automotive business development product & technology roadmap 4 00h05mn growing momentum ecu...
TRANSCRIPT
Automotive Business Development
2018 Rev1.1 Prepared by Stanley Lin Associate Vice President, Automotive SBU
Content
Pages Duration
Company Update
Company overview
12 00h15mn
Global service
Footprints of Manufacturing Sites
Product portfolio
Business performance
Finance overview
Automotive Market Update Industry overview
8 00h10mn Development Trend
Roadmap Product & Technology Roadmap 4 00h05mn
Growing Momentum ECU (Electrical control unit)
25 00h20mn Electrical Vehicle Charging
Q & A Open discussion 1 00h05mn
Company Update
2018 Rev1.1 Prepared by Stanley Lin Associate Vice President, Automotive SBU
Company Overview
• Establishment • Jan-18-FY1979
• Business scale • FY2017 TSC Group (TSC+TSC Auto ID) $296M • FY2017 TSC $174M
• Headquarter • Xindian Dist., New Taipei City,
• Products • Rectifier, TVS, Small signal diodes, MOSFET, Analog ICs
• Manufacturing sites • Wafer : LiJe/TW; Tianjing/CHINA • Assembly & test : I Lan/TW; Sandong/CHINA
• Employees • 1,800+
• Group Structure
Corporate Milestones
TSCE Office Munich, Germany
1979
Foundation Taipei, Taiwan
1988
1st Production Facility Set-Up I-Lan, Taiwan
1995
TEW Production
Facility Set-Up Tianjing, China
TSCA Office Pomona, CA, USA
2000
Registered OTC Stock market Taiwan
TSCK Office Seoul, Korea
2002
TSC SH Office Shanghai, China
MOS/TR R&D HQ, Taiwan
TSC SZ Office Shenzhen, China
TSCJ Office Tokyo, Japan
2005
TSCH Logistic Office Hong Kong
2007 2012 2010
Diode Assembly
Facility Set-Up I-Lan, Taiwan
MOS Assembly Facility Set-Up I-Lan, Taiwan
2016
Automotive Grade MOS & Car Lighting IC Development HQ, Taiwan
2014
Power Mgmt. IC R&D Set-Up HQ, Taiwan
2017
Li-Je, YEW MES(Manufacturing
Execution System),
QMS(Quality
Management System)
Implementation
Automotive Grade Power Management IC Development HQ, Taiwan
1993
Li-Je Production Facility Set-Up I-Lan, Taiwan
YEW upgrade production Automation Shandong, China
YEW Production
Facility Set-Up Shandong, China
Global Service
Founded in Taiwan 12 Branch Offices Worldwide 4 Production Sites in Asia
TIANJIN
YANGXIN
SEOUL
TOKYO
SHANGHAI
SU ZHOU
SHENZHEN
HONG KONG
TAIPEI/HQ
I-LAN
LI-JE
MUNICH PARIS
MANCHESTER
BALTIMORE, MD
CARMEL, IN
BREA, CA
HEADQUARTERS BRANCH OFFICES PRODUCTION SITES
Footprint of Manufacturing Sites
YANGXIN, CHINA Backend (Assembly)
I-LAN, TAIWAN Backend (Assembly)
LI-JE, TAIWAN Frontend (Wafer)
Tianjin, China Frontend (Wafer)
Product Portfolio – Focus On Solutions
Overview about Avaliable Products
Power Management ICs
• Amplifier & Comparator
• Analog IC
• Reset IC
• Voltage and Current Controller
• Hall Effect Sensor
• Omni-Polar
• Unipolar
• Latch
• Linear
• Lighting IC
• AC-DC LED Lighting IC
• DC-DC LED Lighting IC
• Linear LED Driver
• Linear Voltage Regulator
• Standard Linear Voltage Regulator
• Low Dropout Voltage Regulator
• Ultra Low Dropout Voltage Regulator
Discrete Devices
• Bridge Rectifier
• Standard Bridge
• Fast Recovery Bridge
• High Efficiency Recovery Bridge
• Super Fast Recovery Bridge
• Schottky Bridge
• Diode
• Standard Rectifier
• Auto Rectifier
• Fast Recovery
• High Efficient Recovery
• Super Fast Rectifier
• Ultra Fast Rectifier
• Schottky
• ESD Capability Rectifier
• Switching Diode & Array
• TVS
• Zener Diode & Array
• ESD Protection Diode & Array
• MOSFET
• Super Junction
• N-Channel
• P-Channel
• P-Channel Integrated Schottky
• Complementary
• Transistor
• NPN Bipolar Transistor
• PNP Bipolar Transistor
• Complex Digital Transistor
• Switching Regulator
• DC/DC Converter (Integrated Switch)
• DC/DC Controller (External Switch)
• Voltage Reference
• 1.24V Reference Voltage
• 2.495V Reference Voltage
TSC Products Overview
Product Family Active PNs AECQ PNs AECQ/Active PNs
TVS 2145 2145 100%
Power Zener 339 339 100%
Schottky 975 656 67%
Bridge 418 220 53%
Standard 252 177 70%
ESD capability rectifier 4 4 100%
FRD 158 99 63%
HER 286 237 83%
Superfast 353 307 87%
Ultrafast 90 84 93%
Total 5020 4268 85%
Industrial Bosch
Danfoss
Grundfos
GE
Rockwell
Schneider
Siemens
Power Supply & Consumer Bosch Siemens
Braun
Delta Electronics
Dyson
Flex Power
LG
Miele
Panasonic
Sharp
Samsung
Sony
Whirlpool
Automotive (Behr-)Hella
Continental
Delphi
Kostal
Lear
Sumitomo
Wabco
Lighting BAG
Helvar
Osram
Panasonic Lighting
Philips Lighting
Sharp Lighting
Tridonic
Universal Lighting
Vossloh-Schwabe
Applications, Split & Reference Customers
PWR 33%
Lighting 16%
Auto. 20%
IND. 12%
CON. 10%
Others 9%
CN 41%
EU 21%
KO 16%
TW 8%
US 6%
JP 5%
R.O.W 3%
FY 17 Revenue $USD 174M
FY 17 Revenue $USD 174M
Shanghai Munich Electronica
FY18’ (Plan) Mar-14~16
Sales Trend & Profitability ($MNTD)
Revenue ($MNTD) Gross Profit & Margin ($MNTD)
Operation Profit & Margin ($MNTD) Net Profit & Margin ($MNTD)
7,640 7,745 8,702 8,994
0
2,000
4,000
6,000
8,000
10,000
FY2014 FY2015 FY2016 FY2017
2,453 2,679
3,157 3,310
32% 35%
36% 37%
20%
25%
30%
35%
40%
45%
50%
0
1,000
2,000
3,000
4,000
FY2014 FY2015 FY2016 FY2017
1,304 1,449 1,506
1,618
17% 19% 17% 18%
0%
10%
20%
30%
40%
0
1,000
2,000
FY2014 FY2015 FY2016 FY2017
916 1,131 1,119
1,261
12% 15% 13% 14%
0%
10%
20%
30%
40%
0
1,000
2,000
FY2014 FY2015 FY2016 FY2017
EPS ($NTD) & Dividend Payout
1.61
2.51
3.31 3.34
3.77
1.20
2.00
2.50 2.50
3.00
74.5%
79.7%
75.5% 74.9%
79.6%
71.0%
72.0%
73.0%
74.0%
75.0%
76.0%
77.0%
78.0%
79.0%
80.0%
81.0%
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
FY2013 FY2014 FY2015 FY2016 FY2017
EPS Dividend Dividend Payout Ratio
EBITDA ($MNTD)
1,346
1,710 1,855
1,933 2,060
0
500
1,000
1,500
2,000
2,500
FY2013 FY2014 FY2015 FY2016 FY2017
Automotive Market Update
2018 Rev1.1 Prepared by Stanley Lin Associate Vice President, Automotive SBU
Change Of Automotive Industry
Electric Vehicle Connected Car Autonomous drive
Expansion of EV market Cloud service with connected car Accelerate Level 4 self-driving
Regulation of Zero emission OTA for maintenance & upgrade Driver-less Taxi service
Booming EV manufacturing companies
Threat of cyber attacking Utilize AI computing
Global Green Car Growth Trend By Power Type
0
5
10
15
20
2015 2016 2017 2018 2019 2020
48V Mild hybrid FHEV PHEV EV
Unit : M units
100% EV HEV
Motor
Inverter
Battery
Motor
Inverter
Battery
Engine
Gener-ator
FHEV : 42.4% 48V : 34.4%
Global EV (Electrical Vehicle) Market
Unit : K sets FY17’ FY18’ FY19’ FY20’ FY25’ FY30’
BEV 700 1,400 1,750 2,400 5,800 8,500
PHEV 480 930 1,160 1,600 3,200 4,600
EV Total 1180 2,330 2,910 4,000 9,000 13,100
YoY 66.1% 95.8% 24.7% 38.4% 17.5% 7.7%
Remarks • Norway FY2025 Stop sell Fuel Car • Holland FY2025 Stop sell Fuel Car • US CA FY 2030 Stop sell Fuel Car • Germany FY2030 Stop sell Fuel Car • Toyota FY 2050 Stop sell Fuel Car
Automotive Electronics Cost Structure in a Car
AE Cost % in a Car By Time
AE Cost % in a Car By Car Type
Average Semi Cost in a Car
20%
30% 35%
50%
0%
20%
40%
60%
FY2000 FY2010 FY2020 FY2030
15%
28%
47%
65%
0%
20%
40%
60%
80%
Executive Luxury Hybrid EV
Power 42%
MCUs 23%
Others 22%
Sensors 13%
Power 76%
Others 16%
MCUs 4%
Sensors 4%
Power 55% Others
27%
MCUs 11%
Sensors 7%
Engine Car ~$USD 320
Hybrid Car ~$USD 690
E-Car ~$USD 700
Overview of 48V Powernet
Core team LV 148 Standard
48 architecture (12V architecture upgrade type)
Classic 12V Boardnet 48V Boardnet
48V high power Electronics
Core
BMW
VW Audi
Bosch Hella
Daimler Porsche
Continental
Ford
PSA
Renault
Below 60V, no need extra protection system In same power, working current of 48V is only ¼ of
12V, loss is only 1/16 With BSG/ISG, can reduce size of engine, noise and
vibration Alternator size is 5KW to 20KW Support bigger power automotive devices Bidirectional DC/DC converters48V Belt Starter
Generator (BSG) easily replace original 12V Belt Starter Generator
CO2 reduction for vehicles
12V Battery system
Audio Lamp
12V
48V Battery system
DC/DC (Bidirectional)
48V starter/generator
eBooster
EPS/EHPS
Roll stabilization
AC compressor
Air bag Seat control
Door lock
Infotainment
Safety system
Body control
Chassis system
Engine Transmission
Automotive Supply Chain
Navigation
Audio
Air Bag
TPMS
ADAS
Lighting
Air-CON
ABS
IVI Transmission
Window lift Body control
Mirror
Chassis control
EPAS
OBD
AEC
Fuel Injection
Ignition
ECU
Air supply
Automotive Electronics Development Trend
Sensing Technology implementation
ADAS development and phase in More ECUs usage
MCU upgrade
Powerful and more function integration Consolidation of ECUs to drive high performance computing platforms Telematics
Communication/Interface
Enhance reliability Maintenance Autonomous cars
Safety, Environment, Efficiency
Automotive Power types change Design topologies change Proliferation of sensors and ECUs for compliance (NCAPs, NHTSA,..)
Data Collection
Execution ECU
Roadmap (Product & Technology)
2018 Rev1.1 Prepared by Stanley Lin Associate Vice President, Automotive SBU
3 Years Package Technology Roadmap
Current Rating
100(A)
10(A)
1.0(A)
0.1(A)
Y2018 Y2019 Y2020
Thin SMA/SOD-128
DO-218AB
TO-252-2 Thin DPAK DO-247
GUFP 5-pins
Three phase Bridge
Load Dump TVS
Specific design for OBC
High current density design
Integrated Circuit Roadmap
Product 2017 2nd Half 2018 1st Half 2018 2nd Half 2019 1st Half 2019 2nd Half
LED Driver
Automotive LED Driver
High Performance Linear Voltage Regulators
TS19502 80V DC-DC Single & Dual Channel Buck/Boost/Buck-Boost/SPEIC LED Controller
with Analog and PWM Dimming / AEC-Q100
TS19605 3 Channel Linear LED Driver/Controller with Analog and PWM Dimming
AEC-Q100
TS19501CB10H (Q2B) 45V DC-DC Single-Channel LED Controller with Analog and
PWM Dimming MSOP-10EP / AEC-Q100
TS19503CB10H 60V DC-DC Single-Channel Buck LED Controller with Analog and PWM Dimming
AEC-Q100 / MSOP-10EP
TS19820CS (Q1M) Non-Iso PWM/Linear DIM LED Driver with 3.3V LDO
45V Ultra low quiescent current (<11uA) linear voltage regulator Iout 100mA/Enable/Reset delay timing/Reset output/AEC-Q100
45V Low quiescent current (<60uA) linear voltage regulator Iout 150mA/Enable/AEC-Q100
TSCR420/421/400/402H (Q2B) Linear Constant Current Regulated LED Driver /
SOT-26 / AEC-Q100
45V Multi-function Low quiescent current (<60uA) linear voltage regulator Iout 500mA/Enable/Reset threshold adjustment/Reset, Watchdog output/AEC-Q100
In Developing In Planning
Automotive LV/MV MOSFET Product Roadmap B
VD
SS
2H ‘16
1H ‘17
2H ‘17
Q1 ‘18
Q2 ‘18
Q1 ‘19
Q2 ‘19
100V N-Ch PDFN56/ Dual & PDFN33 Family
Standard Level
60V N-Ch PDFN56 Family
Logic & Standard Level
30V N-Ch PDFN56/ Dual & PDFN33 Family
80V N-Ch PDFN56/ Dual & PDFN33 Family
Standard Level
40V N-Ch PDFN56 Family
Logic & Standard Level
Q3 ‘18
Q4 ‘18
40V N-Ch PDFN56 Family
Logic Level & Standard
60V N-Ch PDFN56 Family
Logic & Standard Level
30V N-Ch PDFN56 Family
80V N-Ch PDFN56/ Dual & PDFN33 Family
Standard Level
100V N-Ch PDFN56/ Dual & PDFN33 Family
Standard Level
Growing Momentum (Automotive)
2018 Rev1.1 Prepared by Stanley Lin Associate Vice President, Automotive SBU
TSC Growing Momentum on Automotive Segment
ECU (Electronics Control Unit)
ADAS development and phase in, more ECUs usage Smart and Intelligent car, high performance computing platforms Safety concern, need stronger protection capability
EV (Electrical Vehicle) Charging
Car Power type change, New demand High efficiency and thermal requirement. High performance components
required
ECU, control a growing list of vehicle functions
ECU = Engine Control unit = Electronics Control Unit = Micro Computer = Brain of a Car !!
Safety System ($4.9B, 16.8%) Airbag ECU AFS ECU Parktronic ECU Radar ECU Camera ECU
Body Control System ($4.4B, 15.1%) Dashboard ECU Air CON ECU Window lift ECU Seat ECU HID ECU Smart key ECU
Infotainment System ($5.2B, 17.8%) Navigation ECU Multimedia system ECU ETC ECU
Powertrain System ($4.8B, 16.4%) Engine ECU Sensor ECU Transmission ECU
Chassis System ($4.5B, 15.4%) Braking ECU ABS ECU, ESC ECU Speed sensors Suspension ECU Power steering ECU
Average ECUs per Car
0
20
40
60
80
100
120
140
FY2015 FY2016 FY2017 FY2018
Small Medium Large Executive Luxury Special
Unit : pcs units/Car
ECU, Brain of a CAR !! How a SMART Car !!
ECU Block Diagram
Signal input ADC, Interface
DC-DC converter
Drive circuit Output, IGBT,
Bridge, Injector
Load Motor, LED, Solenoids,
Lamp
MPU
HI load
12V load
HV load
Signal line protection
Fre
ewh
eel
ing
Rectification
Polarity protection
Seco
nd
ary
pro
tect
ion
Load
Du
mp
Battery Alternator
Analog Signal ex.transducer
Digital Signal ex.Switch state
ECU, Brain of a CAR !! How a SMART Car !!
Polarity protection Load Dump protection Rectification
Definition • Protect from reverse polarity connection • reverse transient voltage penetration
• Clamping surge voltage to acceptable low voltage to protect electronic circuits.
• Load dump function is required for almost all automotive electronics
• boost or buck type DC/DC converter or inverters
• 12/24 V to 5 V voltage converting for MPU of most electronic units
• 12/24 V to HV converting for air-bag igniter, engine ignition, LED, HID Ballast
Test Standard
• ISO 7637-2 :2010 pulse 1 and pulse 3a • JASO D001 : 94
• ISO 7637 : 2004, ISO • 16750-2 : 2010, JASO, Toyota TSC7001.
N/A
Design Concern
• Peak reverse voltage • Continuous forward current • IFSM capability
• Clamping capability (min 10% margin) • Load dump test capability
• Peak reverse voltage • Continuous forward current • IFSM capability
Products • STD, ESD Rectifier, BYG series • Load Dump TVS, High Power TVS • Planar/Trench SKY, Utrafast 200-600V
Secondary protection Signal protection Freewheeling
Definition
• Clamping surge voltage to acceptable low voltage to protect electronic circuits.
• Load dump function is required for almost all automotive electronics
• Protect from reverse polarity connection • reverse transient voltage penetration
Protect circuits from induced high voltage by inductance load in operation mode
Test Standard
• ISO 7637-2 :2010 pulse 1 and pulse 3a • JASO D001 : 94
• ISO 7637-3 • IEC 61000-4-2
N/A
Design Concern
• Peak reverse voltage • Clamping capability (min 10% margin) • Load dump test capability
• Peak reverse voltage • IFSM capability • ESD capability
• Peak reverse voltage • IFSM capability at freewheeling operation • Avalanche capability
Products • STD, ESD Rectifier, BYG series • TVS (PG), ESD • Planar/Trench SKY, Utrafast 200-600V
Protection Solution For Automotive Application
MCU/MPU
CO
MM
CAN
LIN
I/O
Data Port
Lighting Body & Chassis Electronics
LCD LED
I/O Port
RF 3G Module Wifi/Bluetooth/GPS Audio
Power V Boost V Buck V Digital
Vbat
TVS Protection (ISO7637-2 / ISO16750-2)
ESD Protection (IEC61000-4-2/ ISO10605)
Display
TVS/ESD Protection (ISO7637-2 / ISO16750-2/ IEC61000-4-2/ ISO10605)
ESD Protection (IEC61000-4-2/ ISO10605)
ESD Protection (IEC61000-4-2 ISO10605) U
SB2
.0
HD
MI
SIM
SD
Dig
i I/O
O
N/O
FF
Ke
ypad
G
PIO
TVS/ESD Protection (ISO7637-2/ ISO16750-2) (IEC61000-4-2/ ISO10605)
Output Driver
Threats Of Automotive Electronics –ESD(Transient wave)
Vehicle test - Internal points
Vehicle test - external points
Electrostatic Discharge Path - Inside Electrostatic Discharge Path - Outside
Threats Of Automotive Electronics –ESD(Transient wave)
ESD Standard
Vehicle test ISO 10605 vs. IEC 61000-4-2
Object Standard Evaluation Cause Automotive Customer
Electronic equipment
IEC 61000-4-2 Malfunction Human body VW(TL82466)
Vehicle Components
ISO 10605 Malfunction
Break Human body
GM(GVM3097), VW(TL82466), Ford(ES-XW7T), Citoren(B21-7110), BMW(GS95002)
Vehicle Components
SAE J1113-13 Malfunction
Break Human body
Standard Module Test Sensitivity Level
Test
ISO 10605
• 150pF/330Ω • 330pF/330Ω • 150pF/2000Ω • 330pF/2000Ω
• 150pF/330Ω • 330pF/330Ω • 150pF/2000Ω • 330pF/2000
IEC 61000-4-2 • 150pF/330Ω • 150pF/330Ω
Threats Of Automotive Electronics – Transient pulse
Vehicle test - Electrical disturbance by conduction and coupling ( Standard ISO 7637/ISO 16750)
Pulse Description
1 Connected directly to an inductive load in parallel
2a
Transient interruption of a device connected in parallel, due to hardness inductance
2b Transients from DC motor acting as a generator when ignition is switched off
3a/3b Switching transients due to distributed inductance and capacitance of hardness
4 Voltage dip due to starter-Motor current during cranking (Excluding spikes)
5 Load Dump
Wiper
Airbag
ABS
EEC
Motor
ESP
Alternator
Conventional
Central Load Dump
ISG (BSG/IMG)
SMD Type TVS Product Portfolio
Above Load Dump
TVS 3.6KW 4.6KW 6.6KW (NEW)
5KW 5.0SMDJxx
(New)
3KW SMDJxx
1.5KW 1.5SMCxx
SMCJxx TVSPBRxx
(New)
1KW 1KSMBxx
600W SMA6Fxx
(New) SMA6Sxx
(New) SMA6Jxx
P6SMBJxx SMBJxx
TPSMBxx
400W S4Fxx (New)
SMA4Fxx (New)
SM4Sxx (New)
P4SMAxx SMAJxx
200W SMFxx
150W MSPxx (New)
PKG
MicroSMA SOD-123W ThinSMA SOD-128 SMA SMB SMC SMPC DO-218AB
Load Dump TVS Market Demand
Products Load Dump TVS Segment Automotive Category New tech
Wafer Process GPP+Si3N4 PV Package DO-218AB SOP Jun-FY’18
Description
• Package DO-218AB compatible Tin ball prevention
• Product plan 6.6KW : 20 PNs 4.6KW : 20 PNs 3.6KW : 20 PNs
• SOP Plan E-Jun-Y18
• Potential customer >15+ Auto OEM customers >3+ alpha customers
Application
• ISO 16750-2 5a/5b – Load Dump TVS protect the load dump
transient which discharged bat. being disconnected while alternator is generating charging current
FY’18 FY’19 FY’20 FY’21 FY’22
TAM (Ku) 105,000 117,000 125,000 140,000 150,000
EV (Electrical Vehicle) Charging
On Board Charger
AC Charging
DC(Fast) Charging
AC
DC
DC
AC Motor
HSG ISG
AC Charging • 7.2KW (32A, 1-phase) • 22KW (3-phases) • Charging time, 7.2KW, 3-4hrs DC Charging • >50KW @ >100A • 80%, 30-60mins
HV Battery Pack
Fast Charging Module
PCU
Inverter
Inverter (Motor)
Boost Converter
DC-DC Converter
Inverter (HSG)
EV (Electrical Vehicle) Charging Market Trend
• DC charging • Storage charging • Mobile Charging • Convenient Charging
EV (Electrical Vehicle) Charging Market Scale
EV Market Demand
China EV Charging Station Demand
0
100,000
200,000
300,000
400,000
500,000
600,000
700,000
800,000
FY'17 FY'18 FY'19 FY'20
Hybrid PHEV BEV
0
500,000
1,000,000
1,500,000
2,000,000
2,500,000
3,000,000
FY'17 FY'18 FY'19 FY'20
• Power Module 3.3KW-20KW • Key Module Maker: Infypower, Increase • Key component of EV Charging Module:
Low VF Bridge, SJMOS (For PFC, with FRD fro DC-DC), Ultrafast 30A/600V-1200V DO-247, SiC 10A/600V TO-220
OEM End Customer
Kostal VW, GM, BMW, BenZ, 長城, 吉利
UAES Audi, VW, 上汽, 北企, 東風
Emerson GM, Ford, 上汽, 一汽
Valeo VW, GM,上汽, 一汽, 東風, BYD, 長安
Delphi VW, GM,上汽, 一汽, 日產, 奇瑞
欣瑞 北汽, 江淮, 長安, 華泰, 宇通, 銀隆
BYD BYD
Topologies for EV (Electrical Vehicle) Charging
AC/DC+PFC DC-DC Auxiliary SMPS
Singe phase +
Full Bridge LLC
Vienna +
Full Bridge LLC
Put TSC into Design
• Single phase Bridge rectifier • Ultrafast rectifier • TVS • Super junction MOSFET • SiC SBD
• Ultrafast rectifier • TVS • Super junction MOSFET • SiC SBD
• Ultrafast rectifier • Schottky rectifier
SiC for xEV Applications
Market Trend Estimation
FY2016 FY2017 FY2018 FY2019 FY2020 FY2021 FY2022
On Board Charger
DC-DC Converter
Main Inverter
SiC SBD + SiC MOSFET SiC SBD + Si MOSFET
SiC MOSFET Si MOSFET
SiC MOSFET Si-IGBT + Si-FRD
Market Competition Status
600V JBS Jul-2009
1700V SBD Apr-2010
1700V/50A SBD
Mar-2014
SBD Gen 3 Feb-09
650V SBD Gen 5
Sep-2012
1200V SBD Gen 5
Jul-2014
SBD Gen 1 May-2010
SBD Gen 2 Jul-2012
600V SBD Feb-09
1200V SBD Sep-2012
Dual 600V SBD
Jan, 2014
1200V SBD Nov, 2012
600V SBD Jan-2012
650V SBD Apr-2013
1200V SBD 2400V SBD Dec-2010
600V/1200V SBD
Sep-2013
1200V SBD Gen 1
Dec-2012
Gen 1 Dec-2013
650V/1200V SBD Gen 2 Jan-2014
650V SBD Gen 3
Sep-2015
1200V SBD Gen 3
May-2016
2009 2010 2011 2012 2013 2014 2015 2016
Overview of SiC SBD Development
Key notes of Product Development
1. There is a trade-off between the forward voltage (VF) and reverse current (IR) of an SBD. TSC improved the VF-IR trade-off by optimizing the device structure.
2. TSC SiC SBDs exhibit low loss even in the high-temperature region and thus help reduce power loss. Suitable for high reliability and automotive requirement
3. TSC's SiC SBDs have low dependence on forward voltage, VF, making it possible to reduce conduction loss in the high-temperature region.
Wafer Construction
1. Majority carrier devices 2. TSC's SiC SBDs have a Junction
Barrier Schottky (JBS) structure to reduce leakage current (IR)
3. Stronger reverse surge cap.
Package Construction
1. Singe die in TO/ITO/D2PAK 2. Dual die in TO-247
Target Product PNs with Specification
Metal
N
P P P
Voltage
(V)
TO-220/ITO-220 TO-263 (D2PAK) TO-247
TSC INF Rohm TSC INF Rohm TSC INF Rohm
650 V V V V V V V V V
1200 V V V V V V V V V
Summary
Automotive Market Demand keep growing
New application / Function : ADAS, ACC, CMS, etc.. , brings more ECUs Power type change : For green, for environment, great opportunities for
on/off board charging, wide band gap technology Higher Automotive % in TSC revenue pie share contributes higher ASP &
Margin
TSC is READY for AUTOMOTIVE
Penetrating into Automotive since FY2002 85% rectifier products is Automotive grade, TVS (Protection) is 100% Engaged with 1st tier WW Automotive OEM manufacturing companies Complete product portfolio to fulfill Automotive application (ECU,
Powertrain, On/Off board charging, Protection solution) DO-218 Load Dump TVS is ready, and penetrate into EU/US/JPN/CN 1st tier
automotive ECU makers Technology migration – Wide band Gap device/SiC
THANK YOU
Taiwan Semiconductor Co., Ltd. Headquarters Address: 11F. No. 25 Sec. 3, Beishin Rd, Shindian District, New Taipei City, Taiwan R.O.C. Telephone: +886-2-8913-1588 E-mail: [email protected] Website: www.taiwansemi.com