analytical modeling of surface waves on high-impedance surfacesyakovlev/presentations/... ·...
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Analytical Modeling of Surface
Waves on High-Impedance
Surfaces
A. B. Yakovlev, C. R. Simovski, S. A. Tretyakov
O. Luukkonen, G. W. Hanson, S. Paulotto,
P. Baccarelli
NATO Advanced Research Workshop
Metamaterials for Secure Information
And Communication Technologies
Marrakesh, Morocco, 7 – 10 May, 2008
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2
Outline
Introduction and Motivation Model 1 – Impedance Surface Model 2 – Grounded Dielectric Slab with
Grid Impedance Series-Resonant Grid Model Jerusalem Cross Array Patch Array Mushroom Array
Conclusion
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Motivation
HIS structures with electrically small FSS elements
Homogenized FSS grids for far-field and near-
field sources
Metamaterial substrates Wire media slabs Slabs with spherical inclusions
Nanotechnology
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Introduction
Analytical modeling of dense FSS grids Homogenization of impedance surface in terms of effective circuit parameters Homogenization limit of full-wave scattering problem via the averaged impedance boundary condition Parallel resonance of grid and slab surface
impedances
Single unit cell of periodic grid and a single Floquet mode
Babinet principle
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Model 1 – Impedance Surface
Zs
Zg Zd ηo g d
s
g d
Z ZZ
Z Z
Transmission Line Model
S. A. Tretyakov, Analytical Modeling in Applied Electromagnetics, Boston, MA: Artech House, 2003
Impedance Surface Model
No fields beyond the impedance surface
Ey
Ez
Hx
TMz
Hy
Hz
Ex
TEz
z sZ
h
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Model 1 – Impedance Surface
S. A. Tretyakov, Analytical Modeling in Applied Electromagnetics, Boston, MA: Artech House, 2003
Impedance Surface Model
TEz TMz
Impedance Boundary Condition
at y=0:
ˆsE Z y H
0
2
0 00
1
TE TEz yjk z k yTE
x s z x
TE TE
y zTE TE
s s
E Z H E E e
jk k k
Z Z
0
2
0 0
0
1
TM TMz yjk z k yTM
z s x x
TMTM TM TM sy s z
E Z H H H e
Zk j Z k k
No fields beyond the impedance surface
Ey
Ez
Hx
TMz Hy
Hz
Ex
TEz
z sZ
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Model 2 -
y
air
slab h
PEC
gZgrid
z
1 1
2 2
Two-sided impedance boundary condition at y=h
1 2 1 2ˆ
gE E Z y H H
Grounded Dielectric Slab with Grid
Impedance on Air-Dielectric Interface
Hy
Hz
Ex
TEz
Ey
Ez
Hx
TMz
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Dispersion Equations
TEz-odd TMz-even
Two-sided impedance boundary condition at y = h
1 21 2
TE
x x g z zE E Z H H1 2 1 2
TM
z z g x xE E Z H H
Dispersion equations
2 21 2 2
1
coth( )y y y TE
g
jk k k h
Z
2 1
2 2
1 1
tanh( )yTM
y y g TM
g y
j kk k h Z
j Z k
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Complex Wavenumber Plane
Branch points in the complex -plane at zk1zk k
1Re{ } 0yk - proper modes on the top Riemann sheet
1Re{ } 0yk - improper modes on the bottom Riemann sheet
1Re{ } 0yk - branch cuts condition
Hyperbolic -plane branch cuts: zk1 1
1
Im{ }Re{ }Im{ }
Re{ }
Re{ } Re{ }
z
z
z
k kk
k
k k
2 2
2
2 2
1/ 2
0 0
y z ii
i i
k k k
k nc
c
1Im{ / }zk k
1 -1 1Re{ / }zk k
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g d
s
g d
Z ZZ
Z Z
Zs
Zg Zd ηo
HIS
S. A. Tretyakov, Analytical Modeling in Applied Electromagnetics, Boston, MA: Artech House, 2003
k
θ
Transmission-Line Network Analysis
0
0
cos
cos,
s
sTE
Z
Z
cos
cos,
0
0
s
sTM
Z
Z
Reflection coefficient
Parallel resonance
0dg XX
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0
2
0
, tan
/
TE TE TE
d z ydTE
r z
jZ k k h
k k
2( ) ( )
0/TE TM TE TM
yd zk k krc
2
00
2
0
/, tan 1
/
TM
zTM TM TM
d z ydTM r
r z
k kjZ k k h
k k
Impedance of the grounded dielectric slab “seen” by surface waves
TMz -
Where
is the vertical component of the
wave vector of the refracted wave
Dielectric Impedance
S. A. Tretyakov, Analytical Modeling in Applied Electromagnetics, Boston, MA: Artech House, 2003
TEz -
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The grid impedance is obtained in the quasi-static limit of the full-wave scattering problem via the averaged impedance boundary condition and expressed in terms of effective circuit parameters (effective inductance and effective capacitance)
, ,, , ,TE TE TE TE TE TE
g z g L z g C zZ k Z k Z k
Grid Impedance
Homogenized grid impedance “seen” by surface waves
TEz -
, ,, , ,TM TM TM TM TM TM
g z g L z g C zZ k Z k Z kTMz -
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Jerusalem Cross Array
D = 4 mm, d = 2.8 mm
t = w = 0.2 mm, h = 6 mm
dielectric permittivity: 2.7
t
w
d
g
D
h
x
z
r
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Effective Inductance & Capacitance
Where
Here:
eff
gL2
0F
D
gcsclndC rg
2
10
w
Dlog
kD 22
2
2
4
23
11
udu
uQ
uQF
2
1d
Q
d
gu
2cos 2
k
2
C. R. Simovski, P. de Maagt, and I. V. Melchakova, “High-impedance surfaces having stable resonance with respect to
polarization and incidence angle,” IEEE Trans. Antennas Propagat., Vol. 53, no. 3, pp. 908-914, Mar. 2005
N. Marcuvitz, Waveguide Handbook, Peter Peregrinus Ltd, 1986
S. A. Tretyakov, Analytical Modeling in Applied Electromagnetics, Boston, MA: Artech House, 2003
d D
g
w 1TE
g g
g
Z j Lj C
2 1, 1 /TM TM TM
g z g z eff
g
Z k j L k kj C
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Dispersion Behavior of Surface Waves
P. Baccarelli, S. Paulotto, and C. Di Nallo, “Full-wave analysis of bound and leaky modes propagating
along 2D periodic printed structures with arbitrary metallization in the unit cell,” IET Microwave
Antennas Propagat., Vol. 1, No. 1, pp. 217-225, 2007.
Jerusalem cross HIS structure
Comparison with full-wave results
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Surface Impedance of HIS
Jerusalem cross HIS structure
Surface impedance of HIS “seen” by surface waves
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Patch Array
w
w
D
x
D z
h
2,
12 1
2
effTE TE
g zTE
z
eff
Z k j
k
k
2
effTM
gZ j
O. Luukkonen, C. R. Simovski, G. Granet, G. Goussetis, D. Lioubtchenko, A. V. Raisanen, and S. A.
Tretyakov, “Simple and accurate analytical model of planar grids and high-impedance surfaces
comprising metal strips or patches, http://arxiv.org/abs/0705.3548.
Grid impedance
• Quasi-static solution of 2D strip
grid scattering problem
• Averaged impedance boundary
condition
• Approximate Babinet principle ln csc2
effk D w
D
D = 2 mm, w = 0.2 mm, h = 1 mm
dielectric permittivity: 10.2
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Dispersion Behavior of Surface Waves
P. Baccarelli, S. Paulotto, and C. Di Nallo, “Full-wave analysis of bound and leaky modes propagating
along 2D periodic printed structures with arbitrary metallization in the unit cell, ,” IET Microwave
Antennas Propagat., Vol. 1, No. 1, pp. 217-225, 2007.
Patch HIS structure
Comparison with full-wave results
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Surface Impedance of HIS
Patch HIS structure
Surface impedance of HIS “seen” by surface waves
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Wire Media Slab
z
x
a
02rGround plane z
y
E
H
a k
h r
0
eff
r a
a
Anisotropic material characterized by effective permittivity
Quasi-static approximation (ENG approximation)
0ˆ ˆ ˆ ˆ ˆˆ
eff r yyxx yy zz2
2
2
0 0
2 /
ln4 ( )
p
ak
a
r a r
pk is the plasma wavenumber
2
2
0
1p
yy
r
k
k
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Surface Impedance of Wire Media Slab
Ground plane z
y
E
H
a k
h r
0
eff
r a
a
2
2
0
1p
yy
r
k
k
2
0 2
0
tanˆ1
yd zt t
yd r yy
k h kE j n H
k k
2 2 2
0
0 2 2
0
tan yd r p zTM
d
yd r p
k h k k kZ j
k k k
Impedance boundary condition
at y=h:
Surface impedance 2
2
0z
yd r
yy
kk k
S. A. Tretyakov, Analytical Modeling in Applied Electromagnetics, Boston, MA: Artech House, 2003
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Mushroom Array
a
Ground plane z
y
E
H
a k
h r
0
eff
r a
g a
a
g
z
x a
02r
g
g
Zs
Zg Zd ηo
g d
s
g d
Z ZZ
Z Z
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Mushroom Array
a
Ground plane z
y
E
H
a k
h r
0
eff
r a
g a
a
g
z
x a
02r
g
g
Period of vias: 2 mm
Period of patches: 2 mm
Gap: 0.2 mm
Radius of vias: 0.05 mm
Substrate thickness: 1 mm
Dielectric permittivity: 10.2
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Dispersion Behavior of Surface Waves
Mushroom HIS structure
Comparison with full-wave results
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Surface Impedance of HIS
Mushroom HIS structure
Surface impedance of HIS “seen” by surface waves
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Dispersion Behavior of Surface Waves
Mushroom HIS structure
Period: 1.5 mm
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Dispersion Behavior of Surface Waves
Mushroom HIS structure
Period: 2.5 mm
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Accurate and rapid analysis of surface-wave propagation on dense HIS structures (low frequency approximation)
Analytical modeling is based on the quasi-static approximation of full-wave scattering problem via the averaged impedance boundary condition. A homogenized surface grid impedance is expressed in terms of effective circuit parameters
It is observed that in dense HIS structures no stopband between TE and TM surface-wave modes occurs at low frequencies. This is in contrast to conventional FSS structures, wherein stopbands occur due to Bragg’s diffraction at resonance frequency
Stopbands in mushroom HIS structures at low frequencies are due to occurrence of TM backward surface waves associated with wire media slab and capacitive grid
Conclusion
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Mário Silveirinha University of Coimbra, Coimbra, Portugal
Igor Nefedov Helsinki University of Technology,
Helsinki, Finland
Acknowledgment