atlas italia / csn1 referee – ibl g. darbo – infn / genova roma, 14 june 2010 o ibl insertable...

ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 June 2010o

IBLInsertable B-

Layer

ATLAS Italia / RefereeRoma, July 14th 2010G. Darbo – C. Meroni

INFN / GE – MIOn behalf of INFN IBL

Agenda:http://indico.cern.ch/conferenceDisplay.py?confId=100499

http://indico.cern.ch/conferenceDisplay.py?confId=100499

ATLAS Italia / CSN1 Referee – IBLG. Darbo – INFN / Genova Roma, 14 July 20102

OutlineStatus of the IBL project

• With focus on INFN related activities

Status of the Technical Design Report (TDR)• Schedule• Consolidation of the Physics & Performance case for IBL

Interim-Memorandum of Understanding• Cost, resources, sharing

Richieste finanziarie e attività 2011


Material from Raphael/NealThe present 7 m long section of the beam-pipe will be cut (flange too big to pass inside the existing pixel) and extracted in situ.The new beam-pipe with the IBL inserted at its place.

ISTIBL Support Tube

Alignment wirers

PP1 Collar

IBL Detector

IBL Staves

Sealing service ring

IBL Specs / Params

• 14 staves, <R> = 33.25 mm.• CO2 cooling, T < 15ºC @ 0.2

W/cm2

• X/X0 < 1.5 % (B-layer is 2.7 %)

• 50 µm x 250 µm pixels• 1.8º overlap in ϕ, <2% gaps

in Z • 32/16 single/double FE-I4

modules per stave• Radiation dose 5x1015

neq/cm2


LHC Plans & IBL MilestonesIBL Milestones

• FEI4 submission : 6/2010. • sensor choice 6/2011.• FEI4 Version 2 eng. Run 9/2011. • first prod module 11/2012 • last prod module 9/2013.• Stave loading completed (incl. 3 months cont) 6/2014 • End of integration (incl. 3 months cont) 5/2015• IBL installation 5/2015 – early 2015 Installation possible,

but no contingency.

LHC plans (ATLAS “interpretation”)• Have a phase I and II• Phase I when 30÷50 fb-1

• Accumulate 300÷400 fb-1 on phase I• Agreed with CERN management to

have phase I shutdown in 2016 (unofficial yet).

IBL design specification (Lint, L)• Life dose @ integrated of 500 fb-1

• R/O: peak L=3x1034 @ LVL1=100kHZ

LHC

Ref. M. Nessi


FE-I4 (GE)FE-I4 submitted on July 1st at 14:00 (GMT)

• More than 2 years of engineering work for a team of >15 Engineers/physicist• Largest HEP chip ever! 20.2x19.0 mm2, 87 million transistors!• IBM accepted all the waivers, tomorrow the WRB at IBM will discuss the waivers and tell us the risk.• Fabrication time is 10-12 weeks. An expected delivery date will be provided 1-2 weeks after

submission. 60 Known Good Dies / wafer.

Money contributions collected following interim-MoU share.

• Engineering run cost > 500kCH• 16 8-inch wafer expected

FE-I4 FINAL LAYOUT 87M TRANSISTORS!

19.0 mm

20.2 mm

Engineering Team:At Bonn Tomasz Hemperek, Michael Karagounis, and Andre Kruth; at CPPM Denis Fougeron, Fabrice Gensolen, and Mohsine Menouni; at Genova Roberto Beccherle; at LBNL Julien Fleury (visiting from LAL), Dario Gnani, and Abderrezak Mekkaoui; and at NIKHEF Vladimir Gromov, Ruud Kluit, Jan David Schipper, and Vladimir Zivkovic.

Students:David Arutinov (Bonn), Bob Zheng and Frank Jensen (LBNL)

Physicists:Marlon Barbero, Maurice Garcia-Sciveres

60 KGD / Wafer16 Wafers


Module Prototype Program & Test Beam (GE, PI, TN, UD)

Sensors and IBL activities merging• Test beam coordination & analysis between IBL and Sensor R&D• EUDET telescope used by Planar, 3D and Diamond sensors: 3 µm resolution!• Common order and plans for FE-I4 prototype modules, bump-bonding at IZM.

• INFN contribution to the cost: 9k€• GE, TN and UD focusing on 3D, PI part of the planar prototyping

• Once sensor technology will be decided, INFN will contribute to production

Residual from EUDET extrapolation to 50µm pitch pixels (single hit clusters).FBK-Irradiated 3E sensors (*)

Flat top:High telescope resolution

50µm

IBLPlanar S

ensors

PI

3D SensorsGE, TN, UD

Diamond Sensors

Preliminary

Test beam Coordination within IBL WG1

ATLA

S

Collab

ora

tion

s f

or

sLH

C R

&D

∞


3D Sensor – Recent results(*)

3D sensors from FBK irradiated to 1015 – 5 x 1015 neq/cm2

• Karlsruhe: 26 MeV protons• Ljubljana: reactor neutrons

Lab & Test Beam measurements (*)• Very good efficiency at 80 V @ 1015

neq/cm2 (preliminary)

Not full 3D devices…• Full 3D in development at FBK

(*) Credits: June 2010 beam and lab tests name listM. Borri, M. Boscardin, L. Bosisio, V. Cindro, G.F. Dalla Betta, G. Darbo, C. Da Via, B. DeWilde, Su Dong, C. Gallrapp, C. Gemme, H. Gjersdal, P. Grenier, S. Grinstein, P. Hansson F. Hugging, A. La Rosa, A. Micelli, C. Nellist, S. Parker, H. Pernegger, O. Rohne, A. Rovani, K. Sjobaek, K. Tsiskaidze, J. Janssen, J.W. Tsung, N. Wermes.

Angle = 0º - Eff. = 99.0%

Angle = 15º - Eff. = 99.9%

p-irradiated devices (dose = 1015 neq/cm2)

Lorentz Angle @ B = 1.6 T)

Planar: ΘL = -7.4º ± 0.4

3D: ΘL = 0º


FBK – 3D Sensors for IBLIBL Design (slim and active edge):

• 3D sensor with slim edge (200µm) and full through columns. DRIE (Deep Reaction Ionizing Etching) is stopped by a 0.7µm membrane. In process 200 and 230 µm thick wafer batches. Expected wafers Oct.2010

• Active edge, with support wafer. Wafer end of the year.

• Wafer floorplan has 8xFE-I4, 9xFE-I3, CMS, ...

Planar Sensor

3D Sensor

700nm DRIE stopping membrane

FBK 3D wafer for IBL

FBK DRIE:200÷230 µm x 12µm


Indium Bump Bonding (MI, GE)

4 Pixels shorted

6 Pixels shorted

8 Pixels shorted

164 Pixels shorted

Dummy sensor Dummy FE

Indium BB at Selex (technology option, SiAg at IZM baseline)

• Selex qualified for small FE-I3 need to change the process to FE-I4

• First attempt with dummy was partially succesfuls

• Need to upgrade the flip-chip head and change pressure/temperature of the process

• Test with scan chains -> with FE-I4 if successful.

X-ray of FE-I4 size dummy bumped to dummy sensor


ROD (BO + GE)Redesign the ROD (Read-out Driver) architecture starting from the Pixel design:

• Reason: components obsolescence, bottle neck of the Architecture, complexity in debugging due to mixed DSP / FPGA environment.

Smart Idea:• Move the embedded processing used for calibration (4 DSP/Board) to

standard PC: use GB-ethernet

Responsibilities:• BO the ROD board,

FPGA, PowerPC Programming

• GE electrical-BOC to connect to FE-I4 modules without opto-link (debug the initial system)

INFN responsibility


Flex Hybrid Design (GE)Stave flex (technology / test demonstrator)

• Final layout made at GE submitted to CERN PCB workshop: in production

• 5 Cu layers and 1 Al layer (for LV)• Total thickness = 0.45mm• (Designed) Impedance = 80Ohm

Several additional designs• Single layer module flex, test boards, • Simulation of the full chain

undergoing at GE

EOS

Wing

Bus (10mm wide)

Simulation of transmission: CLK/DT-IN (40 MHz, multipoint)

Simulation of transmission: DT-OUT (160 Mbps, multipoint)


PP2 Redesign (MI)

IBL needs new Power Distribution System:• Increase of current per channel worst case (up to ~ 4A)• Solution: use two LDO (low drop outputs) / channel with current limit

Controller board• to improve the existing design (new FPGA)• Collaboration between Milano and Barcellona• FPGA: same ACTEL family but need to qualify

for radiation tolerance

Regulator Board

Controller Board

PP2 Crate


Stave Design (MI)STAVE CARACTERISTICS SIMULATION RESULTS

Pipe ID/OD[mm]

Omega Thickness

[µm]

Foam Density[g/cm3]

Coolant X/X0 [%] Thermal Figure of Merit (Γ)

[ºC•cm2/W]Bare

Stave with Coolant

Full layer (+ Module

+ Flex)

CF pipe, heavy foam 2.4 / 3.0 150 0.55 C3F8 0.48 1.056 17.25

CF pipe, light foam 2.4 / 3.0 150 0.25 CO2 0.36 0.956 18.56

Ti 3mm pipe, light foam 2.8 / 3.0 300 0.25 C3F8 0.66 1.276 2.79

Ti 2mm pipe, light foam 2.0 / 2.2 300 0.25 CO2 0.57 1.166 3.22

Design baseline defined:• Ti cooling pipe with CO2 cooling.Prototyping and test• Many prototypes made • Status: finalizing base line design• Major technical contributions from MI and

~1/3 of the project under financial responsibility of INFN

Baseline


TDRIBL Technical Design Report Status


TDR: Status & ScheduleMotivation for delay in TDR printout:

• LHC machine plans after Chamonix, luminosity profile, machine shut-downs impacted on IBL TDR.

Need of better documentation of Physics performance for the TDR ATLAS EB "IBL physics and performance taskforce”(M. Elsing, A. Andreazza)

• The TF will reinforce the efforts to ensure the completion of the IBL performance studies for the IBL TDR by end of August.

TDR draft (Schedule)• First draft circulated to selected readers,

comments received, being implemented.• Second review by experts: mid July.• TDR draft ready for distribution to IBL

Collaboration: 2nd week of August• Final TDR ready: 4th week of August• Submission to LHCC: 1st week of September

Iourii GusakovExisting B-layer

IBL (Staves)

Ed Moise

IBL (Staves)

IBL in the Physics Simulation & in the Engineering CAD Rendering


Physics & Performance TFconsolidate and extend present studies

• single particle performance (pions and muons) • tracks in jets (100 and 500 GeV di-jets, top, WH) • primary vertexing with high lumi. Pileup • b-tagging, especially redo high-pt jets studies

study different pileup scenarios• zero, 1034, 2*1034 and 3*1034 luminosity • estimate efficiency and fake rate vs lumi• demonstrate how IBL helps for robust tracking in jets, with fakes, …

add emulation of Pixel/SCT readout problems • study robustness of tracking and how IBL recovers performance

Status• IBL geometry existing, motecarlo production ongoing• Checking results on single tracks, tuning jets and vertexing• TDR editing… keep deadline!!!


IBL Performance (TF Results)Simulation shows:

• Clear improvement in impact parameter resolution (plot 1)

• Specially in the region pT<10 GeV, that in ATLAS is dominated by multiple scattering

• 50% improvement of rejection power in b-tagging (plot 2)

• Performance are stable even if existing b-layer is off (plot 3).

Plot 1(top events)

Plot 1Light jets rej.

Plot 3IP resol.


MOUInterim-Memorandum of Understanding


Memorandum of Understanding

IBL Memorandum of Understanding (MoU) • Between The ATLAS COLLABORATION, and Funding Agencies/Institutions of

the ATLAS Collaboration constructing the IBL (for the ATLAS construction was between Institutes and CERN).

• The MoU comprises all of the actions needed to construct and commission the IBL. The operation and maintenance of IBL is not a part of the present MoU and will be included, following its completion, within the M&O MoU framework. (IBL once delivered will be part of the Pixel Detector)

• Annexes define: work sharing and responsibility, cost contribution, project organization and management structure.

IBL interim MoU – Why an interim MoU?• Ad Interim MoU until sensor technology is chosen (Planar Silicon / 3D Silicon /

Diamond) - Decision on sensor technology (Spring 2011) – Sensor R&D and IBL communities work in tight collaboration to finalise a design matching IBL specification.

• Consolidate interest of Institutes and availability of funds


Development of Interim-MoU

IBL (interim)-MoU Status:• “IBL Kick-off” meeting (8/7/2009)

• Institutes express their interest in the IBL based on project WBS (Workpackage Breakdown Structure).

• Institute Board created with the Institutes interested in the project• Extended Pixel IB (Meetings: 1/03/2010 and 18/06/2010)• Defined sharing of work, cost amongst Institutes/Funding Agencies (i-MoU annexes)• All project is covered by resources – need x-check with Funding Agencies (FA)

• Status• Collecting feedback from FA on funding and general project support• Going to sign the interim-MoU?

INFN (BO, GE, MI, UD)• Quite active in the project, very good synergy and collaboration keeps up INFN visibility.


Institutes and Contributions to IBL

Note: the numbers in the table "are not final, nor are the suggested financial contributions yet firm, but are meant for a common overall discussion.”

Technology options refer to supplementary costs that are sensor technology specific and will be known before the definite MoU takes effect.

42 Institutes in the interim-MoU (few others are “observers” ).14 Countries + CERN

9.7 MCH total project cost


INFN Contribution to IBLTotal IBL cost:• 9741 kCH

Total INFN contribution:• 1400 kCH (14.4 %)• 1047 kCH CORE• 354 kCH M&O-A in-kind

~100 kCH presently on M&O-A could be deducted from INFN if cables (assigned as work responsibility) becomes in-kind contribution.


INFN Contribution to MoU Items

Resources and deliverables are summarized in the two tables


RICHIESTE FINANZIARIE

2011 – Programma attività INFN, richieste finanziarie, responsabilità, milestones


BOLOGNA

Attività 2011:• Sviluppo PCB prototipo ROD.• Sviluppo firmware FPGA e software PowerPC del ROD

• porting software da DSP (old Pixel ROD) a PowerPC• Test bench per sviluppo software TDAQ del ROD (Crate e Single Board

Computer – SBC)


GENOVA

Attività 2011• Sviluppo prototipo funzionale Flex Hybrid per lo stave e per il modulo• Disegno versione 2 del FE-I4 (sottomissione Autunno 2011)• Catena alta tensione: Test della catena completa di alta tensione con PS, cavi a PP1,

Flex hybrid, sensore• Si sta discutendo di installare I cavi nell Shut Down 2012/13 – sono su M&O-A,

potrebbero essere presi in-kind (stima ~40÷50 kCH).• Sviluppo prototipo & test dei moduli: in vista della produzione (2012) del 50% del totale• Sviluppo scheda BOC (back of crate card) elettrico per leggere moduli con ROD senza

opto-link (per QC RoD, test-beam, system test, produzione moduli…). In collaborazione con BO e gruppi tedeschi (BOC)


MILANO

Attività Milano 2011:• Prototipaggio e preproduzione stave• Modifiche schede regolatori PP2 (differenti specifiche FE-I4: VDD , IDD ),

scheda controller PP2 (nuova FPGA da qualificare con irraggiamento), backplane

• Sviluppo bump-bonding con Selex (alternativa technologica alla IZM)


TRENTO (Dot.1 PD)

Attività 2011:• Simulazione sensori in 2 D e 3D• layout sensori 3D (slim e active edge), layout maschere bump-bonding• Test strutture su wafer sensori 3D: prima e dopo irraggiamenti


UDINE

Attività 2011:• Sviluppo sensori 3D insieme a UD e TN (fase di prototipaggio), • Bump-bonding di FE-I4 con sensori 3D• Test-beam, irraggiamenti sensori 3D• Pre-produzione sensori (tecnologia da decidere a metà 2011)


Sommario Richieste e Responsabilità IBL

Responsabilità nel progetto IBL:• Giovanni Darbo: IBL Project Leader L1

https://twiki.cern.ch/twiki/bin/view/Atlas/InnerDetectorOrganisation

• Danilo Giugni Stave WG Coordinator L2https://espace.cern.ch/atlas-ibl/Shared%20Documents/IBL_Organization.v1.2.pdf

https://twiki.cern.ch/twiki/bin/view/Atlas/InnerDetectorOrganisation

https://espace.cern.ch/atlas-ibl/Shared%20Documents/IBL_Organization.v1.2.pdf


Milestones INFNMilestones – ATLAS IBL:

• IBL -Test beam di rivelatori con chip FE-I4 30/4

• IBL - Scelta baseline per i sensori 31/7

• BL - produzione e test prototipo ROD/BOC 31/10


ConclusionsIBL planned to be completed by 2015

• CERN/Experiments agree on a shutdown in 2016

TDR is progressing and documenting the technical design of the IBL• Deadline for submission to LHCC early September

iMoU ready to sign• Some Countries/Institutes already did.

INFN balanced between money contribution and visibility of activities, but

• Competition is high … and many want a seat on boat!


BACKUP SLIDES


IBL Project Status in PillsAll the aspect of the IBL project are pretty well covered:

• Some in advanced design or prototype phase, as mentioned sensor and FE-I4

Just to mention a few• Stave: baseline CO2 cooling & Ti-pipe, TM measurements & FEA simulation well on its

way.• Stave/module flex-hybrid: multi-layer and stacked single layer prototyping.• Internal services: design, simulation, prototyping• Off-detector R/O: architecture defined, detailing board design and firmware• Power chain: upgrade study of the PP2 regulator. Simulation & design, waiting FE-I4

for selecting power scheme. Sensor decision impacts HV selection.• Integration in SR1, installation mockup in bld. 180: designs, prototypes, getting parts• Stave loading: ideas, testing, looking at jigs• Layout: global supports, beam-pipe flanges, IST• 2012 shutdown: preparatory activities in the pit for IBL• Installation: guiding pipe, insertion/extraction table, ALARA• Cooling: cooling plant parameters, TM studies and prototypes for beam-pipe bakeout

For most updated overview checkout June IBL Workshop at hold Geneva Univ.:• http://indico.cern.ch/conferenceTimeTable.py?confId=93635#20100616.detailed

http://indico.cern.ch/conferenceTimeTable.py?confId=93635%2320100616.detailed


IBL LayoutBaseline layout decided

• 14 Staves, “reverse turbine” (there were two main options in Barcelona)

Beam-pipe reduction:• Inner R: 29 25 mm

Very tight clearance:• “Hermetic” to straight tracks

in Φ (1.8º overlap)• No overlap in Z: minimize

gap between sensor active area.

Layout parameters:• IBL envelope: 9 mm in R• 14 staves.• <R> = 33 mm.• Z = 60 cm (active length).• η = 2.5 coverage.


Extraction/InsertionProgresses on many areas:

• Installation mock-up (Geneva & CERN ) in bld 180• Extraction/Insertion “table” (LPSC Grenoble)• Long Guiding Tube (Brandeis)• Integration and Envelopes definition (CERN Atlas TC)• Beam-pipe split flanges (CERN Vacuum group)• ALARA (CERN Atlas TC)

InstallationMock-up in bld.180


IBL TDREditors: M.Capeans (CERN), K. Einsweiler (LBNL)

Chapter Editors: G.Darbo, T.Flick, M.Garcia-Sciveres, C.Gemme, H.Pernegger, O.Rohne, R.Vuillermetand quite many Contributors to different chapters: A.Andreazza, O.Beltramello, A.Catinaccio, I.Dawson, D.Ferrere,

KK.Gan, D.Giugni, Y.Gousakov, N.Hartman, I.Hinchliffe, F. Huegging, S.Kersten, N.Massol, P.Morettini, D.Muenstermann, L.Nicolas, M.Raymond, S.Rozanov, D.Su, W.Trischuk, C.da Via, E.Vigeolas and S.Wenig

Chapters’ Structure:1. Overview – IBL history, lifetime and failure issues, requirements, physics2. Modules – sensors (3 technologies), FE electronics, integration (bump-bonding, “mini- Flex”)3. Staves - mechanical concept for the stave, module loading, cooling and thermal issues, electrical

integration, internal services4. Integration - mounting staves with beampipe, services integration, final surface testing5. Control, Readout, and Integration - power supplies, opto-links, off-detector readout electronics,

external services, cooling plant, DCS, integration with the present detector DAQ/DCS6. Installation – beampipe extraction, mock-up, IBL transport and installation, connection and testing7. Commissioning – calibration, early data-taking plan with random triggers, charge injection, cosmic ray

data-taking8. Prototyping, Production Testing, System Testing 9. Critical Integration Issues – cooling, bakeout, powering, detector weight, material budget10. Project Management and Organization

Draft has 200 pages (too long?).Circulated to selected readers (many comments received):

Attilio Andreazza, Andrea Catinaccio, Allan, Nigel Hessey, Tim Jones , Leonardo Rossi, Steinar Stapnes, Georg Viehhauser, Norbert Wermes

atlas italia / csn1 referee – ibl g. darbo – infn / genova roma, 14 june 2010 o ibl insertable...

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