Aries Engineering Design Team

06/06/2008

Aries Engineering Design Team

Matt BakerPete LevnoZach PerrymanJessica Pierry

Industry Advisor:Ken Millard, P.E.Faculty Advisor:David Sailor, Ph.D.

Final ReportFinal Report

Project Overview

Design a system to efficiently and safely remove floor tiles from heated floor systems in luxury motor coaches without damaging the heating elements

Product Design Specifications• Original customer request was for a “heated

scraper”– Still required use of open flame for initial heating

• Final design request was for tile removal system– Heat tile to break down adhesive– Remove tile– Remove adhesive

Old process in action…

Product Design Specifications• Critical to Quality

– Safety• Eliminate open flame• Control heat sources and surfaces

– Cost• Entire tool kit must cost less than $400

– Resulting Process Time• Trained operator must be able to remove tile and adhesive in

less than 30 min

– Electricity Usage• Must run at less than 10 amps

External Search & Concept EvaluationTile Preparation

•Heat tile using flame•Dangerous

•Heat tile using infrared•Time consuming•Hot exposed surfaces

•Super chill tile using dry ice•Wouldn’t work

•Heat tile using heat pad•Plausible

Heated Pad Chosen

External Search & Concept EvaluationTile Removal

•Hammer & crowbar•Can be dangerous

•Suction device •Expensive and complicated

•Scoring device (glass cutter)•Will help make hammer and crowbar less dangerous

Combination of prying device and scoring device chosen

External Search & Concept EvaluationAdhesive Removal

•Heat adhesive with flame & scrape with unheated scraper

•Dangerous•Adhesive cools while scraping

•Heat scraper using infrared•Impractical

•Resistance Heated Scraper•Plausible

Resistance heated scraper chosen

Material Testing• Strength of Adhesive Bond

– Measure strength of adhesive bond at various temperatures

– Establish temperature that adhesive breaks down

1.Samples heated to several temperatures2.Sample pulled apart in tensile tester3.Data collected4.Results plotted for target temperature

selection

Material Testing

y = 0.0119x2 - 3.2724x + 248.48

R2 = 0.7252

0

20

40

60

80

100

120

55 75 95 115 135 155 175

Temperature (F)

Ten

sile

Str

ess

(PS

I)

At 150°F The adhesive material

became un-testable using this method

By targeting 200°F, the tile removal

should be easiest

Material Testing

• Heat Transfer Properties– Need to relate heat applied at surface to

temperature under tile

thermocouples buried underneath tile on “test board”

Data collected using Labview

Heat applied in W/m^2 with a heat

pad

Material Testing

Adhesive directly under pad reaches

200°F At approximately 10 minutes after heat pad is turned on

Pad temperature is offset from adhesive

temperature by 100°F

Final Design

• Heat pad– Support Frame & Handle– Heating elements– Temperature Controller

• Selected temperature controller to maintain pad temperature at 100°F above adhesive target temperature

– Insulating layer• Protects operator (safety)

Tile Preparation

Final Design

• Tile Removal– Scoring Device

• Handheld tile cutter

– Breaking Device• Heavy steel hammer • Simple yet effective

– Removal Facilitator…• 1” wide pry bar

Tile Removal

Final Design

• Adhesive Removal– The heated scraper…

• Scraping blade – Embedded 150 Watt heating element for quick heat up

• Ergonomic handle • Temperature controller

– Bimetal disc thermostat– Set at 300°F to cut through adhesive as fast as possible

Adhesive Removal

Results

• Time for tile and adhesive removal:– 25 minutes

• Cost:– >$300

• Electricity usage:– 7.25 amps

Questions & Answers

Thanks To:

Ken Millard

Dr Sailor

Selco Products