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Fico AMS-W Top Foil The Art of Top Foil Molding the molding solution for products like QFN, BGA, BOC and BGA-MAP, Future Proof Equipment Conventional Complex handling Large and heavy mold Expensive PR-set Fico AMS-W Individually moving blocks 35% less moving parts Modular mold design Low cost PR-set The Fico Approach MOLDING PELLET SUPPLY Fico AMS-W Top Foi l The Art of Top Foi l Mol ding Molding is a process where micro chips are encapsulated in plastic. Dedicated to the latest trend in single sided packages, the Fico AMS-W is the most economic and flexible foil molding system. It is the molding solution for products like QFN, BGA, BOC and BGA - MAP, including high end applications such as flip chip, multi array and stacked die. The special foil molding feature allows bleed free production of bare die molded underfill products. Future Proof Equipment Conventional Moving blocks Complex handling Large and heavy mold Expensive PR-set Fico AMS-W Individually moving blocks 35% less moving parts Modular mold design Low cost PR-set The Fico Approach Opt tics LED L Medical A u t o m o t i v e M e m o r y E l l e e c t r o n i c s M o b i l e S u b s t r a t e C o p p e r C e r a m i c F i l m CASSETTE HANDLER VISION LEADFRAME HANDLER FOIL UNITS MOLDING PRESS PELLET SUPPLY www.besi.com

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Page 1: AMS-W Top Foil -HR - Homepage | Besi · PDF fileFico AMS-W Top Foil The Art of Top Foil Molding Molding is a process where micro chips are encapsulated in plastic. Dedicated to the

Fico AMS-W Top FoilThe Art of Top Foil Molding

Molding is a process where micro chips are encapsulated in plastic.

Dedicated to the latest trend in single sided packages, the Fico

AMS-W is the most economic and flexible foil molding system. It is

the molding solution for products like QFN, BGA, BOC and BGA-MAP,

including high end applications such as flip chip, multi array and

stacked die. The special foil molding feature allows bleed free

production of bare die molded underfill products.

Future Proof Equipment

Conventional

Moving blocks

Complex handling

Large and heavy mold

Expensive PR-set

Fico AMS-W

Individually moving blocks

35% less moving parts

Modular mold design

Low cost PR-set

The Fico Approach

CASSETTEHANDLER

VISION

LEADFRAMEHANDLER

FOILUNITS

MOLDINGPRESS

PELLETSUPPLY

www.besi.com

Fico AMS-W Top FoilThe Art of Top Foil Molding

Molding is a process where micro chips are encapsulated in plastic.

Dedicated to the latest trend in single sided packages, the Fico

AMS-W is the most economic and flexible foil molding system. It is

the molding solution for products like QFN, BGA, BOC and BGA-MAP,

including high end applications such as flip chip, multi array and

stacked die. The special foil molding feature allows bleed free

production of bare die molded underfill products.

Future Proof Equipment

Conventional

Moving blocks

Complex handling

Large and heavy mold

Expensive PR-set

Fico AMS-W

Individually moving blocks

35% less moving parts

Modular mold design

Low cost PR-set

The Fico Approach

OptticsLEDL

Medical

Autom

otiv

e

Memory

Elleectronics

Mobile

Su

bstrate Copper

CeramicFi

lm

CASSETTEHANDLER

VISION

LEADFRAMEHANDLER

FOILUNITS

MOLDINGPRESS

PELLETSUPPLY

www.besi.com

Page 2: AMS-W Top Foil -HR - Homepage | Besi · PDF fileFico AMS-W Top Foil The Art of Top Foil Molding Molding is a process where micro chips are encapsulated in plastic. Dedicated to the

Molding PressTopedge molding (no gold layer)

Flash free molding

Dynamic Clamping Control (DCC)

17 process patents

Board and cavity vacuum

Individual, equal board clamping

Besi AustriaDie bonding

Die sorting

Besi SwitzerlandDie bonding

Wire bonding

Besi NetherlandsMolding

Trim & Form

Singulation

Meco EquipmentPlating

Visit Besi at http://www.besi.com/after-sales/spares_tooling

Cassette HandlerHigh capacity

Freely accessible

Slot to slot copy

Two or four deck version

Bar code and RFID reader (optional)

VisionLeadframe orientation check

Mark inspection

Optical Character Verification (OCV)

Leadframe HandlerAutomatic orientation correction

Leadframe pre-heating

Anti warpage leadframe cooling

Air cushion transport

Foil UnitsBare die molding

Bleed free molding

No mold cleaning necessary

Pellet SupplyRemote pellet feed (up to 40 m)

Pellet length check

Pellet cooling

Pellet age control

Machine Dimensions

WxDxH: 2273 x 1490 x 1976 mm

Weight: approx. 2600 kg

Leadframe Size

Width: 45 - 79 mm

Length: 180 - 280 mm

Thickness: 0.1 - 1.5 mm

Max. height: 2 mm

Cassette Dimensions

Width: 48 - 85 mm

Length: 180 - 300 mm

Height: 100 - 165 mm

Storage capacity: 400 mm

Supply Requirements

Voltage: 208 - 480 VAC

Frequency: 50 / 60 Hz

Power rating: 9 kVA

Compressed air: 5 - 10 bar

Average air cons.: 6 m3 at 6 bar

Factory exhaust: 300 m3 at 50 Hz

Performance

Uptime: 98%

MTBF: > 200h for a MTTR of 1 h

MTBA: > 3 h

MTTR: > 1 h

MTTA: < 3 min

Press & Mold

Max. clamp force: 450 kN

Max. mold opening: 90 mm

Max. transfer pressure: 180 bar

Pellet diameter: 11, 14, 14.3 mm

Max. number of plungers: 10

Max. cavity temp. diff.: 2°C

Molding PressTopedge molding (no gold layer)

Flash free molding

Dynamic Clamping Control (DCC)

17 process patents

Board and cavity vacuum

Individual, equal board clamping

Cassette HandlerHigh capacity

Freely accessible

Slot to slot copy

Two or four deck version

Bar code and RFID reader (optional)

VisionLeadframe orientation check

Mark inspection

Optical Character Verification (OCV)

Leadframe HandlerAutomatic orientation correction

Leadframe pre-heating

Anti warpage leadframe cooling

Air cushion transport

Foil UnitsBare die molding

Bleed free molding

No mold cleaning necessary

Pellet SupplyRemote pellet feed (up to 40 m)

Pellet length check

Pellet cooling

Pellet age control

Machine Dimensions

WxDxH: 2273 x 1490 x 1976 mm

Weight: approx. 2600 kg

Leadframe Size

Width: 45 - 79 mm

Length: 180 - 280 mm

Thickness: 0.1 - 1.5 mm

Max. height: 2 mm

Cassette Dimensions

Width: 48 - 85 mm

Length: 180 - 300 mm

Height: 100 - 165 mm

Storage capacity: 400 mm

Supply Requirements

Voltage: 208 - 480 VAC

Frequency: 50 / 60 Hz

Power rating: 9 kVA

Compressed air: 5 - 10 bar

Average air cons.: 6 m3 at 6 bar

Factory exhaust: 300 m3 at 50 Hz

Performance

Uptime: 98%

MTBF: > 200h for a MTTR of 1 h

MTBA: > 3 h

MTTR: > 1 h

MTTA: < 3 min

Press & Mold

Max. clamp force: 450 kN

Max. mold opening: 90 mm

Max. transfer pressure: 180 bar

Pellet diameter: 11, 14, 14.3 mm

Max. number of plungers: 10

Max. cavity temp. diff.: 2°C

www.besi.com - [email protected]