aurix multicore lauterbach handout market positions* nno. 2 in automotive semiconductors worldwide...
TRANSCRIPT
AURIX™MultiCore Microcontroller
Lauterbach Experts′ Forum, 19. Aug. 2015, Beijing
Dirk Geiger | 葛德克
Director Automotive Marketing, China (IFX CN ATV SMD AP M) | 市场总监Infineon Technologies (China) Co. Ltd., Automotive Electronics | 英飞凌科技(中国)有限公司,汽车电子
Agenda
› “AURIX™ Multicore”
– Trends in Automotive– IFX company introduction– AURIX™ product overview– AURIX™ MultiCore– Lauterbach and Infineon
2set date Copyright © Infineon Technologies AG 2015. All rights reserved.
InfineonCompany Presentation, 2015
17.1 17.6 18.6 21.3 23.1 24.9 26.7 28.1 29.2 30.0
19.0 20.2 19.3 19.5 20.0 20.3 20.8 21.6 22.4 22.611.9 13.1 15.416.2 17.0 17.4 17.9 18.4 18.7 18.9
9.1 7.9 9.49.0
9.2 8.5 8.0 8.0 7.8 7.9
4.2 4.64.5
4.54.5 4.4 4.4 4.2 4.2 4.0
13.0 13.414.3 14.3 13.8 14.8 15.9 16.9 17.9 18.9
74.4 76.981.5 84.7 87.6 90.4
93.897.2 100.3102.3
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019
China Europe N. America Japan S. Korea Others
229
428
435
461
362
219
287
481
481
498
404
234
China
Europe
N. America
Japan
S. Korea
Others
Car Production Growth is driven by China, South-East Asia and European recovery
CAGR(14-19) = 3.2%
Source: IHS, September 2014
[units m]
Global car production (cars ≤ 6t)
+3.5%
[USD per car – 2019 vs. 2014]
Worldwide2014 2019 CAGR
334 363 1.64%
Semiconductor Value per Car
Source: Strategy Analytics, July 2014
CAGR14-19 2.0%
CAGR14-19 2.4%
CAGR14-19 4.6%
CAGR14-195.3%
CAGR14-19 2.8%
CAGR14-19 1.6%
CAGR14-19 -3.0%
CAGR14-19 -1.5%
CAGR14-19
6.6%
CAGR14-19 2.3%
CAGR14-19 1.3%
CAGR14-19 1.6%
Page 42015-Q1 Copyright © Infineon Technologies AG 2014. All rights reserved.
Market Growth Fuelled by Car Production Growth and Increasing Functions Enabled by Semiconductors
Source: IHS, September 2014
Global car production (cars ≤ 6t)
Source: Strategy Analytics, July 2014
Semiconductor market by segment
Semiconductor value per car
CAGR14-19
+6.4%
CAGR14-19
+6.4%CAGR14-19
+4.5%
CAGR14-19
+7.6%
[USD bn]
* Safety = “Safety” + “Chassis” according to SA definition.** Body = “Body” + “Security” according to SA definition.
19.0 20.2 19.3 19.5 20.0 20.3 20.8 21.6 22.4 22.6
11.9 13.1 15.4 16.2 17.0 17.4 17.9 18.4 18.7 18.917.1 17.6 18.6 21.3 23.1 24.9 26.7 28.1 29.2 30.010.8 11.5 12.8
12.7 12.6 13.3 14.0 14.6 15.3 15.8
9.1 7.99.4 9.0 9.2 8.5 8.0 8.0 7.8 7.9
6.4 6.66.0 6.0 5.7 5.9 6.3 6.5 6.8 7.1
74.4 76.981.5 84.7 87.6 90.4 93.8 97.2 100.3102.3
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019
Europe North America China APAC ex China Japan ROW
CAGR14-19 = 3.2%
[units m]
+3.5%
CAGR14-19+2.8%
CAGR14-19+1.6%
CAGR14-19+5.3%
CAGR14-19+4.6%
CAGR14-19-3.0%
CAGR14-19+5.6%
CAGR14-19
+1.64%
[USD]
324334
363World
2019 2014 2013
6.0
7.4
9.4
6.5
8.6
9.3
12.9
8.9
Infotainment
Body**
Safety*
Powertrain
2019 2014
Page 52015-Q1 Copyright © Infineon Technologies AG 2014. All rights reserved.
Market Trends
■ Dwindling energy resources■ Urbanization■ Stricter CO2 emission legislations■ Growing environmental awareness
Infineon's Opportunities
n Infineon components are key enabler for car manufacturers to meet challenging targets for CO2 emission reduction, e.g. in the EU 95g CO2/km in 2021
n We offer Hybrid and electric drivetrain products (HybridPACK™/HybridPACK™ DSC)
n No electric vehicle without semiconductors: electric drive and control, battery management, on-board battery charging and power grid communication
We Focus on Future TrendsMaking Cars Clean
Page 6May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
USA[2]: 133
USA[2]:103
EU: 95Japan: 105
China[1] :117
60
80
100
120
140
160
180
200
2010 2015 2020 2025
Gra
ms
CO
2/k
m n
orm
aliz
ed to
NE
DC
Tes
t Cyc
le
Semiconductors Are Indispensable in Reaching CO2 Emissions Targets
Two main trends drive reaching the CO2 emission goals – enabled by
semiconductors
Historical national fleet emissions performance and future targets
Source: The International Council for Clean Transportation
historical performanceenacted targets proposed targets
Higher efficiency of the‘classic’ ICE:n EPSn TPMSn Start-stopn Dual Clutchn Alternator
Electrification of theDrivetrain:n Main Invertern Auxiliary Invertern Onboard Chargern Battery Management
Page 72015-Q1 Copyright © Infineon Technologies AG 2014. All rights reserved.
Smart Mobility
Page 81/20/2015 Copyright © Infineon Technologies AG 2015. All rights reserved
Infineon provides Mobilitysolutions for Smart Cars/CCAVs,
Electro-Mobility and Transportation Infrastructure
Electrification of Power train for Cars & Auxiliary Drives
Leadership in Autonomous Driving
Smart Traffic Management &Improved Road Safety
Automotive Safety & Security solutions
NEV Electric Drive Train & Charging Contactless Payment
Infineon's Opportunities
Infineon components covers the overall needs of the autonomous vehicle:
n AURIXTM microcontroller family enables dependable and secure processing
n Sensing technologies (e.g. Radar, Hall, 3D Imager) increase performance of ADAS systems
n Safe actuation solution (e.g. 3 phase Bridge Driver IC) and safe power supply enable dependable vehicle dynamics and control
We Focus on Future TrendsMaking Cars Safe
Key system requirementsMarket trends
ReliabilityAccident avoidance
Autonomous driving
Cyber-networked car
High Availability
Functional Safety (ISO26262)
Cybersecurity
Courtesy: Bosch
Page 9May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Automotive Cyber-Security
Page 1013.08.2015 Copyright © Infineon Technologies AG 2013. All rights reserved.
Infineon Technologies is leading the security industry for over 25 years
Market Leadership with Broadest Security Offering
Market Leadership with Broadest Security Offering
Innovation Leadershipwith Pioneering Innovation
Innovation Leadershipwith Pioneering Innovation
Leading in Smart Card Microcontrollers
Leading in Embedded Security
Highest security standards-compliant
First 32bit multi-application security µC
Best combination of Security, Performance and Multi-FunctionAward-
winning digital security
Most innovative packaging technology
Enable world’s fastest contactless ePassport
>20bn security
chips shipped
Payment MobileCommunication
GovernmentID Transport
Authentication TPM Mobile Security
Page 111/20/2015 Copyright © Infineon Technologies AG 2015. All rights reserved
Secure Flexible Fast Mask
CC EAL5+EMVCo
PBOC 3.0CIPURSE™
Infineon is the right partner for addressing security in automotive
311
34
56
2010 2013 2016 2019
Secure Elements for Telematics & V2xSLI 76SLI 97
Microcontrollers with Integrated Security Trust AnchorAUDOMAXAURIXTM
Scalable HW & SW Security Solution
Threat & Attack Scenario Analysis
Security-Certified Concept, Design and DevelopmentProcess
Large Portfolioof Common Criteria Certified Products
Security-Certi-fied ProductionSecure Persona-lization
Infineon's system offering
Source: Strategy Analytics; active and inactive systems, cumulative
Automatictoll collection
NavigationE-Call
Power ondemand
Local-basedservices &
advertisement
Internet
Traffic alerts / V2V
Maintenanceupdates
[units m]
Applications subject to hacker attacks
Forecast for cars with eCall
Page 122015-Q1 Copyright © Infineon Technologies AG 2014. All rights reserved.
Page 13
Next Level of Zero Defect: A Continuous and Sustainable Approach of Quality Improvement
PLAN
DO
CHECK
ACT
Pareto analysis of systemic root causes based on FARs, audit findings, severe incidents and internal spills
Basis: Leadership and Motivated People
The IFX houses of quality match the systemic root causes
KPI FE BE ATV PMM IPC CCS
# 1
Par
tner Customer
Satisfaction
Number of returns (FAR)
No
spils
Spills
100%
st
abili
ty
Internal Stability Indicators
The Quality KPI system controlsthe progress of the program
Corrective actions are systematically rolled out and rollout is verified
FE Villach Regens-burg
Dresden Kulim
Measure 1
Measure 2
BE PowerMAL
Power Batam
DS SENS Logic High Power
Measure 1
Measure 2
ATV ASIC BP SENS STD µC EDT
Measure 1
Measure 2
Lifecycle Stability
Quality Leadership
Deviation Culture
Maintenance
Equipment Stability
Unit Process Stability
Supplier Stability
Deviation management
Firewall
Deviation Handling
Detectability
Risk management
Pipeline management
Zero Defect CultureGaps in:
Wire Problem (Team 1)
Package Crack/Chipped
Die Crack
Top Defect Modes Common BE SRC Projects
OJTI with TWI Cu@BE
Robust Pre-assembly
Equipment Excellence
Quality Firewall
NLoZD @ BE
Methodology and Tools, Organization
Zero Defect Culture and Leadership
Design for Green Line
Supplier Excellence (L/F)
Design for Manufacturability
Wire Problem (Team 2)
Manufacturing in a Green Line
Incomplete Mould
Mixed Device
ATV Division FE Operations BE Operations
Page 132015-Q1 Copyright © Infineon Technologies AG 2014. All rights reserved.
We focus on three major areas relevant to today’s societal needs
Energy EfficiencyEnergy Efficiency MobilityMobility SecuritySecurity
Industrial Power Control
Automotive
Power Management & Multimarket
Chip Card & SecurityPage 141/20/2015 Copyright © Infineon Technologies AG 2015. All rights reserved
Automotive Overview
Product Range
n Sensors: pressure, magnetic, radarn Microcontrollers: 32-bit for Powertrain, Safety and
ADASn Power: MOSFETs, IGBTs, smart power ICs: voltage
regulators, bridges, driver ICs, CAN / LIN / FlexRay™ transceiver**, DC-DC converters, power system ICs, system-on chip, embedded power ICs
n Hybrid & Electric Vehicle: IGBT HybridPACK™, HybridPACK™ Double Sided Cooling (DSC) modules, gate driver ICs
Core Competencies/Value Proposition
n Automotive commitment: More than 40 years of automotive system and application expertise
n Complete automotive system providern Hybrid and Electro mobility: industry leading
expertise and product portfolion Functional Safety (ISO26262) and Security
enabling car solutionsn Worldwide development, production and support
sites for automotive semiconductorsn Next Level of Zero Defect: most comprehensive
quality program of the industry
Market Positions*
n No. 2 in Automotive semiconductors worldwiden No. 1 Europen No. 3 North America n No. 1 APAC & RoW
n No. 1 Korean No. 3 China
n No. 4 Japan
n No. 1 in automotive power semiconductors (24.8%) Source: Strategy Analytics (April 2015)
**FlexRay is a trademark licensed by FlexRay Consortium GbR*incl. International Rectifier
Page 15May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
n Clean Combustion Engines
n Efficient Energy Management
n Electrified Drivetrain
n Occupant and Pedestrian Protection
n Collision Avoidancen Advanced driver
assistance
n Individual Conveniencen Secure Connectivity,
Data Integrity and Privacy
n Autonomous Driving
Smart
Infineon Automotive Makes Cars: Clean, Safe and Smart
With innovative products for the highest growth applications in:
Clean Safe
Powertrain
Safety
BodyPage 162015-Q1 Copyright © Infineon Technologies AG 2014. All rights reserved.
High Power
Infineon Automotive Division Broad and Competitive Product Portfolio
Total Revenue: € 1’’965 for FY1314
TransceiversDC&DC ConvertersIndustrial productsVoltage Regulators
Airbag ICsEPS - ICsLi/Ion BMS ICsAlternator ICsMultichannel SwitchesEngine Management ICsTransmission ICs
SPOCTM - SPI Power ControllerPROFETTM – Smart High Side SwitchHITFET™ – Smart Low Side SwitchPower PROFETTM/Connect FET –Smart High Side Power Switch SPI Driver for Relay ControlInfineon® Auto LED DriverMotor Control - BridgesSystem Basis ChipsEmbedded Power IC
HybridPACK™- Inverter ModulesEiceDRIVER™ - IGBT Driver ICEasyPackBare Die IGBT, DiodesAutomotive MOSFETs
Magnetics SensorsPressure/TPMS SensorsRadar
High-End (32-bit)Mid-Range (16-bit)Low-End (8-bit)AutoSAR Software
Microcontroller
Sense & Control
Body Power
PowertrainSafety & ASICs
StandardPower
Page 172015-Q1 Copyright © Infineon Technologies AG 2014. All rights reserved.
ATV focuses on powertrain, safety and body applications
I
Powertrain
Safety
Body
Revenue split FY2014 by application
Page 182015-Q1 Copyright © Infineon Technologies AG 2014. All rights reserved.
Infineon is global #2, #1 in Europe & Korea, #5 in China with strongest regional growth
Korea($2.0bn)
Japan($4.9bn)
Europe($8.7bn)
APAC & others($6.7bn)
World($25.1bn)
North America($4.8bn)
China($3.5bn)
1. Renesas 13.3%2. Infineon 9.6%3. STMicro 7.9%4. Freescale 7.4%5. NXP 6.5%
1.2. Infineon 9.7%3.4.5.
Source: Strategy Analytics, April 2014.The main vehicle production markets driving "others"/ROW for 2013 are Brazil, India, Taiwan, and Indonesia.
1. Infineon 13.1%2.3.4.5.
1.2.Infineon 8.6%3.4.5.
1.Infineon 13.3%2.3.4.5.
1.2.3.4.5.Infineon 8.2%
1.2.3.Infineon 4.3%4.5.
(+0.3%)
(+0.1%)
(+0.2%)
(+0.6%)
(+1.2%)
(-0.4%)
(+0.5%)
1
Page 192015-Q1 Copyright © Infineon Technologies AG 2014. All rights reserved.
I
Europe accounts for half of Infineon Automotive Revenue. Importance of APAC is Growing
Germany
Europe, Middle East and
Africa(w/o Germany)
APAC
Americas
Japan
Revenue Split FY2014 by Region
Page 202015-Q1 Copyright © Infineon Technologies AG 2014. All rights reserved.
Xi’anXi’an
1/20/2015 Copyright © Infineon Technologies AG 2015. All rights reserved
Infineon’s Footprints in China
ShanghaiHeadquarter of Infineon
China
ShanghaiHeadquarter of Infineon
ChinaChengduChengdu
WuxiWuxi
HongkongHongkong ShenzhenShenzhen
ChangchunChangchun
BeijingBeijing
ChongqingChongqing
WuhuWuhu
XiamenXiamen
Page 21
*w/o International Rectifier
WuhanWuhan
1/20/2015 Copyright © Infineon Technologies AG 2015. All rights reserved
Infineon China at a Glance
LOCATIONS12
LOGISTIC HUB
1
IP/PATENTSFilings
>2000PEOPLE
>1700
JOINT LABS>10APPLICATION
& SYSTEM ENG
~100
TECHNICAL CENTER
2
REVENUE mio €868
MANUFACTURING
2
Page 22*w/o International Rectifier
1/20/2015 Copyright © Infineon Technologies AG 2015. All rights reserved
Key accountsApplication
Key Customers in China (by Segment)
Chip Card & Security
Automotive
Industrial Power Control
Power Management & Multimarket
Page 23*w/o International Rectifier
AURIX™Introduction and MultiCoreAugust 2015
AUtomotive Realtime Integrated neXt Generation
Safety& advanced connectivity MCU Roadmapfuture proof roadmap guarantees joint success story
(X)C164/740MHz,0.2M
Typ. Applications
› 4-6 cyl. GDI/DDI/MPI› Full feature ESC› Hybrid Ctrl. / E-Drive› Chassis Domain Ctrl.› Sensor Fusion Box› RADAR› Camera (front)
› 4 cyl. GDI/DDI› Transmission
(DCT/ECAT)› E-Drive› Integrated Airbag› Vehicle Stability Ctr.› Connected Gateway› Truck BCM › 4 cyl. MPI› Battery Management› Airbag with Sensor
Clusters› Active Power Steering› ESC premium› Suspension Systems› BCM premium› 1-2 cyl. MPI› Starter-Generator› DC/DC Converter› Airbag› ESC basic› ABS› Power Steering (EPS)› 24GHz RADAR› BCM/Gateway› Airbag basic› Steering lock› Park brake& Companion ICs
Production 2014 2015
Production Development Concept IdeaxxTechnology
Pre
miu
mFu
ll fe
atu
re
Bas
icEn
try
XC20x0 U/L40/66MHz, 0.1/0.3M
90
TC1762/3666/80MHz, 1M
65AURIX™
XC20x0 M/N66/80MHz, 0.5/0.8M
TC1387/67/37150/180MHz, 1-3M
TC1796/97180MHz, 2-4M
XC20x0 H/I100/120MHz, 1.6/1M
CIC61508Safety IC
XC8xx HOT8-32k
TC270T200MHz, 4MBare DieTC1766/67
80/133MHz, 1.5-2M
TC1746180MHz, 2.5MTransmission
130
XC2000
40TC1793/98300MHz, 4M
TC1782/84180MHz, 2.5M
TC1724/28133MHz, 1.5M
TC260D200MHz, 2.5MBare Die
TC1791240MHz, 4M
AURIX™ PLUS
CIC310FlexRay IC
2016 2017 2018 2019
TC27xT200MHz, 4M
TC24xS180MHz, 2M
AUDOMAX
TC22xL133MHz, 1M
TC23xL200MHz, 2M
TC290T300MHz, 8MBare Die
TC29xT300MHz, 8M
TC26xD200MHz, 2.5M
TC21xL133MHz, 0.5M
AURIX™ TC3x
252014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
Infineon Microcontroller focus areasLeading in key automotive innovation areas
› Power Steering› Vehicle Stability Control, Braking› Chassis/Safety Domain Control› Airbag› Suspension› Sensor Fusion Box› RADAR› Vision
› Engine Management (GDI/DDI/MPI)› Transmission (DCT/ECAT/AMT)› Hybrid & Electric Vehicle Inverter › DC/DC Converter› Battery Management› Starter-Generator› 48V
POWERTRAINPOWERTRAIN
CHASSIS, SAFETY, ADASCHASSIS, SAFETY, ADAS
SA
FETY
:Com
plet
e Sol
utio
n fo
r Saf
ety
up t
o ASIL
-D
SEC
UR
ITY
:In
tegr
ated
har
dwar
e su
ppor
t fo
r Sec
urity
› Connected Gateway › Full Feature BCM› V2V / V2X
ADVANCED CONNECTIVITYADVANCED CONNECTIVITY
262014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
One Family - scalable across applicationMost scalable 32-bit MCU portfolio on the market
SA
FETY
:Com
plet
e Sol
utio
n fo
r Saf
ety
up t
o ASIL
-D
SEC
UR
ITY
:In
tegr
ated
har
dwar
e su
ppor
t fo
r Sec
urity
272014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
One Family - scalable across applicationMost scalable 32-bit MCU portfolio on the market
SA
FETY
:Com
plet
e Sol
utio
n fo
r Saf
ety
up t
o ASIL
-D
SEC
UR
ITY
:In
tegr
ated
har
dwar
e su
ppor
t fo
r Sec
urity
282014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
AURIXTM scalable family - next generation µCOne family supporting multiple applications
9x Seriesup to 8 MB
7x Seriesup to 4 MB
6x Seriesup to 2.5 MB
4x Seriesup to 2 MB
3x Seriesup to 2 MB
2x Seriesup to 1 MB
1x Seriesup to 512 KB
TQFP-80 TQFP-100 LQFP-144TQFP-144 LQFP-176 LFBGA-292 BGA-416 LFBGA-516
TC212L/S133 MHz
TC223L/S133 MHz
TC233S/L200 MHz
TC234S/L200 MHz
TC224L/S133 MHz
TC213L/S133 MHz
TC244S180 MHz
TC277T200 MHz
TC275T200 MHz
TC265D200 MHz
TC264D200 MHz
TC299T300 MHz
TC298T300 MHz
TC297T300 MHz
TC267D200 MHz
TC237S/L200 MHz
TC222L/S133 MHz
MCU Scalablility§ # of TricoreTM 1.6 cores
§ Clock rate 133-300MHz
§ Up to 2.7MB SRAM
§ Package/Pin compatibility
Latest connectivity§ 6x CAN/CAN FD
§ Ethernet (AVB support)
§ FlexRay
Safety/Security Concept§ HW/SW safety features
§ ISO26262 compliance
§ Programmable 32bit hardware security module
Power Consumption§ On-chip DC/DC high-
efficiency power supply
§ Standby control unit
§ Pretended networking
TC214L/S133 MHz
Support of ISO26262 ASIL-D and related safety standards across the entire AURIXTM family
Hardware security enabled
Broad portfolio of fully compatible devices ranging from 512kB to 8MB flash and from TQFP80 to LFBGA516 packages
Broad portfolio of fully compatible devices ranging from 512kB to 8MB flash and from TQFP80 to LFBGA516 packages
With up to 1300DMips, 8MB flash and 640kB SRAM, AURIX™ matches the most performance hungry applications
With up to 1300DMips, 8MB flash and 640kB SRAM, AURIX™ matches the most performance hungry applications
Scalability
Performance
Rich set of peripherals to address the growing demands of in-vehicle networkingRich set of peripherals to address the growing demands of in-vehicle networkingNetworking
Innovative multicore safety concepts following ISO26262 standard, enabling ASIL-D levelInnovative multicore safety concepts following ISO26262 standard, enabling ASIL-D levelSafety
2nd generation Hardware supported security functions2nd generation Hardware supported security functionsSecurity
Best-in-class supply security concept, 2nd FabconceptBest-in-class supply security concept, 2nd Fabconcept
SupplySecurity
AURIX™ ™The Automotive Microcontroller for Tomorrow
302014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
AURIX™ Core Architecturesfrom single core to triple core lockstep w/ clock delay
Core
Triple Core Lockstep -„T“ Marking
Checker Core
Core
Main bus
Core
Peripheral bus
Flash
Main bus
Flash
Main bus
Core
Peripheral bus
Flash
Lockstep -„L“ Marking
Single Core -„S“ Marking
Dual Core Lockstep-„D“ Marking
Main bus
Core
Peripheral bus
Flash
Checker Core
Checker Core
Core Core
Peripheral bus
Checker Core *
* 2nd checker core only in TC27x
312014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
7x Series – Umbrella DeviceSAK-TC27xTP-64F200
Feature Set 7x Series
TriCore1.6P
# Cores / Checker 2 / 1
Frequency 200 MHz
TriCore1.6E
# Cores / Checker 1 / 1 2)
Frequency 200 MHz
Flash Program Flash 4 MB
EEProm @ w/e cycles
64 KB @ 500k
SRAM Total (DMI , PMI) 472 KB
DMA Channels 64
ADC Modules 12bit / DS 8 / 6
Channels 12bit / DS 60 / 6 diff
Timer GTM Input / Output 32 / 88 channels
CCU / GPT modules 2 / 1
Interfaces FlexRay (#/ch.) 1 / 2
CAN-FD3)
(nodes/obj)4 / 256
QSPI / ASCLIN / I2C 4 / 4 / 1
SENT / PSI5 / PSI5S 10 / 3 / 1
HSCT / MSC / EBU 1 / 2 diff LVDS / -
Other Ethernet MAC
Safety SIL Level ASIL-D
Security HSM Optional
Power EVR Yes
Standby Control Unit
Support
FCE
HSCT
SCU
DS-ADCx
ADCx
PLL
&PL
L ER
AY
Flex
Ray
Mul
tiCAN
+FD
QSPI
x
ASCLI
Nx
SEN
T
MSCx
STM
Ethe
rnet
I²C
TriCore™1.6P
PMI DMIOverlay
FPU
SRI Cross Bar
PSI5
(S)
HSM
GTM
CCU
6x
TriCore™1.6P
PMI DMIOverlay
FPU
Checker Core
TriCore™1.6E
PMIDMI
Standby Overlay
FPU
Checker Core 2)
BCU
Package Variants
Ports
OCDS
GPT
12x
IOM
System Peripheral Bus
PMU
Data FlashBROM
HSM DFlash
Progr.Flash
Progr.Flash
LFBGA-2920.8mm
-40°C to +125°C 1)
60 ADC inputs
LQFP-1760.5mm
-40°C to +125°C 1)
48 ADC inputs
Bare Die
Tjmax 170°C60 ADC inputs
RAM
LMU
EVR
5V or 3.3Vsingle supply
SDMA
1) HOT option available with limited functionality >Ta=125°C 2) not available on TC29x/TC26x – to be considered in SW family concept3) Option: CAN-FD
Sys
tem
Per
iphe
ral B
us
Bridge
322014-12-03 Copyright © Infineon Technologies AG 2015. All rights reserved.
7x Series – Umbrella DeviceSAK-TC27xTP-64F200
FCE
HSC
T
SC
U
DS-ADCx
ADCx
PLL
&PL
L ER
AY
Flex
Ray
Mul
tiCAN
+FD
QSPI
x
ASCLI
Nx
SEN
T
MSCx
STM
Ethe
rnet
I²C
TriCore™1.6P
PMI DMIOverlay
FPU
SRI Cross Bar
PSI5
(S)
HSM
GTM
CCU
6x
TriCore™1.6P
PMI DMIOverlay
FPU
Checker Core
TriCore™1.6E
PMIDMI
Standby Overlay
FPU
Checker Core 2)
BCU
Package Variants
Ports
OCDS
GPT
12x
IOM
System Peripheral Bus
PMU
Data FlashBROM
HSM DFlash
Progr.Flash
Progr.Flash
LFBGA-2920.8mm
-40°C to +125°C 1)
60 ADC inputs
LQFP-1760.5mm
-40°C to +125°C 1)
48 ADC inputs
Bare Die
Tjmax 170°C60 ADC inputs
RAM
LMU
EVR
5V or 3.3Vsingle supply
SDMA
Sys
tem
Per
iphe
ral B
us
Bridge
332014-12-03 Copyright © Infineon Technologies AG 2015. All rights reserved.
3x TriCore™ 1.6
› Application and I/O processing
Up to 2x Lockstep cores
› ISO26262 ASIL D support
4x programmable GTM sequencer
› Realtime timed I/O processing
1x 32bit security processor
› Programmable security functions
› Hardware acclerators
1x 32bit FFT Engine
› FFT and windowing hardware support
1x 8bit Standby controller
› Low power standby functions
9 user-programmble Cores
RAMM-JPEG/CIFFFT engine
Why Multi-Core?Address the challenges of tomorrow
› Total power limit - Flash single-core processors have peaked at appr. 300MHz@90nm - more power would add system cost (e.g. cooling)
› Further performance enhancements mainly enabled by additional cores – with less power and more flexibility, enabling advanced applications (e.g. safety dedicated tasks)
› Functional standardization allows introduction of highly efficient dedicated accelerator blocks – enabling more optimized devices to save on BOM.
› Microcontroller power modes and power management become more important - only use the performance that is required to enable energy efficient automotive systems.
Set date Page 3410/04/2013 Copyright © Infineon Technologies 2013. All rights reserved.
AURIX™ TriCoreTM based Multi-Core architecturefor Efficient Performance
The Task
› Provide 1.5 times the application perfor-mance compared to previous generation
› Increase performance-power ratio by more than 30%
› Provide means for stronger software encapsulation
Solution
› Introduction of TriCore™ 1.6 multicore architecture
› Efficiency and performance CPU variant› 1000 DMIPS and more application
performance› Advanced power management
technologies, e.g. integrated DC/DC converter, clock gating, low power modes, standby controller
Performance
Po
wer
Dis
sip
atio
n P
d
Single CoreController
Single CoreController
Dual/Multi CoreController
Dual/Multi CoreController
Pd~C∙U2∙f
TC16P
RAM
TC16P
RAM
300MHz 300MHz 200MHz
TC16P
RAM
TC16P
RAM
TC16E
RAM
TC16E
RAM
Crossbar
300MHz
TC16P
RAM
TC16P
RAM
Crossbar
TC1798 AURIX™ High End
PD trend: flat
352014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
TriCore™ OverviewTC 1.3 TC 1.3.1 TC 1.6 TC 1.6Performance
(version TC 1.6.1)TC 1.6Efficiency(version TC 1.6 Scalar)
Architecture 32-bit superscalar Harvard
32-bit superscalar Harvard
32-bit superscalar Harvard
32-bit superscalar Harvard
32-bit scalar Harvard
Max. Frequency 150 MHz 180 MHz 300 MHz 300 MHz 200 MHz
Pipeline stages 4 4 6 6 4
DMIPS / MHz 1,55 1,68 1,7 1,7 – 2,3 1.4 – 1,7
Instruction cache Two way set associative,256-bit cache line length
Two way set associative,256-bit cache line length
Four way set associative, 256-bit cache line length
Two way set associative, 256-bit cache line length
Two way set associative, 256-bit cache line length
Data cache Not in Automotive Products
Two way set associative128-bit cache line length
Two way set associative128-bit cache line length
Two way set associative128-bit cache line length
4 line read buffer or Two way set associative128-bit cache line length
HW int. division unit
No No Yes Yes Yes
MAC units dual 16x16 multipliers dual 16x32 multipliers dual 16x32 multipliers dual 16x32 multipliers dual 16x32 multipliers
FPU Single precision (32-bit) Single precision (32-bit) Single precision (32-bit) Single precision (32-bit) Single precision (32-bit)
FPU performance 0,66 FLOPs/cycle 0,66 FLOPs/cycle 2 FLOPs/cycle (pipelined)
2 FLOPs/cycle (pipelined)
2 FLOPs/cycle (pipelined)
User modes Supervisor, user 1, user 0
Supervisor, user 1, user 0
Supervisor, user 1, user 0
Supervisor, user 1, user 0
Supervisor, user 1, user 0
Memory protection
2 protection sets (overlaid HW breakpoints)
4 protection sets (overlaid HW breakpoints)
4 protection sets (separate HW breakpoints)
4 protection sets (separate HW breakpoints)
4 protection sets (separate HW breakpoints)
Instruction set 16/32 bit instructions 16/32 bit instructions 16/32 bit instructions 16/32 bit instructions 16/32 bit instructions
Compatibility TC1.2 compatible TC1.3 compatible TC1.3.1 compatible TC1.6 compatible TC1.6 compatible
Other features n static branch predictor n dynamic branch predictor
n Enhanced branch pre-diction (branch history and target buffers)
n Dual core support
n Safety support
n Dual core capable
n Power consumption optimized
n Safety support
Status Production (Audo-NG) Production (AudoFuture) Production (AUDO MAX) Production (AURIX) Production (AURIX)
Page 362014-12-15 Copyright © Infineon Technologies AG 2014. All rights reserved.
Monaco
e200z335@80Mhz
Andorra
e200z4@150MHz
Mamba
e200z7@266Mhz
SH7286
SH2A@100Mhz
Estimation
SH2A@200Mhz
TC1767/24
TC1.3.1@80Mhz
TC1797/82
TC1.3.1@180Mhz
TC179x
TC1.6@300Mhz
152%
100%
46%
81%
45%
113%
80%
28%
Freescale Renesas Infineon
TC179x
TC1.6@200Mhz
113%
TC1767/28
TC1.3.1@133Mhz
74%
Performance benchmark based on the application code for a 4 cylinder direct injection engine management system
Estimation1.5x
TC1.6P@300Mhz
228%
TC29
xT
Estimation1.5x
TC1.6P@200Mhz
170%
TC27
xT
Exceptional Performance
372014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
AURIX™ safety system architecture exampleEPS (electric power steering)
Sense Compute Actuate
Supply
Communicate
Rotor PositioniGMR SensorTLE 5009/12
Torque SensorTLE 4998 32-bit
LockstepMCU
AURIX™
TC233L
CAN TransceiverTLE 6251D / TLE7250G
FlexRayTransceiver (opt.)
VMCU
VSens VLogicVTx
3-PhaseDriver
IC
TLE9180
MotorCurrent
М
OptiMOS™-T2 40V7x IPB180N04S4-01
VBAT VBAT
TLF35584Safety Power Supply
Failure Protection Failure Diagnosis Redundancy Diverse Implementation382014-12-03 Copyright © Infineon Technologies AG 2015. All rights reserved.
AURIX™ safety system architecture exampleEPS (electric power steering)
Sense Compute Actuate
Supply
Communicate
Rotor PositioniGMR SensorTLE 5009/12
Torque SensorTLE 4998 32-bit
LockstepMCU
AURIX™
TC233L
CAN TransceiverTLE 6251D / TLE7250G
FlexRayTransceiver (opt.)
VMCU
VSens VLogicVTx
3-PhaseDriver
IC
TLE9180
MotorCurrent
М
OptiMOS™-T2 40V7x IPB180N04S4-01
VBAT VBAT
TLF35584Safety Power Supply
Failure Protection Failure Diagnosis Redundancy Diverse Implementation392014-12-03 Copyright © Infineon Technologies AG 2015. All rights reserved.
AURIX™ –HW measures supporting safety
System
Micro-controller
B
A AA AA
Inte
rrup
t co
ntro
ller
Redundant, spatially separated peripherals
A
Bus Monitoring UnitB
Safe DMAC
C
Safe SRIDD
SRAM ECC (DECTED with enhancements to detect multi bit failures)
E
E E EE
Flash ECC (SECDED with enhancements to detect multi bit failures)
F
F
Lockstep coreG
G
Memory protection coreH
Memory protection peripheralsII I I I I I I I I I I I
I III
Safe Interrupt ProcessingJ
J
Flexible CRC Engine (FCE)K
K
IO MonitorL
L
Clock MonitoringM
M
CPU self tests (90% Latent Fault Metric)N
N N N
GTM
E
I
H H H
402014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
Exemplary processing of a safety critical task
SensorActuator
1
2
3
4
5
6
9
1 Analog to digital conversion
2 Sensor data pre-conditioning
3 Data transfer to SRAM
Fetching of data and/or code from flash
4
Data processing 5
6 Derived data transfer to timer
7 Timer data processing
8 Timer data transfer to communication interface
9 Communication to actuator
System
Micro-controller
Lockstep core domain
Lockstep cores support the safe processing of data, but many additional features are required to build a safe system!
GTM7
8
412014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
Hardware Security Module (HSM)
• A highly flexible and programmable solution
• AES128 HW accelerator matching performance for automotive protocols
• Crypto- and Algorithm Agility by Software
• AIS31 compliant True Random Number Generator (TRNG) with high Random Entropie over Lifetime
Secure Platform HSM: 32 bit CPUAES AcceleratorSecurity
CPU
SecAPP
SecAPPþ
SecAPP
AESRNG
ÏsecAPP HSM
ECCRSA
Embedded µC Security - AURIX™ Security Hardware
Page 422014-12-15 Copyright © Infineon Technologies AG 2014. All rights reserved.
AURIX™ kits and toolsavailable
http://free-entry-toolchain.hightec-rt.com
432014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
TLF35584QVVS1/VS2 plus AURIX™ TriBoardEvaluation Environment
TLF35584-Evaluation-Boards (Green)› TLF35584-Evaluation-Boards (Green)
– Equipped either with 3V3- or 5V-variant
– Can be adapted to high- and low-switching frequency
› AURIX™ TriBoard (Red)
– For TLF35584-configuration
– Stack-concept
– GUI – Parameter setting – Monitoring functions– SPI-communication logging – Register modification – Flag control
442014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
Infineon AUTOSAR offeringLow level driver (MCAL) ISO26262 compliant
452014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
Integrated CompilerEnvironments
Emulators/DebuggerDevelopment Systems
Simulation/Virtual Prototyping
Embedded Software SolutionsAUTOSAR suites
OperatingSystems
Auto CodeGeneration Tools
Data Measurement, Calibration& Rapid Prototyping
Timing/Scheduling Analysis
dSPACE Etas
Hitex iSYSTEM Lauterbach PLS
dSPACE Etas Vector
Synopsys
AbsInt GLIWA
TASKING GNU GCCDiab Compiler
Symtavision
Programmer /Flash Tools
Training /Services
VectorInformatic
elektrobit
elektrobit Etas VectorHightec
Software Verification
Data IO Hitex PLS Promik SMH
The MathworksBTC GAIOAbsInt
HTVGöpel Hitex MicroConsult
Timing Architects
KPIT
AccurateTechnologies
Etas
AURIX™ Tool Chain
462014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
3x TriCore™ 1.6Application and I/O processing
Floating Point Unit
Up to 3 instructions/cycle
Set datePage 47
FCE
HSS
L
SCU DS-ADC
ADC
SCR
Flex
Ray
Mul
tiCAN
+
QSP
I
ASC
LIN
SEN
T
MSC
STM
Ethe
rnet
I²C
TriCore™
1.6PPMI DMI
FPU
HSM
GTM
CC
U6x
TriCore™
1.6P
PMI
FPU
TriCore™
1.6P
PMI DMI
FPU
Checker Core
BC
U
GPT
12x
IOM
Program
Flash
Sys
RAM
DMI
EVR
5V or 3.3Vsingle supply
SDMAPS
I5(S
)Data
FlashFFT
Crossbar
Peripheral Bus
Bridge
1x 32bit 1x 32bit 1x 32bit
10/04/2013 Copyright © Infineon Technologies 2013. All rights reserved.
Per
form
ance
Saf
ety/
Sec
uri
ty
TriCore™ 1.6 LockstepSafety Management (SCU)Safe DMA (SDMA)I/O Monitor (IOM)CRC unit (FCE)Hardware Security Module (HSM)
1x 32bit
Con
nec
tivi
ty 1x Fast Ethernet (AVB supported)1x Flexray4x MultiCAN + FD1x HSSL
Pow
er 1x Single Supply EVR DC/DCSamples and kits available for the TC27x: June 2014
Early sampling already on request
AURIXTM Product Features - SummaryMultiCore - Making the difference
AURIXTM useful links
Product home page AURIXTM: www.infineon.com\AURIX
AURIXTM forum for technical information exchange: www.infineon.com\tricore-forum
AURIXTM Documentation access: www.myinfineon.com
Free tool chain AURIXTM: http://free-entry-toolchain.hightec-rt.com/
482014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.
Infineon in China
Infineon Official Website www.infineon.com/cn
Infineon Official Website www.infineon.com/cn
Infineon China
Official Wechat
Wechat Account:InfineonChina
Wechat QR Code:
Infineon Tech
Community (Chinese)
http://www.infineonic.org/
Infineon Automotive ecosystem
official website
http://www.infineon-
ecosystem.org/
Infineon power
management and RF tech community
http://www.infineon-power-rf.org
Infineon Automotive ecosystemWechat QR
Code
Weibohttp://weibo.com/inf
ineonecosystem
Page 492014年6月27日 © 英飞凌科技股份公司版权所有,2014年。保留所有权利。
Lauterbach Infineon
Support infineon targets
Debug Tools
51set date Copyright © Infineon Technologies AG 2015. All rights reserved.
OCDS-L1/DAP Interface
Onchip Trace for TriCore™ ED
Support forPXB4260, TC10GP, TC1100, TC1115,TC1124, TC1128, TC1130, TC1161, TC1162, TC1163, TC1164, TC1165, TC1166, TC1167, TC1182, TC1184, TC1191, TC1193, TC1197, TC1198, TC11IA, TC11IB, TC11IC, TC1337, TC1367, TC1387, TC1724, TC1728, TC1736, TC1746, TC1762, TC1764, TC1765, TC1766,TC1767, TC1768, TC1775, TC1782, TC1784, TC1791, TC1792, TC1793, TC1796, TC1796L, TC1797, TC1798, TC1910, TC1912, TC1920
Support forTC1287ED, TC1736ED, TC1724ED, TC1728ED, TC1766ED, TC1767ED, TC1782ED, TC1784ED, TC1791ED, TC1793ED, TC1796ED, TC1797ED, TC1798ED
Trace32 for TriCore™
52set date Copyright © Infineon Technologies AG 2015. All rights reserved.
Debug Tools
› AURIX™ Family
2014-02 All supported
2013-02
2012-02 First Aurix support
53set date Copyright © Infineon Technologies AG 2015. All rights reserved.
Multi-Core Debugging and Tracing
› Multicore debugging for up to three TriCore™ cores, HSM core and GTM
› Ready-to-use FLASH programming scripts
› On-chip trace as well as serial off-chip trace
› Start and stop synchronisation
54set date Copyright © Infineon Technologies AG 2015. All rights reserved.
AMP Multi-Core Debugging
55set date Copyright © Infineon Technologies AG 2015. All rights reserved.
Thank You!
56set date Copyright © Infineon Technologies AG 2015. All rights reserved.