automatic, non-contact die monitoring system
DESCRIPTION
MICRON. MICRON. Automatic, Non-Contact Die Monitoring System. The Low Cost Solution For:. Misfeeds Slug detection Material Changes Stroke Deviation Mis-alignment between punch and die Broken punch or die assemblies. Micron base unit with 2 additional channels. - PowerPoint PPT PresentationTRANSCRIPT
Helm Instrument Co., Inc
Automatic, Non-Contact Die Monitoring System
Micron base unit with 2 additional channels
MICRONMICRON
The Low Cost Solution For:
• Misfeeds• Slug detection• Material Changes• Stroke Deviation• Mis-alignment between punch and die• Broken punch or die assemblies
Helm Instrument Co., Inc
Micron is the most advanced monitoring system available
to the stamping industry
With precise accuracy to .00004 inches (1/1000 mm)
Helm Instrument Co., Inc
Micron Detects Separation Gap to Within .00004 Inches
L o w er D ie
A b n o rm alN o rm al
U p p er D ie
U p p er D ie S h o e
L o w er D ie S ho e
S en so rTarg et
S en so r S lu g
S trip p er
M ateria l
Helm Instrument Co., Inc
Easy to use, limits are set automatically
Helm Instrument Co., Inc
Each stack includes one channel of monitoring with high and low limits
Helm Instrument Co., Inc
HMIC-R Sensor and target
Helm Instrument Co., Inc
Power requirements:Power consumption:Output contacts:Response time:Operating speed:Repeatability:Operating temperature:Alarm adjustment:Sensor type:Maximum sensing distance:Enclosure size:
115VAC ±10%30 watts1 NO-NC, 250VAC 5A ratingLess than 10 MsecUp to 2500 SPMTo .00004 inches-10°C to 50°C± 99 MicronsProximity 500 KHZ.1 inch (2.5mm)Base 8.25”w x 9.50”d x 3.25”hStack 8.25”w x 9.50”d x 4.75”h
Specifications: