criticality .
This basically demands a very unique timing/triggering system.
Employ various diagnostics to study the various parameters like
Electron Density
Electron Temperature
Soft X-Ray radiation
Plasma Current
Loop Voltage
Charge-exchange
Spectroscopy
Bolo meters
Microwave Interferometer
Thomson scattering
Langmiur Probes
S.N DIAGNOSTICS No. of channels
Sampling Freq
Type of Acquisition
Remarks
1 Mirnov coils 44 1Mhz Event based 100ms Multiple window# Current Ramp up# LHCD / NBI ON# Gas puff/ Pellet# Current ramp downor Disruption
2 Two component Magnetic probes
48 10KHz Continuous Control + Daq
3 Halo Rogowskicoils
50 1Mhz Event Based 100ms multiple windows# Z-position(thres)# Disruption
4 Saddle loops 16 1 kHz Continuous control + DAQ
5 Rogowski coils 4 10KHz Continuous control + DAQ
6 Fiber optics Current sensor
2 10KHz Continuous control + DAQ
7 Voltage Loops 24 10KHz Continuous control + DAQ
8 Diamagnetic Loops 4 10KHz Continuous Monitor + DAQ
9 Hall sensors 24 10KHz Continuous Control + DAQ
10 Bolometer System 1020
100Hz20KHz
ContinuousContinuous
Diagnostics and EventsDiagnostics and Events
100ms Multiple window# Current Ramp up
# LHCD / NBI ON
# Gas puff
# Current ramp down
# Disruption
11 SXR Imaging System 10125
100Hz1Mhz
ContinuousEvent Based
Monitor + DAQ100ms multiple windows# NBI ON (L-H trans & H mode)# Gas puff/pellet# Disruption12 HXR
Tomography10100
100Hz1MHz
ContinuousEvent Based
100ms multiple windows# NBI ON (L-H trans & H mode)# Gas puff/pellet# Disruption13 Sodium Iodide (NI) 2
5
100Hz1MHz
ContinuousEvent Based
100ms multiple windows# NBI ON (L-H trans & H mode)# Gas puff/pellet# Disruption14 VUV Broadband 2
510KHz1MHz
ContinuousEvent Based
100ms multiple windows# NBI ON (L-H trans & H mode)# Gas puff/pellet# Disruption15 FIR interferometer 24 10KHz Continuous Digital Counts
16 Spectroscopy 128
10KHz1MHz
ContinuousEvent Based
100ms multiple windows# NBI ON (L-H trans & H mode)# Gas puff/pellet# MARFE / DP# Disruption17 ECE Radiometer 16
81KHz1Mhz
ContinuousEvent Based
100ms multiple windows# NBI ON (L-H trans & H mode)# Gas puff/pellet# MARFE / DP# Disruption18 Langmuir Probes 32
6410KHz1MHz
ContinuousEvent Based
100ms multiple windows# NBI ON (L-H trans & H mode)# Gas puff/pellet# MARFE / DP# Disruption19 Michelson @
Interferometry
20 Charge Exchange 8
S.N DIAGNOSTICS No. of channels
Type of Acquisition
Sampling Freq KHZ
Bytes/Sample
Duration Sec
Mbytes No of Events
44 1 0.5 22 5
2 Two component Magnetic probes
48 Continuous
10 2 1000 960
Halo Rogowski 50 1 0.5 25 5coils
4 Saddle loops 16 Conti 1 2 1000 325 Rogowski coils 4 Conti 10 2 1000 806 Fiber optics
Current sensor2 Conti
nuous10 2 1000 40
7 Voltage Loops 24 Conti 10 2 1000 4808 Diamagnetic
Loops4 Conti
nuous10 2 1000 80
9 Hall sensors 24 Conti 10 2 1000 48010 Conti 0.1 2 1000 2
20 Conti 20 2 100010 Conti 0.1 2 1000 2
125 Event Based
1000 1 0.5 63 5
HXR 10 Continuous
0.1 2 1000 2
Tomography 100 Event Based
1000 1 0.5 50 5
2 Continuous
0.1 2 1000 0.4
5 Event Based
1000 1 0.5 2.5 5
2 Continuous
10 2 1000 40
Event based
3 1000Event Based
1 Mirnov coils 1000
10 Bolometer System
11 SXR Imaging System
12
13 Sodium Iodide (NI)
14 VUV Broadband
Diagnostics and Data Volume
Total of 250 Data channels demanding Continuous Acquisition for all 1000 sec. @ 10Khz sampling
Generate 3.5 Gbytes of data.
Total of 450 Channels at fast sampling rate @1Mhz, event based…
Number of schedule and unscheduled events about 5
Generate 3.5 Mbytes/sec
Total Data 225 Mbyte on board
timing/triggering system
Timing System
SST-1 is consists of various subsystems
Subsystems are Physically wide apart.
Time synchronization between the subsystem is required for proper and reliable operation of Experiment.
Exchange of events between sub systems is essential for smooth operation. Deterministic distribution within 5 micro sec
Common clock reference for tight simultaneity between subsystem and central control.
Event based sampling to limit data volume and not to lose the physics information.
Constituents of Timing system
Master Control Unite (Event Sequencer & distributor)VME based CPUFiber Optic communication Link @100Mbits/secTree Structure
Event Encoder Module8 Event Inputs16 bit codeFiber optic link with master unit
Timer ModuleEvent DecoderProgrammable Delay & Trigger generators.Reference ClockFiber optic link with master unit
Available BUS Options
ISA 8bit, 16 bit, Max 8MB/s Limitation of slots
PCI 32Bit, 132Mbyte/sec
PXI Extension of PCI, Sync. Clock, Trigger lines, Local Bus EMI/EMC, Cooling, Pug & Play, VISA
VME 32/64Bit, 40/80MB
CPCI 32Bit 64Bit 132/256MB/s
IEEE1934 Serial Bus, 200/400Mbits
VXI 32Bit, 40MB/s 10MHz sync clock, Trigger lines, Local Bus, Module ID, Resource manager, EMI/EMC
CAMAC
ISA 8bit, 16 bit, Max 8MB/s Limitation of slotsPCI 32Bit, 132Mbyte CPCI 32Bit 64Bit
132/256MB/sPXI Extension of PCI, sync. Clock, Trigger lines, Local Bus EMI/EMC, cooling , P & P VISA
VME 32/64Bit, 40/80MB
IEEE1934 Serial Bus, 200M/400Mbits
CAMAC
Available BUS Options For Instrumentations
VXI 32Bit, 40MB/s 10MHz sync clock, Trigger lines, Local Bus,Model ID, P & P, Resource manager EMI/EMC , VISA
What is the solution Considering the data rate generation as per the requirements
For Fast Diagnostics demanding higher sampling rateData must be stored on Onboard MemoryMulti Buffer or Segmented memory for different events
For Slow Diagnostics Demanding Continuous Loss less acquisition.Volume of data generation is less per secFIFO/Dual Ported RAM bufferFast back planeData streaming to disk
PXI for Slow Diagnostics: The PXI based system has been chosen. The major reason of choosing PXI is that it is based on the industry standard PCI bus. For making it perfect for instrumentations, the additional trigger lines, local bus and aclock signal has been incorporate. In addition the chassis complieswith EMC/EMI standard. All the PXI module comes bundled with Plug and Play driver for windows platform. The bus offersa transfer rate of 132Mbytes @33MHz & Fiber optic link to host.
Fast Diagnostics: CAMAC based stand alone system has been chosen. For this a ISA bus based 16 Bit Crate Controller and a special digitizer supporting multiple segments of memory for Events has be developed in house.
Opted for
CAMAC based- Computer Automated Measurement And Control.
Fast Diagnostics
VME For control applications
PXI for Slow Diagnostics
Data Streaming to the disk
Opted for
PCI bus
• PCI bus developed by Intel.
• Introduced in 1993.
486 motherboards use PCI as well.
• Clearly is the Bus of the ‘future’
PCI Highlights
• 32-bit bus that normally runs at a maximum of 33 MHz• Greater system performance ,with a maximum data
transfer rate of 132MB/s• Offers excellent expandability for high-performance
peripheral devices• investment spanning multiple CPU generations • Processor independent
Computer Bus Architecture
CPU
local bus (32-bit)
PCI Bridge32-bit
RAM
PCI bus 32-bit
Hard drive Video ISA bridge PCI Slot
16-bitISA Slot
PCI bus
33 MHz, 32-bit, address
lines and data lines are shared– Memory (where cards live)– IO (chip connection)– Configuration
• Bios on bootup
• Each slot on the PCI bus
has the configuration registers
shown at the right.
0x000x040x080x0C0x100x140x180x1C0x200x240x280x2C0x300x340x380x3C
31 16 15 0Device ID Vendor ID
Status Command
Class Code Rev
BIST Header Latency Cache
Base Address Registers
Cardbus CIS Pointer
Subsystem ID SubVendor ID
Reserved
Reserved
Expansion ROM Base Address
MaxLat MinGnt Int Pin Int Line
• Wide Industry Support Wide Industry Support
• Plug and Play capability Plug and Play capability
• Thousands of software productsThousands of software products
• 32-bit data transfers at 33 MHz 32-bit data transfers at 33 MHz (132 Mbytes/sec)(132 Mbytes/sec)
• PCI is a PCI is a de factode facto standard standard• Automatic Resource Allocation
BIOS will normally "lock" the "PCI IRQ and DMA Settings"
• PCI IRQ and DMA Settings can also be set manually
The PCI bus The PCI bus
1 2 3 4 1 2 3 4 But limited slots….
Peripheral Sizes in PCI and CompactPCI
PCIPCI PXI/CompactPCIPXI/CompactPCI
HalfHalfSizeSize
3U3U
FullFullSizeSize
6U6U
PCI boards can be redesigned to PCI boards can be redesigned to fit in PXI/CompactPCI with littlefit in PXI/CompactPCI with littleor no electrical changes.or no electrical changes.
•Eurocard Packaging Proven over decades of use in industrial applications (VME, VXI, etc.)Defined by IEEE 1101 Standard
PC Motherboard = Controller + Backplane
1 2 3 4 5 6 7 81 2 3 4 5 6 7 8
1 2 3 4 1 2 3 4
PC MotherboardPC Motherboardwith 4 PCI slotswith 4 PCI slots
CompactPCICompactPCIEmbeddedEmbeddedControllerController
CompactPCICompactPCI8-slot8-slot
BackplaneBackplane
Trigger Bus
Sys
tem
Co
ntr
oll
er
Sta
r T
rig
ger
Co
ntr
oll
er
Per
iph
eral
Per
iph
eral
Per
iph
eral
10 MHzCLK
132 Mb/s, 33 MHz, 32-bit Computer Bus
Star Trigger
Local Bus
Electrical ExtensionsElectrical Extensions::
• Integrated 8 Trigger Lines, 10 MHz reference clock, Star Trigger Bus
• Local Bus between adjacent slots 13 lines
Mechanical Extensions
Mandatory Active Cooling
• System-level environmental specificationsfor EMC, shock, vibration, and humidity
• Defined embedded controller location
PXI/CompactPCI Form Factors
64-bit PCI andPXI Features3U
PXI/CPCI J1
J2
32-bit PCI
6UPXI/CPCI
J5
J4
J3
J2
J1
64-bit PCI andPXI Features
32-bit PCI
PXI Reserved
PXI Reserved
PXI Reserved
6U Adapter Panel6U Adapter Panel
Software ExtensionsSoftware Extensions
PXI speeds application development because:PXI speeds application development because:
• PXI Controllers MUST support a standard PXI Controllers MUST support a standard software framework by including a pre-loaded software framework by including a pre-loaded OS: OS: – Windows NTWindows NT– Windows 9xWindows 9x
• Peripherals modules MUST be supplied with a Peripherals modules MUST be supplied with a WIN32 Device DriverWIN32 Device Driver
PXI and PC Software is IdenticalPXI and PC Software is Identical
• Operating systems and application software run unchanged on PXI systems
• Configuration tools recognize PXI modules as PCI devices
• Operating systems and application software run unchanged on PXI systems
• Configuration tools recognize PXI modules as PCI devices
PXI Also Works with Other Standards
VXI or VME Chassis
MXI
GPIB INSTRUMENT
GPIB
PXI Chassis
CompactPCI
• Embedded controllers– Most compact solution– Modular– Pentium and Pentium III Class
Controller Option
•Remote MXI-3 controllers
–Short or long 200 meter distance
–cupper or fiber connectivity 1.2Gbits/s
can sustain data transfers at over 80 Mbytes/s
–Fully transparent
–Low cost
MXI-3 Benefits
• More slots for PCs and PXI/CompactPCI• Very high performance serial fiber link 1.2GB/s• Easy to integrate — software transparent • 200 meter L O N G distances• Low cost
Control Panel
Flow
Pressure Alarm Conditions
STOP
Temperature
Front_end Electronics with built in Intelligence for Plasma Diagnostics.
Signal Originating from diagnostics has large dynamic ranges
Remote setting of front end electronics is required
Dynamic control of various settings of Front_end Electronics Gain, BWShielded twisted pair Cables
Opto Isolations
CANBuse base system, multi drop, serial bus @1MBits/s, msg exchange with priority, priority and address is part of msg,received by all, act if req.
During operation no entry to hall
PXI Based Lossless Continuous Data Acquit ion
Platform Windows2000
Development Tool
LabWindows/CVI
Data Socket based Client/Server Architecture
Direct Data Streaming to Hard Disk
1.2GB/s Fiber Optic Link
ulCount1 = SampRate1*Num_of_Channel*2;
piBuffer1 = (short *)malloc(ulCount1*2) ;
piHalfBuffer1 = (short *)malloc(ulCount1);
dSampRate = 1200000;
iHalfBufsToRead = iteration ;
GetCtrlVal (panelHandle, PANEL_LST1, &SampRate1);
DS_ControlLocalServer (DSConst_ServerLaunch);
Init_DA_Brds (1, &brd1); Init board AI_Configure (1, -1, 2, 10, 0, 1)
DS_Open ("dstp://202.41.112.140/dataport1", DSConst_Write,
DSCallback, NULL, &dsHandle);
DAQ_DB_Config(iDevice1, iDBmodeON)
SCAN_Start(iDevice1, piBuffer1, ulCount1, iSampTB1, uSampInt1, iScanTB1, uScanInt1);
Server Architecture
Wihle (loops <100)
DS_SetAttrValue (dsHandle, "Samp_Rate1", CAVT_FLOAT, &SampRate1, 0, 0);
DAQ_DB_HalfReady(iDevice1, &iHalfReady1,&iDAQstopped);
if ((iHalfReady1 == 1)
DAQ_DB_Transfer(iDevice1, piHalfBuffer1fwrite (piHalfBuffer1, 2,ulPtsTfr, ffp1);PlotY (panelHandle, PANEL_GRAPH
DS_SetDataValue (dsHandle, CAVT_SHORT|CAVT_ARRAYDS_Update(dsHandle);
STOP
DS_Open (URL, DSConst_ReadAutoUpdate, DSCallback, NULL, &dsHandle);
DS_EVENT_STATUSUPDATED:
DS_EVENT_DATAUPDATED
hr = DS_GetAttrType (dsHandle, "Samp_Rate1", &type))
If (data type matches)
DS_GetAttrValue (dsHandle, "Samp_Rate1", type, &SampRate1)
Client
DS_GetDataType
If (data type matches
DS_GetDataValue (dsHandle, type, dataArray
Integrate(input_integrater
PlotY (mainPanel, MAINPNL_GRAPH)
Observed Performance of PXI onWindows2000
Data Acquisition Module with 16 Channels, 12 Bit ADC, supporting aximum1.2Msamaples/sec. 2 channel DAC, 2 Channel of counter/timers and 8 Lines of gital I/O. Such three modules. ( 48 Ch of Analog In, 6 ch of Analog out, 24 I/O nd 6 counter timers)
Continuous Data Acquisition.... Acquisition Server (48 channel @ 10 kHz, writing to file for 1000 sec. and pushing the all 48 channel on network using Data Sockets )
Synchronized Continuous Acq. with start trigger (One common start trigger to one module and the same is applied to rest by the back plain)
Single Shot application..
On fly sampling rate changing in case of Scheduled Event triggering.
MultiTrigger: In case of event based sampling 100 events with time gap of 70msec can be acquired with ploting of the data and with out plot the subsequent time gap can be 15msec. (This was tried with pre/post trigger facility
Following performance was very recently
HP Vectra P-III @1.2 GHz supports 96 channels acquisition @10KHz with pushing all data no network and storing it on hard disk with few channels plotting on local machine.
Embedded PC of NI P-II @1.2GHz working supports up 96 channel @20KHz.
This is double the channel handling capacity compare with PCL machine working at P-III @500MHz
CAMAC based Data Acquisition for fast diagmnostics
Platform Windows2000
Development ToolLabWindows/CVI
Data Socket based Client/Server Architecture
On board memory, Multiple segments
Standalone CAMAC system
16 bit parallel crate controller
Data transfers under PIO and DMA mode
Device Driver with DAM for Windows2000 platform
Differential line drivers to support the longer distance
ISA bus
Crate Controller
CAMAC Digitizer for Fast Diagnostics
Selectable segment size
Facility for Onfly Reading
Design our own CAMAC Module
Supports Continuous, Transient and Monitoring Mode
Independent 8 bit ADC per channel, +/- 5 V
Four channel per module
512KB memory per channel
Single width CAMAC module
Digitizing rate up to 1MHz
Selectable pre/post trigger samples
FIFO
ON FLYREAD BUFFER
ADC
CLOCKGENERATOR
CLOCKSELECTION
CLOCKDIVISION
LATCH
LATCH
DAC
CONTINUOUSREAD BUFFER
TRANSIENTREAD BUFFER
RAM
ADDRESSCOUNTER
BUF1
BUF2
INSTRUMENTATIONAMPLIFIER
CAMACWRITELINES
INPUT SIGNAL
HF FF R CLOCK
OR
OR
CLOCKDIVISION
NOT
SAMPLINGCLOCK
COMPARATOR
STARTTRIGGER
INPUTSIGNAL
CAMACREADLINES
CLOCK
CLK ENW*
EF
HFFF
R
A0-A14R/WENB2
ENB1
CONTROL LOGIC
CAMAC DIGITIZER
Function
Decoder
START
RESET
SELECT SAMPLINGRATE
START DIGITIZING
START TRIGGER
STORE DATA IN FIFO & RAM
IS
STOPTRIGGER
ON FULL FLAG (FIFO)READ DATA FROM FIFO
READ DATA FROM RAM
STOP
START DIGITIZING
READ DATA FROM ADC ON-FLY
STOP
START DIGITIZING
START TRIGGER
READ DATA FROM FIFO ON LAM
STOP
FUNCTIONAL SEQUENCE OF CAMACBASED DUAL RATE DIGITIZER
IS
STOPTRIGGER
MODECONTINUOUS MODE TRANSIENT MODE
MONITORINGMODE
NO
YES
YES
NO
CLOCK GENERATOR
INSTRUMENTATION AMPLIFIER
CLOCK DIVISION
CLOCKSELECTION
RAM
ADDRESS COUNTER
READ BUFFER
FIFOADC
FOUR IDENTICAL CHANNELS
ANALOG
INPUT CAMAC
READ
LINES
CLOCK
WR
SAMPLING CLOCK
HIGH SPEED CAMAC DIGITIZER
OR
OR
OR
OR
HF
TRIGGER
CONTROL LOGIC
START
SAMPLING
CLOCK
HF R
CLK
ACQUISITION
WINDOW
CLOCK
OR
R/W
R
Objective and Requirements of Control
Since SST-1 is consist of many subsystem the major objective is to ensure reliable and smooth operation.
Provide Integrated interactive Remote control environment
Proper sequencing of subsystem for synchronized operation
Safety interlocks and fail safe measure under normal and abnormal conditions
Fast real time control of Plasma shape and position.
Interactive strategic control during the pulse.
Configuring and downloading operation parameters to various subsystem
Implementation approach
Hierarchical distributed control system.
Supervisory central control at the top Supervising subsystems andexchanging status , parameters and commands
Individual subsystems are directly controlled and monitored by itsown dedicated intelligent control system
For quicker and faster actions Interlocks and safety measures will be exercised by individual subsystem
For batter and Efficient managements of the system entire control activity has been divided in following groups
Machine Control system
Discharge Control System Diagnostic Control System
Machine Control
All the subsystem doing routine tasks like monitoring temp, water flow, vac pressure etc. are covered under machine control.
Status and heath of all the
subsystem will be monitored
under the Machine control
Down load of limit values and summary of status from subsystem
Power Supply System
Status of switch Yard
TF currents on/off,
limit values,
TF current profiles
Vacuum System
Control of vacuum pumping system,
sequencing gate valves,
Partial pressure measurements
Status of various components
Water Cooling System
Number of cooling system
for passive plate divertor
Copper coils
OT cooling system
temp
alarm and limit sets
water flow
water pressure etc
Discharge cleaning system
On/off,
Discharge currents
Cryogenics
status
Coil Protection and Monitoring system
Status
Limit values
Auxiliary Heating system
Status of LHCD, ICRH, NBI
Due to long discharge time.. One has a option of changing the strategy online depending upon the situations
Scheduled discharge phases can be dynamically changed…
Includes Plasma Current, Shape, Position and Density Control
Dynamic Discharge control System
Position and Shape Control
Target system PowerPC
Real Time OS….
VxWorks
Reflective Memory
for real time data sharingPlasma Position and Shape Control
Common algorithm to estimate the
Plasma Position and Shape
Based on Function Parameterization code
Relatively on slow time scale
Constraint due to Super conductor PF Coils
Rapid change of I is not permitted through PF due Quench
And L/R ratio Signal from 48 Mag probes, Plasma Currents ,
Flux loops and coil currents to determine the shape & Position.
Error in shape will be translated into correction PF current
Position Control will be fast
Time scale of the order of 100 micro sec.
Changing current in copper
conductor active
feed back coil
ADC - 96 ch
FIFO
VM E Bus RAM
LHCD Control
DSP Processor
Power Supply Control
Reflective Memory
Reflective Memory
Reflective Memory
FPDP (160 MB/s)
PCI (132 MB/s)
Real Time Network (13.6 Mbytes/s)
Real- Time position feedback (Loop back time = 100 us)
Diagnostics
Density and Plasma Current Control
Microwave
InterferometerPlasmaFringe
Counter
Gas Feed
Controller
Ref. Density
Piezo gate Valve
Plasma Current will be controlled
By controlling the LHCD power
Rogowski coils / Hall sensors
1 ms correction time scale
Electron density
10ms time scale
Control Overview
Software & H/W
Platforms….
Windows
Linux
Real-time Linux
VxWorks
Software Development Tools
Lab Windows/CVI
LabView
TCL/TK
MSSQL
ORACLE
EPICSHardware
CAMAC
PXI
VME
Reflective Memory
Processor
Pentium
PowerPC
Thanks…….
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