application examples of triplex based pic modules & pix4life
TRANSCRIPT
Application examples of TriPleXbased PIC modules & Pix4life
silicon nitride open access ecosystem
Arne Leinse – Chief Commercial Officer LioniX International
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Outline
Introduction LioniX international
Overview TriPleX™ nitride platform
User case examples
Open access in PiX4life Pilot Line
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Our Mission
LioniX International is a leading global provider of customized microsystem solutions, in particular integrated photonics-based, in scalable production volumes
Why
Applying disruptive technologies
to solve major societal challenges
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Who
Located in the Netherlands (Europe)
Established in 2001 (LioniX)
Merged with XiO Photonics & SatraX in 2016
>50 employees
>50% PhD
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LioniX International
Providing customized solutionsfor OEM’s and System Integrators
From design to device by vertical integration in scalable production volumes
Seoul, South KoreaEnschede, The Netherlands Enschede, The Netherlands Enschede, The Netherlands
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LioniX International PHIX
TriPleXTM waveguide concept
LPCVD SiO2
Low refractive index
Layer quality is excellent
Stress: Compressive
LPCVD Si3N4
High refractive index
Layer quality is excellent
Stress: Tensile
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Multilayer waveguide
Characteristics: • Applicable in between 405 nm and 2.35 μm• Single mode waveguides• Ultra low-loss
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TriPleXTM: some geometries... Adjustable polarization properties
(sensors telecom)
Low optical attenuation
Adaptable mode profile
Small bend radii (small footprint!)
Design by geometry
Silicon and glass compatible
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Tapering: high low index waveguides
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Low index contrast
•Mode profiles from 1 µm to > 10 µm•Modefield conversion•Pitch conversion•Low loss coupling to almost any external component, including SM fiber, InP and Si (SOI)
High index contrast
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“Low-loss, high-index-contrast Si3N4/SiO2 optical waveguides for optical delay lines in microwave
photonics signal processing”, L. Zhuang et all, Optics express, 19 (23), 2011
Low propagation losses
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"An Ultra-Low-Loss (<0.1 dB/m) Planar Silica Waveguide Platform," J. Bauters et all, IEEE Photonics Newsletter, December 2011
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Application Examples of TriPleX PIC
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• Visible: power splitter, multi-color laser combiner
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TriPleX™
• NIR: ultra sensitive sensor arrays
• IR: microwave photonics, hybrid InP-TriPleX laser
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Visible light application
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Power splitter for DNA sequencing (Pacific Biosciences)
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• Ultra high power density (per channel typically 100 mW)• Very high power uniformity over output channels
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Visible light application
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Multi-color laser combiner
• Combining of four visible laser colors through TriPleX™: 405, 488, 532 and 640 nm
• Thermal actuation for on-chip power stabilization up to 10 mW
• PZT actuation for noise stabilization and modulation in the MHz range
• Flow cytometry, confocal microscopy
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NIR application
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Ultra sensitive sensor arrays
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• Label-free refractive index sensing • Multiple MRR and/or MZI sensor arrays• Flip-chip assembly of VCSEL’s and detector arrays through grating couplers
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NIR application
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• Driving and interrogation unit co-developed with supplier
• Software developed in-house• Up to 8 channels simultaneously• Variety of application fields
through choice of sensing layers:-Biochemical sensing-Gas sensing -……
Experimental resolution: • Δn = 10-6 to 10-7 RIU
Surface sensitivity • ~0.1 pm of protein layer
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IR application
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400 600 800 1000 1200 1400 1600 1800 2000 2200 2400
Microwave photonics (OBFN)
5G requires higher capacity and faster speed of data transmissionOptical signal processing at high radio frequency(28GHz) is required:
combine TriPleX and InP
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IR application
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Major stepping stone: realization of on-chip, tunable, hybrid InP-TriPleX laser
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IR application
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Latest result: extremely small bandwidth (290 Hz) with 13 mWpower in output fiber, >80 nm tunability
“290 Hz Intrinsic Linewidth from an Integrated Optical Chip-based Widely Tunable InP-Si3N4 Hybrid Laser”, Y. Fan et al, post deadline oral presentation, CLEO USA, San Jose, (CA) , 14-19 May 2017
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Access to TriPleX technology
Technology accessible via Multi Project Wafer (MPW) runs
Photonic Design Kit (PDK) in PhoeniX software
Special offer to PhoeniX Software for first time MPW customers
PDK training in collaboration with PhoeniX Software
At fixed tape out deadline design submission
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12th run 13th run 14th run
Training February 2017 June 2017 December 2017
Tape out May 2017 October 2017 March 2018
Devices ready September 2017 February 2018 July 2018
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Characterization Packaging
Characterization Packaging o To measure PIC without alignment setup
o Connection to fiber arrays and electronics
o Standardized design guidelines to improve assembly speed and lower assembly cost
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PIX4life Silicon Nitride MPW platforms
TriPleX
LPCVD Si3N4
Single or Double stripe
405 to 700nm wavelength range
Propagation loss <0.3 dB/cm.
Min bend radius TE-100 µm
Actuation by thermo-optic effect
Cladding openings for interaction
Butt-coupling to an array of fibers.
Minimum feature size 0.8 µm.
Si3N4 MPW offer
o 1550 nm
o VIS (400-700nm)
BioPIX
PECVD Si3N4
300/150 nm waveguide height.
532 to 850 nm wavelength range
Minimum bending radius: 20 µm.
Propagation loss <1.5dB/cm.
Coupling by gratings: light output to
Compatible with CMOS sensor stack.
Cladding openings available.
Minimum feature size 150 nm.
Si3N4 MPW offer
o 532-850 nm
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www.pix4life.eu
Si3N4 MPW @ Visible
The PIX4LIFE project, a project funded by the EU under the H2020 program (contract number: 688519)
The European PIX4life pilot line offers o open-access manufacturing platform for photonic integrated circuits
o specially targeting life-science applications at visible wavelength ranges (400-850 nm).
Flow Cytometery Multispectral light source
Gas/Bio Multi sensor
Optical Coherence Tomography
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Pix4life user example
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Pix4life user example
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Pix4life user example
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Silicon nitride MPW schedules
TriPleXo 1550 nm - Double Stripe. Start October 2017, Chips ready February 2018
o VIS – Single stripe. Summer 2018.
BioPIXo VIS - Winter 2017
PDKs and trainings are available
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Q&A
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