atlas fp tracker plans
DESCRIPTION
ATLAS FP TRACKER PLANS. Steve Watts School of Physics and Astronomy University of Manchester. Well defined design in the FP420 Design Report Based on the FE-I3 ATLAS Pixel Readout chip. Design suitable for 220 but needs roughly double the number of - PowerPoint PPT PresentationTRANSCRIPT
ATLAS FP TRACKER PLANS
Steve WattsSchool of Physics and AstronomyUniversity of Manchester
• Well defined design in the FP420 Design Report Based on the FE-I3 ATLAS Pixel Readout chip.
• Design suitable for 220 but needs roughly double the number of sensors. Layout is more difficult and power dissipation is higher.
• Radiation level close to beam is very high. Implications for the readout chip. Sensor is good to 1-2 1016 charged hadrons cm-2 300-600 MRad
Consequence – New Design for the Tracker…… R&D is linked to 3D sensor developments for IBL and SLHC
220 m420 m
FE-I3 Lifetime issue 1015 charged particles per cm2 or ~30 MradSOLUTION A 3D sensor safe to 1-2 1016 charged hadrons per cm2
Dose highest in very narrow vertical band.
Move sensors up and down by 1-2 mm to even out the dose
Trick used with CCDs in NA32. Additional specification for mechanical design.Would give a factor 3.
• New FE-I4– Pixel size = 250 x 50 µm2
– Pixels = 80 x 336– Technology = 0.13µm– Power = 0.5 W/cm2
• FE-I4 Design Status– Contribution from 5 laboratories.– Main blocks MPW submitted in Spring
2008.– Full FE-I4 Review: 2/3/3009– Submission in Summer 2009
– Expect IBL modules late 2010
7.6mm
8mm active
2.8mm
FE-I3 74%
20.2mm
active16.8mm
~2mm
~200μm
FE-I4 ~89%
Char
tere
d re
ticul
e (2
4 x
32) IBM
retic
ule
~19 mm
FE-I3 - lifetime issueSolution B
Use FE-I4. Factor 5 more radiation tolerant than FE-I3. For IBL projectPlus - better matched to track hit distribution at 220. - Common module design for 220 and 420 - 2 x Fe-I4 each plane
NOTE: IMPROVED Y-Measurement. Consequence for physics ???NOTE2: Assumes hits distribution stable with time…..
FE-I3 versus FE-I4
• FE-I3 run had very poor yield. There will be another run in 2010.
• FE-I4 First run will produce chips in summer/Autumn 2010
ASIC designs always take more than one iteration.
FE-I4 3D sensor is larger and thus yields will be lower.
Conclusion
FE-I4 baseline. There will be 3D/FE-I4 detectors developed for IBL.
Mechanics/electronics engineers to look at FE-I4 design.
FE-I4 - common 220/420 mechanics design