ams multi-spectral sensor - system plus · 2017. 12. 6. · ©2017 by system plus consulting | ams...

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21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ams Multi - Spectral Sensor True Color ambient light sensor from Apple iPhone X IMAGING report by Stéphane ELISABETH December 2017 – version 1

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Page 1: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

ams Multi-Spectral SensorTrue Color ambient light sensor from Apple iPhone XIMAGING report by Stéphane ELISABETHDecember 2017 – version 1

Page 2: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 2

Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o ams

o ams portfolio

o Apple iPhone X Teardown

o Module View & Dimensions

Physical Analysis 20

o Summary of the Physical Analysis 21

o Package 23

Package View & Dimensions

Package Opening

Package Cross-Section:

Materials, Flex PCB, Wire Bonding, Glass Window, Diffuser

o Sensor Die 39

Sensor Die View & Dimensions

Sensor Die Overview:

Optical Isolation, Sensing Cells

Sensor Delayering & main Blocs

Sensor Die Process

Sensor Die Cross-Section:

Substrate, Metal layers, Optical Isolation, Filters, Photodiode Area

Sensor Die Process Characteristic

Sensor Manufacturing Process 62

o Global Overview

o Sensor Die Front-End Process & Fabrication Unit

o Packaging Process & Fabrication unit

Cost Analysis 75

o Summary of the cost analysis 76

o Yields Explanation & Hypotheses 78

o Sensor die 80

Sensor Die Front-End Cost

Sensor Filter Front-End Cost

Sensor Die Probe Test, Thinning & Dicing

Sensor Die Wafer & Die Cost

o Packaged Component 84

Packaging Cost

Package Cost per steps

Back End: Final Test

Component Cost

Estimated Price Analysis 89

Customer Feedbacks 93

Company services 95

Page 3: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 3

Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Executive Summary

• This full reverse costing study has been conducted to provide insight on technology data, manufacturingcost and selling price of the Multi-spectral Sensor in the Apple iPhone X supplied by ams.

• Located in the phone’s front, above the main speaker, the ALS shares the flex PCB with the proximitysensor and the front microphone. The custom version provided by ams is a multi-spectral ALS in very long,narrow packaging (6 x 0.9mm).

• The ALS’ architecture allows for large spectral sensing. Combined with a diffuser, the die sensor features sixdifferent cells, probably dedicated to UV, red, green, blue, NIR1, and NIR2, thus providing a broad lightspectrum. This allows the sensor to adapt the display color and brightness towards warm or cool-whitebased on the correlated color temperature (CCT) level of the phone’s environment.

• This report analyzes the complete multi-spectral ALS, from the sensor die to the custom packagingdeveloped for the device. This report also includes a complete analysis of the package and sensor die, alongwith a cost analysis and a price estimate for the device.

Page 4: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 4

Overview / Introduction

Company Profile & Supply Chain o amso ams Portfolioo Apple iPhone X teardown

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Apple iPhone X Teardown

Apple iPhone X Overview©2017 by System Plus Consulting

Apple iPhone X Front, Side and Back View©2017 by System Plus Consulting

Page 5: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 5

Overview / Introduction

Company Profile & Supply Chain o amso ams Portfolioo Apple iPhone X teardown

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Spectral Sensor Module

Page 6: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 6

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Summary of the Physical Analysis

Page 7: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 7

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Package Views & Dimensions

Page 8: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 8

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Package Cross-Section

Page 9: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 9

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Package Cross-Section – Bottom Glass Window

Page 10: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 10

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Sensor Die – Die View & Dimensions

Page 11: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 11

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Sensor Die – Die Overview – Sensing Cells

Page 12: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 12

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Sensor Die – Die Cross-Section – Optical Isolation Layer

Page 13: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 13

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Sensor Die – Die Cross-Section – Filters

Page 14: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 14

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Sensor Die – Die Cross-Section – Filters

Page 15: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 15

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Sensor Die – Die Cross-Section – Photodiodes Area

Page 16: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 16

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flowo Global Overviewo Sensor Die Processo Packaging Process

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Packaging Process Flow 1/5

PCB Panel

• PCB Substrate

PCB Panel

• Sensor Die bonding

Page 17: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 17

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysiso Synthesiso Supply Chaino Yieldso Sensor Wafer & Die Costo Back-End Costo Component Cost

Selling Price Analysis

Feedbacks

About System Plus

Sensor Front-End Cost

Page 18: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 18

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysiso Synthesiso Supply Chaino Yieldso Sensor Wafer & Die Costo Back-End Costo Component Cost

Selling Price Analysis

Feedbacks

About System Plus

Packaging Cost

Page 19: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 19

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysiso Financial Ratioso Manufacturer Price

Feedbacks

About System Plus

Multi-Spectral Ambient Light Sensor Estimated Manufacturer Price

Page 20: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 20

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Pluso Company serviceso Related reportso Contacto Legal

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

Related Reports

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

IMAGING• ams Ambient Light Sensor (ALS)• STMicroelectronics Time of Flight Proximity Sensor in the Apple iPhone 7 Plus• MEMS Packaging: Reverse Technology Review

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

IMAGING• 3D Imaging and Sensing 2017 • Status of the CMOS Image Sensor Industry 2017 • Status of the MEMS Industry 2017

Page 21: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 21

COMPANYSERVICES

Page 22: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 22

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Pluso Company serviceso Related reportso Contacto Legal

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings

Page 23: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 23

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Pluso Company serviceso Related reportso Contacto Legal

Contact

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

America Sales OfficeSteve LAFERRIEREPhoenixUSA(310) [email protected]

www.systemplus.fr

Asia Sales OfficeTakashi [email protected]

Mavis WANGGREATER [email protected]

NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

KOREAYOLE

Page 24: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

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Page 25: ams Multi-Spectral Sensor - System Plus · 2017. 12. 6. · ©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1 21 rue la Noue Bras de Fer 44200 NANTES

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