analysis of grain boundary mobility in commercially pure copper and pure nickel
DESCRIPTION
Analysis of Grain Boundary Mobility in Commercially Pure Copper and Pure Nickel. Ana Erb Advisor: Professor A. D. Rollett. Interests & Goals. Mobility pertains to the movement of grain boundaries, dominated by solute. Solute present in commercial alloys affect the migration of the boundaries. - PowerPoint PPT PresentationTRANSCRIPT
Analysis of Grain Boundary Mobility in Commercially Pure
Copperand Pure Nickel
Ana Erb
Advisor: Professor A. D. Rollett
Interests & Goals• Mobility pertains to the movement of
grain boundaries, dominated by solute.
• Solute present in commercial alloys affect the migration of the boundaries.
• Boundary mobility controls recrystallization in alloys, which is of importance to industry.
• Recrystallization: the formation of new, strain-free grain structure from that existing in cold worked metal.
The effects of annealing on metals: (a) cold work, (b) after recovery, (c) after recrystallization, and (d) after grain growth.
ApproachEquation for grain boundary mobility:
MPV where, V is the velocity of the boundaries, M is the mobility of the boundaries, and P is the driving pressure for migration.
V M P
HardnessTest
Annealing & OIM(during recrystallization)
StoredEnergy
Commercially Pure Copper
• Initial treatment– Anneal at 800°C for 20
hours– Roll to 30% reduction– Polish overnight on the
Vibromet – Scratch sample
perpendicular to the rolling direction
Figure on the left is after initial treatment, scratch can be seen.
Figure on the right is after the second anneal (800°C for 2 hours), sample oxidized and scratch gone.
Commercially Pure Copper• Twin boundaries observed
in copper samples.• Characterized as a 60°
rotation about <111> crystal direction.
• Used information from “Extracting Twins from Orientation Imaging Microscopy Scan Data,” Ryan J.Larson and Stuart I. Wright.
3 60°<111> (depicted in black) 111 Pole Figure for Copper Sample
Pure Nickel
• Initial treatment– Anneal two samples at
1000°C for 30 minutes– Roll to 30% reduction– Electro-polish – Scratch sample
perpendicular to the rolling direction
• Second anneal– Anneal sample again after
first OIM scan– one sample at 900°C in
argon for 20 minutes– other sample at 700°C in
argon for 20 minutes
Figure on the left is after initial treatment.
The sample was then annealed at 900°C for 20 minutes in an argon tube
Figure on the left is after initial treatment.
The sample was then annealed at 700°C for 20 minutes in an argon tube.
Nickel OIM Datagrain boundary number misorientation angle < > sigma
1 59.1 1 1 1 32 59.9 1 -1 1 33 37.9 1 0 1 94 59.7 1 1 -1 35 59.4 -1 1 1 36 47.4 -2 -1 3 -7 54.6 0 -7 -8 118 38.3 10 -6 3 -9 59.7 -1 -1 1 310 54.8 2 -2 3 -11 57.6 -7 5 -5 -12 38.1 8 2 -13 -
MPV
G
GP
2
factortaylor
hardness
Shear Modulus
annealedtime
diametergbV
Solving For Mobility
Calculated Mobility and Grain Boundary Diameters
gb # grain diameter (m) gb mobility (m2 s/kg)1 189.9 1.84E-072 385.3 3.73E-073 552.9 5.36E-074 278.3 2.70E-075 316.1 3.06E-076 522.2 5.06E-077 289.6 2.80E-078 186.1 1.80E-079 123.8 1.20E-0710 152.4 1.48E-0711 507.5 4.92E-0712 182.9 1.77E-07
Future Work
• Take samples back to FAMU/FSU COE.
• Prepare more nickel samples, now knowing what temperature range to work on.
• Obtain more grain mobility data on both the commercially pure copper samples and pure nickel samples.
Acknowledgements
• Dr. Anthony D. Rollett• Mitra Taheri• Jason Gruber• Herb Miller• Chaovoon Samuel Lim• Mohammed Haroon Alvi• Jennifer Barrow• Diego Laboy
Reference
• Humphreys, F.J. and M. Hatherly Recrystallization and Related Annealing Phenomena. Elsevier Science Ltd. 1996.
• Kalu, Peter. Recrystallization and Grain Size Determination. PowerPoint Presentation, Fall 2003.
• Rollett, A.D. Grain Boundary Properties: Energy, Mobility. PowerPoint presentation, Spring 2003.
• Taheri, Mitra L. In-Situ Quantification of the Solute Effect on Mobility, Character and Driving Pressure of Grain Boundaries During Recrystallization in Aluminum Alloys. Carnegie Mellon University.
More on Mobility
Two main categories of boundary types:
• Low angle grain boundaries– Migration in the LAGBs occur during recovery
• High angle grain boundaries– Migration in the HAGBs occur during
recrystallization
• Angle refers to the angle of rotation required to coincide the two lattices.
Solutes & Mobility• Solutes tend to segregate to any
interface and lower the free energy of the system.
• For a boundary to move away from the segregated solute requires energy to be supplied.
• Mobility is also strongly sensitive to boundary type.
• High mobilities tend to be associated with CSL structures.
Coincident Site Lattice(CSL)
• A CSL is when a finite fraction of lattice sites coincide between two lattices.
• The reciprocal of the ratio of CSL sites to lattice sites is denoted by .