atlas itk - infn genovagemmec/talks/itk_talk_csn1_v1.pdf · 2017-04-30 · room di dispositivi...

Feb. 6, 2017 G.-F. Dalla Betta

ATLAS ITk CSN1 Meeting – Roma, 6 Febbraio 2017

Gian-Franco Dalla Betta1, Claudia Gemme2

1 University and TIFPA INFN / Trento 2 INFN Genova

On behalf of RD_FASE2: ATLAS Pixel BO, CS, GE, MI, TN, UD

Overview of the Phase-II Pixel upgrade ü  The project is now accelerating significantly given the schedule for the

Pixel TDR (Dec 2017).

2

•  PossibilitytohavetwoFEsubmissionsisincludedintheschedule.Moduleop:miza:oncanstartwithfirstchip.

•  Moduleproduc:onandloading:~27-33months

ü  The project is now accelerating significantly given the schedule for the Pixel TDR (Dec 2017).

Overview of the Phase-II Pixel upgrade

3

Zoom in 2017: •  Layout definition will allows groups to take

commitments on parts of detector. •  and preliminary design of the local supports.

•  RD53-A will be submitted in spring 2017à technological demonstrator of the 65 nm technology and module prototypes with small pixel size.

•  Bump bonding marker survey. •  Sensors: identify the baseline designs to be used in

the detector. A preliminary design of the data transmission and power distribution scheme will be included in the TDR.

•  Start of ATLAS chip design.


INFN Contribution to ITk & R&D’s –  3DPixelSensors→ RD_FASE2–(commonwithCMS)

•  InpartnershipwithFBK(Trento)• BaselinetechnologyinLayer0(maybealsoL1andRing0)

–  Bump-bonding→ RD_FASE2(inpartcommonwithCMS)•  Indiumthermo-compressionprocesswithLeonardo(exSelex)

–  PixelR/Ochip(RD53)→ common CHIPIX65projectofCSN5–  Pixelmoduleassembly/tes:ng→ RD_FASE2–  CMOSsensors(withSTM)→ HVR_CCPDprojectofCSN5–  Mul:moduleR/O&DAQ→ RD_FASE2–  Localsupport/CO2cooling→ RD_FASE2–  Simula:on&tracking

4

Several topics also co-funded by EU AIDA2020

Mai

n ta

rget

of t

he R

&D

4


A3vità Descrizione BO CS GE MI TN UD TOT

3DSvilupposensoriconFBK(inclusisubstra:,etc.)

- - 65 - 38.5 - 103.5

BBBumpbondingdimodulipersensori&QualificazioneBumpbondingadaltadensita’suW.12”

- - 62 110 - - 172

MODULI Assemblaggiomoduli,test,irraggiamen:,etc. - 7 22 2 8.5 2 41.5

READ-OUTSvilupposistemaREAD-OUTmul:modulo

42.5 - - - - - 42.5

MECCANICAECOOLING

QAsuppor:localiecontributoalCoolingSystemITk - 8 26 57 - - 91

TotalperGroupGrandTotal

42.5 15 175 169 47 2 450.5

450.5

Assegnazioni RD_FASE2 a ITk 2014-2017 (inclusi items comuni con CMS)

5

Feb. 6, 2017 G.-F. Dalla Betta 6

Data Descrizione % Note

31-05-2014 Presentazione documenti relativi alle attivita' di R&D, pianificazione temporale e gruppi coinvolti

100

20-12-2014 Realizzazione batch sensori planari a FBK con prove tecniche di foratura

100

Milestones 2014

Milestones 2015


31-07-2015 Verifica batch FBK n. 2 pixel planari su wafer DWB 6". Se positiva seguono test di moduli single ROC con pixel planari

100

30-11-2015 Qualifica della prima produzione di pixel 3D single side FBK

0 Riportata al 2016



31-07-2016 Pixels, Caratterizzazione in clean room di dispositivi planari e 3D

100

30-11-2016 Pixels, test in laboratorio di moduli 3D 100

30-11-2016 Pixels,Definizione Layout per pixel 3D e planari compatibili con i prototipi del chip di lettura previsto per RD53

100

Milestones 2016

Milestones 2017 Data Descrizione % Note

31-07-2017 Prove su fascio di rivelatori a pixel 3D con chip di lettura FEI4 e PSI46dig

100

31-10-2017 Caratterizzazioni in laboratorio di sensori a pixel planari con pitch 50x50um e 25x100um

Confidenti di soddisfare pienamente

Italian R&Ds à 3D sensors ü  Achieved so far:

•  Feasibility of small-pitch 3D demonstrated, tested with large pitch read-out •  Extensive testing of 3D modules under way with good results

•  Very promising results also from irradiated test structures

8

Preliminary test beam results

Italian R&Ds à 3D sensors ü  Achieved so far:

•  Feasibility of small-pitch 3D demonstrated •  Extensive testing of 3D modules under way with good results

•  Very promising results also from irradiated test structures

9

ü  Towards the TDRà Qualify FBK as a 3D vendor •  Need to qualify sensors for extreme radiation

hardness. •  proceed with irradiations of FE-I4 modules, looking

forward to RD53A ROCs (~fall 2017)

•  One 3D batch being launched now (funded by AIDA 2020), another one (already funded by RD_FASE2) to be produced, essential to finalize this R&D, still waiting for the new agreement with FBK for pixel sensors.

3D wafer: New layout

Italian R&Ds à Bump-Bonding@Leonardo

10

ü  Achieved so far: •  Bump bonded FBK 3D and planar sensors. •  High bump density deposition (50x50 µm2 over 2x2 cm2) validated with

electrical and visual QA on 6” wafers with dummy chains.

•  Started validation of high density BB on 12” wafer. So far just bump deposition on bare Silicon.

Source scan of a 3D sensor bump bonded to a +FEI4 by Leonardo

Bump R of dummy chains

High density Bumps X-ray

Italian R&Ds à Bump-Bonding@Leonardo

ü  Achieved so far: •  Bump bonded FBK 3D and planar sensors. •  High bump density deposition (50x50 µm2 over 2x2 cm2) validated with

electrical and visual QA on 6” wafers with dummy chains.

•  Started validation of high density BB on 12” wafer. So far just bump deposition on bare Silicon.

11

ü  Towards the TDRà Qualify Leonardo as a BB vendor •  Next step is to deposit bumps on 12” wafer with

resistive chains. If successful to be used for RD53A wafer in Fall 2017

•  For the TDR and beyond: Qualify Leonardo to do high density In bump deposition on 12” wafers and maybe part of the flip-chip.

•  Deposited wafers may be flip-chipped by users in the collaboration (BCN, Moscow, Glasgow, Geneva, etc...).

12” dummy chain wafer

Italian R&Ds à Read-out ü  Profiting of IBL (and Pixel Layer 2/1 on-going upgrades) experience

in Read-Out Card design/production/qualification. ü  The idea is to produce a table top card, replacing the ROC+BOC

current pit implementation: •  Manpower: 2 FTE with electronics Workshop in Bologna •  For the TDR: qualify the system for the detector offline readout.

12

Italian R&Ds à Mechanics/Cooling

ü  Participation to the ITK cooling system with the design, construction and tests of the splitting box (Genova): •  Prototypes to be ready in

summer for QA at CERN.

13

8 Pump

1 4

7

3 2

9

Staves

Transfer line

5 6

PP2 PP1 Plant in USA15

Chiller

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PP1 Splitting box

Italian R&Ds à Mechanics/Cooling

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ü  CO2 evaporative system with recycle now available for ATLAS and LHCb in Milano.

ü  Slim longeron (Support of the inclined solution) •  Manufacturing of the Al moulding. •  Thermo mechanical FEA: stress in the cell critical interfaces and thermal

radiation effect studies.

•  Planned CO2 tests of cooling circuits with the 2PACL Traci unit. •  Planned measurement of the cell solder/tim interfaces before and after

cooling/pressure cycles.

SLIM Local Support for Inclined Layout

Al mould short prototype

Cell FEA studies

E cosa costruiamo? ü  We are discussing if to take responsibility of building one End-cap,

so far uncovered. •  The other one is built by UK colleagues. •  Building the innermost barrel layers - as originally proposed to better

match our sensor interests - seems to be difficult as there is a strong US interest and our design and engineering capabilities are limited.

•  This is not expected to damage our interest and leadership in the 3D sensors as the pixel production model decouples the module production&test from their installation on detector.

ü  Meeting in Genova on Feb 8/9 to discuss the current status of the activities, push them to be relevant in the Pixel TDR and discuss if to take the responsibility to deliver the End-cap.

ü  This is an ambitious project (2.5 m length, 60 cm diameter, 2.5 m2 surface) but may be a big opportunity to boost the Italian contribution: •  New groups have shown interests in this opportunity (Lecce, Frascati).

15

Aggiornamenti in un paio di mesi

Production organization for the pixel detector

PoolofQualifiedSupports

(Staves,Half-Rings)

PoolofQualifiedModules

(3D,planar…)

EC Loading Sites receive QA Half-rings + QA modules

Barrel Loading Sites receive QA Staves + QA module

Lab1Lab1Lab3LabN

Lab1Lab2LabM Modules and

Supports QA sites are not necessarily correlated to the Loading sites

Module Loading: Robot, Survey Loaded supports QA: HW setup, source, cold box

A possible model for Italy

ü  Module Assembly e QA: •  Assembly e QA dei 3D (~1 m2 /2 vendors ) – per paragone 0.04 m2 sono i

3D installati in IBL. •  Altro se necessario per il nostro share.

à Coinvolgere piu’ lab: almeno 2 per module assembly, 4-5 per module QA. à E’ MOLTO importante per il formare competenze per l’operazione negli

anni futuri!

ü  Module Loading and QA: •  A Genova montati in passato ~ 40 staves (~500-600) moduli.

•  Procedura lenta , va sicuramente ottimizzata.

à1/2 siti per il Loading (Genova/xx) à Almeno 2 siti per la QA dei moduli sui supporti.


ü  Integration: •  To be defined.


Riassunto FTE 2017

Sez. RD_FASE2 HVR_CCPD CHIPIX65 AIDA2020

BO 1.00 0.40 - -

CS 0.80 - - -

GE 3.70 1.20 - 0.15

MI 2.12 1.20 1.50 0.35

TN 3.30 - - 1.00

UD 1.30 - - -

Total 12.22 2.80 1.50 1.50

Sezione First+Name Family+Name Ruolo RD_FASE2+ HVR_CCPD CHIPIX65 AIDA2020BO Federica Fabbri PhD 0,20 1 1 1BO Davide3 Falchieri Tecn.3Cat.3D 0,20 1 1 1BO Alessandro3 Gabrielli RU 0,20 1 1 1BO Carla Sbarra RIC 1 0,20 1 1BO Antonio Sidoti RIC 0,20 0,20 1 1BO Maximiliano Sioli PA 0,20 1 1 1CS Anna Mastroberardino RU 0,50 1 1 1CS Daniela Salvatore Assegnista 0,30 1 1 1GE Giovanni Darbo DR 0,60 0,30 1 1GE Andrea Favareto Assegnista 0,30 1 1 1GE Andrea Gaudiello PhD 0,50 0,30 1 1GE Claudia Gemme RIC 0,20 0,10 1 0,15GE Silvia Miglioranzi Assegnista 0,20 1 1 1GE Paolo Morettini 11RIC 0,60 0,20 1 1GE Hideyuki Oide Borsa 0,40 1 1 1GE Leonardo Rossi DR 0,20 0,10 1 1GE Cecilia Rossi Tecn. 0,30 1 1 1GE Mario3 Sannino PA 0,40 0,20 1 1MI Gianluca Alimonti RIC 0,50 1 1 0,20MI Attilio Andreazza PA 1 0,30 1 1MI Mauro Citterio D1TEC 1 0,10 1 1MI Simone Coelli Tecn. 0,40 1 1 1MI Luca Frontini PhD 1 1 0,60 1MI Danilo Giugni P1TEC 0,50 1 1 1MI Valentino Liberali PA 1 0,20 0,40 1MI Chiara Meroni DR 0,25 0,30 1 0,15MI Francesco Ragusa PO 0,10 0,30 1 1MI Seyedruhollah Shojali Assegnista 1 1 0,50 1MI Clara Troncon 11RIC 0,37 1 1 1TN Maurizio Boscardin RIC 0,10 1 1 1TN Gian1Franco Dalla3Betta PO 0,50 1 1 1TN Mostafa El3Khatib PhD 0,50 1 1 1TN Roberto Iuppa RTD1A 0,10 1 1 1TN David Macii PA 0,70 1 1 1TN Roberto Mendicino PhD 1 1 1 1,00TN D3M3S Sultan PhD 0,70 1 1 1TN Giovanni Verzellesi PO 0,70 1 1 1UD Mario3Paolo Giordani RU 0,30 1 1 1UD Gilberto Giugliarelli RU 1,00 1 1 1

Total 39 12,22 2,80 1,50 1,50

Total for the 4 R&D of interest for ITk - 39 persons (same as in 2016) - 18 FTE (was 16.2 in 2016)


Lecce e Frascati hanno dimostrato serio interesse a partecipare; altri laboratori potrebbero aumentare il loro contributo à FTE>25 nei prossimi anni


Itk Money Matrix

GRAND TOTAL = 6282,60 kCHF

Pixel Contributions Italy

Common Item Contribution Italy

Final Message

20

ü  2017 important steps:

•  Contribute to the TDR!

•  Test 3D sensor at very high fluence and produce new batches for test and assembly with RD53A.

•  Qualify the high density bump deposition on 12” wafers.

•  Choose a detector part to built and contribute with our expertize there.


Back-Up Slides

•  Funding 2014-2017 •  General ITK •  Sensors •  Bump Bonding •  Mechanics •  ITk Cooling •  Electronics


RD_FASE2: Assegnazioni 2017

Fund

ing



1)  In corso ordine congiunto GE-MI a Selex per BB (40 kEuro) + residuo ~12 kEuro per lavorazione wafer 12’’

2) In attesa di riattivazione convenzione per ordine a FBK 3) Include contributo 2016 a Baby Demo

1 2

3

23 Fu

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A3vità Descrizione BO CS GE MI TN UD

3D

6"Waferprocurement(SOI,waferbonding,epi) - - - - 10.0 -PicoScope6407Digi:zerwith1.5GHzprobesandaccessories. - - - - 8.5 -

BB

6"dummywafers-testdeposi:onon6"andhigh-densitybumps(150k-bumps/chip) - - - 20.0 - -

BBfor3Dsensortest - - 24.0 - - -

MODUpgradeR/OSystems - 2.0 2.0 2.0 - 2.0

Moduleassemblyandirradia:on,RDonflex - - 10.0 - - -

MM-R/O Mul:moduleR/O 15.0 - - - - -

CO2/µCH Developµ-channelcooling - - - 10.0 - -

TotalrequestedbyATLAS15.0 2.0 36.0 32.0 18.5 2.0

105.5


Fund

ing


2014: CSN1 funded (Feb and May) R&D Phase 2 activities for ATLAS & CMS inner trackers.

–  Developmentof3DandAc:veEdgesensorswithFBK–3Batches(ATLAS/CMS)–  Bump-bonding:developmentofIndiumbumps(6”sensors)andproduce

modules–  Developatechnologyforpixeldetectorhybridiza:onusingC(dielectric)instead

ofR(bump-bonding)coupling–  Comple:onofCO2testplant(combinedATLAS/LHCb)

Assignedon Sezione Category ATLAS/CMS/COMMON Assigned DescripVon

Feb2014 GE 3D COMMON 21000 Waferfor3Dsensors(commonwithCMS)

Apr2014 GE 3D COMMON 44000 3processesatFBK:2commipedwithMEMS3

May2014 GE HV ATLAS 13000 HV-CMOSHybridiza:on+3FE-I4Bwafers

May2014 MI BB ATLAS 27000 BBof3D(IBLdesignon6")+3FE-I4Bwafers

May2014 MI CO2/µ-CH ATLAS 20000 TRACI:co-fundedwithLHCb

125000


Fund

ing

Itk Layout à strip TDR

2608/05/2015 RoadmaptoLayoutWorkshop

Strip

Pixel

One layout for strip; two concepts for pixel.

Gen

eral

ITk

The ITK Pixel detector: FullyInclined

27

Outer Barrel

End cap

Innermost: Barrel + endcap

Same Endcap in both layouts, optimized for the Extended

Gen

eral

ITk

The ITK Pixel detector: Extended

28

Outer Barrel

End cap

Innermost: Barrel + endcap

Gen

eral

ITk

Same Endcap in both layouts, optimized for the Extended

performance

29

Gen

eral

ITk

Surfaces

Una Endcap à 3.3 m2 ma in processo di ottimizzazione, si potrebbe ridurre del 30% Il Pixel detector oggi e’ 1.9 m2

Gen

eral

ITk

Bump-bonding: Selex à Leonardo ü  Requirements/challenges:

•  5x bump density of current IBL à 120 k-bumps/chip FEI4 size •  Optimize the process on dummies (produced by FBK), studying bump height, size

and the process parameters as pressure and temperature. •  Visual, mechanical and electrical test of the parts and assemblies.

•  Bump deposition on 12-inch electronics and 8-inch sensors wafers (was 8” and 6”)

•  Optimize the process on dummy supports •  Wafers and deposition masks procured: test uniformity of bumps deposition.

•  Handling of thin electronics (100 µm has been achieved for few FEI4 test

modules). •  Indium bumps have an easier process that does not need temporary support

wafer à competitive for innermost layers

•  10x total surface (14-18 m2 vs current pixel of 1.7): •  Need to optimize production flows and reduce bottle-necks as Flip-chip à

outsourcing ?

ü  We are working with Leonardo for the R&D phase and to qualify it as vendor.

31

Bum

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Bum

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Bump-bonding@Leonardo: resistive chains

ü  Very promising results from first resistive chain tests on 6”: •  Bumps resistivity as expected •  No open among 64k bumps (3 chips) •  No indication of shorts (either by X-rays or R measurement) •  Mechanical tests with thermal cycles on module-like structure are fine. •  Flip-chip planarity needs to be improved.

ü  Next steps: •  Resistive chain QA with 12” wafers •  … until high pitch density is available with real sensors/RD53A

34

Bum

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Bump-bonding@Leonardo: 12” deposition

ü  Bump deposition on 12” bare wafer (just Si, no pattern) with several bumps openings under test •  Wafer has been visually analyzed and bumps height measured with a

profilometer •  preliminary results on bump height (~10 µm) uniformity good (~1 µm) if

opening is larger than 16 µm. •  Some problems at the photoresist lift-off due to low number of bumps

(bump density is nominal but only in spots uniformly distributed over the wafer surface).

ü  Next steps on daisy chains: •  More tests needed with high bumps density all over the wafer and

daisy chains to measure bump resistivity. •  Resistive chains layout on 12” is a common layout for all the groups. •  In fabrication nowà BB in March.

35

Bum

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Bump-bonding@Leonardo: 12” deposition

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Bum

p Bo

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SLIMLONGERONPROTOTYPEPRODUCTION:MANUFACTURINGOFALUMINUMMOULDS

MODELOFTHEMOULDINTERNALCOMPONENTSWITHCRITICALMACHINING

DETAILOFTHECARBONFILAMENTSCORNERCROSSING(THEVOLUMEFIBERNEEDSTOBEMAINTAINEDCONSTANT)

37

STRUCTUREALUMINUMMOULDSFOR:•  TESTPROTOTYPES•  FULLLENGTH

COMPONENTS

FORTHEPRODUCTIONOFTHECARBONFIBERLONGERON

Mec

hani

cs

STAINLESSSTEELMOULD

ALUMINUMMOULDSHORTPROTOTYPE(200mm)PRODUCEDINMILANOMECHANICALWORKSHOPSENTTOCERNTOTESTTHEDE-MOULDINGPROPERTIES

38

WORKINPROGRESS:MANUFACTURINGSTUDIESFORALUMINUMFULLASSEMBLYMOULD,LENGTH400mm

Mec

hani

cs

EXAMPLESOFCARBONFIBERLONGERONSTRUCTURESUNDERTEST

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Mec

hani

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SLIMCELLCRITICALINTERFACESUSEOFADVANCEDMATERIALS(NOALLDATAAREAVAILABLE)•  SOLDERING(BRAZING)

BETWEENPIPEANDCOOLINGBLOCK

•  PHASE-CHANGE-THERMALINTERFACE-MATERIAL

MATERIALCTEANDYOUNGMODULESUNDERINVESTIGATIONFEACALCULATIONOFTHESTRESSINTHEINTERFACES

BARRELCELL

40

THERMO-MECHANICALFEA:EVALUATIONOFTHESTRESSINTHECELLCRITICALINTERFACES

TILTEDCELL

ISO-GRAPHITEBLOCK

Sn-37PbSOLDER

PHASE-CHANGETHERMALINTERFACEMATERIAL

TPGPLATE

Mec

hani

cs

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FEASTUDY:EFFECTOFTHETHERMALRADIATIONONTHETHERMALFIGUREOFMERIT

THERMALRADIATIONEFFECTMODEL:CELLINACLOSEDCYLINDERENVELOPETOSIMULATETHEENERGYEXCHANGEWITHTHESURROUNDINGENVIRONMENTDUETOTHEINFRAREDRADIATIONEMISSIVITYCASESSTUDIED•  Ɛ=1(BLACKBODY)•  Ɛ=0.5(GRAYBODY)

Mec

hani

cs

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EFFECTOFTHETHERMALRADIATIONHEATEXCHANGEWITHASURROUNDINGENVIRONMENTAT20°C,FORBOTHTHEBARRELANDTILTEDSLIMCELLS:THETHERMALFIGUREOFMERITCHANGESWITHTHECOOLINGTEMPERATURE,WITHTHEEMISSIVITYOFTHEFACINGOBJECTS=>INCREMENTOFTHE6TO9%OFTHETFOMDUETOTHERMALRADIATIONEXCHANGE

Mec

hani

cs

COLDBOXFORSLIMCELLSOLDERING/THERMALINTERFACE

THERMALTESTBEFOREANDAFTERTHERMAL/PRESSURECYCLING

DEDICATEDCOLDBOXDESIGNCOMPLETEDCONSTRUCTIONWORKINPROGRESSDRY-AIRFLUXEDCHAMBERWITHINTERNALDEWPOINTMEASUREMENTCO2COOLINGSUPPLYFROM2PACLTRACICOOLINGUNITARMAFLEXINSULATIONTEMPERATUREPROBESATTACHEDTOTHESYSTEMUNDERTESTPOWERSUPPLYFORHEATERDUMMYLOADSLIMBARREL/TILTEDCELLUNDERTESTPRE-QUALIFICATIONUSINGADUMMYPROTOTYPE

43

Mec

hani

cs

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TESTPLAN:1.  MEASUREMENTOFTHETHERMALFIGUREOFMERIT,APPLYINGPOWERWITHHEATERS

ANDMEASURINGTHETEMPERATURES,COOLINGTHECELLUSINGTHECO2SUPPLYFROMTHETRACIUNIT

2.  CYCLETHEPROTOTYPE(100)TIMESBETWEENAMBIENTANDCOLDTEMPERATURE(-40°C)

3.  POST-MEASUREMENTOFTHETHERMALFIGUREOFMERITAFTERTHECYCLES

CLIMATICCHAMBERTHERMALTEST

Mec

hani

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CO2FLUID-DYNAMICCHARACTERIZATION

0

0.5

1

1.5

2

2.5

3

3.5

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9

ORIFICE

PRE

SSURE

DRO

P-ba

r

MASSFLOWRATE-g/s

SWAGELOKFLOWRESTRICTORCALIBRATEDORIFICE=0,25mm(0,01")

CO2T,P(OUTLETFLOWRESTRICTOR)=-20°C,20barA

45

CO2TESTOFCOOLINGCIRCUITCRITICALCOMPONENTSWITH2PACLTRACIUNIT

SOLVEDTHEPROBLEMSFOUNDINTHEPUMP:NEWGASKETTOWITHSTANDEXPLOSIVEDE-COMPRESSIONUNDERFINALCOMMISSIONINGATCERN

MILANOCOOLINGLAB.2PACLTRACIV.3UNIT

Mec

hani

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NEXTFEATASKS:ANSYSACPFINITEELEMENTANALYSIS

EXAMPLE OF OPTIMIZATION PROCESS FOR THE TILTED CELL COOLING BLOCK

SLIM LONGERON FEA PERFORMANCE. RIGIDITY, VIBRATION FREQUNCIES, THERMO-MECANICAL STABILITY, MOUNTING FIXATIONS AND DETAIL STUDIES

46

Mec

hani

cs

ITkCoolingsystemGenovaisinvolvedinthesplizngboxprojectandproduc:on.

3Dmetallicprintedprototypebysummer:me.

47

Plant →PP1 •  Common Mechanics group (Lukasz Zwalinski, Paolo Petagna, … ) •  DEMO & BABY DEMO

PP1→Detector•  Pixelside(DaniloGiugni,…)

8 Pump

1 4

7

3 2

9

Staves

Transfer line

5 6

PP2 PP1 Plant in USA15

Chiller

7

Splitting Box Splitting Box

ITK

Cool

ing

SchedaPixel_ROD

Features•  7-seriesXilinx®FPGAs

ü  Kintex®7XC7K325Tfortriggeranddataprocessingü  Zynq®Z020withphysicaldual-coreARMCortex-A9

•  1xPCIeExpressinterface(4GB/stowardsthePCmemory)•  16xGTX@10Gb/s

ü  1x10-Gb/slink(GBTx)•  1xHPC(400-pin)HS(HalfpairBOC-ROD)•  2xLPC(160-pin)HSdifferen:allinesManPower(anyoneWelcome!!)•  INFN(Lab.Elepronica)

•  G.Balbi,D.Falchieri,G.Pellegrini•  DIFA:A.Gabrielli+studen:

•  G.D’amen(XXXPhD12-2017)•  N.Giangiacomi(XXXIPhD12-2018)•  F.Alfonsi(Magistrale06-17)•  C.Pre:(Magistrale03-17)

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