av02-0813en_0

HSMP-389x Series, HSMP-489x Series Surface Mount RF PIN Switch Diodes

Data Sheet

Features• UniqueConfigurationsinSurfaceMountPackages

–AddFlexibility

–SaveBoardSpace

–ReduceCost

• Switching

–LowCapacitance

–LowResistanceatLowCurrent

• LowFailureinTime(FIT)Rate[1]

• MatchedDiodesforConsistentPerformance

• BetterThermalConductivityforHigherPowerDissipation

• Lead-freeNote:1. For more information see the Surface Mount PIN Reliability Data

Sheet.

Description/ApplicationsTheHSMP-389xseries isoptimizedforswitchingappli-cationswherelowresistanceatlowcurrentandlowca-pacitancearerequired.TheHSMP-489xseriesproductsfeature ultra low parasitic inductance. These productsare specifically designed for use at frequencies whicharemuchhigher than theupper limit forconventionalPINdiodes.

Pin Connections and Package Marking

Notes:1. Packagemarkingprovidesorientation,identification,anddate

code.2. See“ElectricalSpecifications”forappropriatepackagemarking.

GUx

1

2

3

6

5

4

2

Package Lead Code Identification, SOT-23/143 (Top View)

Package Lead Code Identification, SOT-323 (Top View)

Package Lead Code Identification, SOT-363 (Top View)

Absolute Maximum Ratings[1] TC = +25°C

Symbol Parameter Unit SOT-23/143 SOT-323/363

If ForwardCurrent(1µsPulse) Amp 1 1

PIV PeakInverseVoltage V 100 100

Tj JunctionTemperature °C 150 150

Tstg StorageTemperature °C -65to150 -65to150

θjc ThermalResistance[2] °C/W 500 150

ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.

Notes:1. Operationinexcessofanyoneoftheseconditionsmayresultinpermanentdamagetothedevice.2. TC=+25°C,whereTCisdefinedtobethetemperatureatthepackagepinswherecontactismadetothecircuitboard.

SERIES–SHUNT PAIR

LOWINDUCTANCE

SINGLE

T

UNCONNECTEDTRIO

L1 2 3

6 5 4

1 2 3

6 5 4

1 2 3

6 5 4

UHIGH

FREQUENCYSERIES

V1 2 3

6 5 4

DUAL SWITCHMODEL

R1 2 3

6 5 4

COMMONCATHODE

F

COMMONANODE

E

SERIES

C

SINGLE

B

DUAL ANODE

489B

COMMONCATHODE

#4

COMMONANODE

#3

SERIES

#2

SINGLE

#0

UNCONNECTEDPAIR

#5

DUAL ANODE

4890

RINGQUAD

#71

3

2

4

UNDER DEVELOPMENT

3

Electrical Specifications, TC = 25°C, each diode

Package Minimum Maximum Maximum Part Number Marking Lead Breakdown Series Resistance Total Capacitance HSMP- Code Code Configuration Voltage VBR (V) RS (ý) CT (pF) 3890 G0[1] 0 Single 100 2.5 0.30 3892 G2[1] 2 Series 3893 G3[1] 3 CommonAnode 3894 G4[1] 4 CommonCathode 3895 G5[1] 5 UnconnectedPair 389B G0[2] B Single 389C G2[2] C Series 389E G3[2] E CommonAnode 389F G4[2] F CommonCathode 389L GL[2] L UnconnectedTrio 389R S[2] R DualSwitchMode 389T Z[2] T LowInductanceSingle 389U GU[2] U Series-ShuntPair 389V GV[2] V HighFrequencySeriesPair

TestConditions VR=VBR IF=5mA VR=5V Measure f=100MHz f=1MHz IR10µA

Notes:1. Packagemarkingcodeiswhite.2. Packageislasermarked.

High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes

Minimum Maximum Typical Maximum Typical Part Package Breakdown Series Total Total Total Number Marking Voltage Resistance Capacitance Capacitance Inductance HSMP- Code[1] Configuration VBR (V) R S (ý) C T (pF) CT (pF) LT (nH)

489x GA DualAnode 100 2.5 0.33 0.375 1.0

TestConditions VR=VBR IF=5mA f=1MHz VR=5V f=500MHz– Measure VR=5 V f=1MHz 3GHz IR10µA

Note:1. SOT-23packagemarkingcodeiswhite;SOT-323islasermarked.

Typical Parameters at TC = 25°C

Part Number Series Resistance Carrier Lifetime Total Capacitance HSMP- R S (ý) τ (ns) C T (pF)

389x 3.8 200 0.20@5V

TestConditions IF=1mA IF=10mA f=100MHz IR=6mA

4

HSMP-389x Series Typical Performance, TC = 25°C, each diode

Typical Applications for Multiple Diode Products

Figure 6. HSMP-389L used in a SP3T Switch.

Figure 7. HSMP-389L Unconnected Trio used in a Dual Voltage, High Isolation Switch.

1

123

40

5 6

b1 b2 b3

23

11 1

RF in RF out

2

2

3

4 5 6

100

2+V–V

“ON”“OFF”

Figure 1. Total RF Resistance at 25 C vs. Forward Bias Current.

100

10

1

0.1

RF

RE

SIS

TA

NC

E (

OH

MS

)

IF – FORWARD BIAS CURRENT (mA)

0.01 0.1 1 10 100

120

115

110

105

100

95

90

851 10 30

IF – FORWARD BIAS CURRENT (mA)

Figure 3. 2nd Harmonic Input Intercept Point vs. Forward Bias Current.

INP

UT

INT

ER

CE

PT

PO

INT

(d

Bm

)

Diode Mounted as a Series Attenuator in a50 Ohm Microstrip and Tested at 123 MHz

0.55

0.50

0.45

0.40

0.35

0.30

0.25

0.200 4 8 12 16 20

VR – REVERSE VOLTAGE (V)

TO

TA

L C

AP

AC

ITA

NC

E (

pF

)

1 MHz

1 GHz

Figure 2. Capacitance vs. Reverse Voltage.

200

160

120

80

40

010 2015 25 30T

rr –

RE

VE

RS

E R

EC

OV

ER

Y T

IME

(n

S)

FORWARD CURRENT (mA)

Figure 4. Typical Reverse Recovery Time vs. Reverse Voltage.

VR = –2V

VR = –5V

VR = –10V

100

10

1

0.1

0.010 0.2 0.4 0.6 0.8 1.0 1.2

I F –

FO

RW

AR

D C

UR

RE

NT

(m

A)

VF – FORWARD VOLTAGE (V)

Figure 5. Forward Current vs. Forward Voltage.

125 C 25 C –50 C

5

Typical Applications for Multiple Diode Products(continued)

Figure 11. HSMP-389V Series/Shunt Pair used in a 1.8 GHz Transmit/Receive Switch.

Figure 10. HSMP-389U Series/Shunt Pair used in a 900 MHz Transmit/Receive Switch.

Figure 8. HSMP-389L Unconnected Trio used in a Positive Voltage, High Isolation Switch.

Figure 9. HSMP-389T used in a Low Inductance Shunt Mounted Switch.

RF in RF out

1+V

0

20

+V“ON”“OFF”

456

1

1 1

2

2

3

RF in

RF out

456

1 2 3

λ4

RcvrXmtr

Bias Ant

PA

bias

HSMP-389ULNA

λ4

Rcvr

Bias

Xmtr

HSMP-389V

Antenna

λ4

λ4

RcvrXmtr

Bias Ant

C C

6

Typical Applications for Multiple Diode Products(continued)

RF COMMON

RF COMMON

RF 1

BIAS 1 BIAS BIAS

RF 2

BIAS 2

Figure 12. Simple SPDT Switch, Using Only Positive Current.

RF COMMON

RF 1 RF 2

BIAS

Figure 14. Switch Using Both Positive and Negative Bias Current. Figure 15. Very High Isolation SPDT Switch, Dual Bias.

Figure 13. High Isolation SPDT Switch, Dual Bias.

RF 2RF 1

RF COMMON

RF 2RF 1

BIAS

7

Equivalent Circuit Model

HSMP-389x Chip*

Typical Applications for HSMP-489x Low Inductance Series

Microstrip Series Connection for HSMP-489x Series

In order to take full advantage of the low inductanceoftheHSMP-489xserieswhenusingtheminseriesap-plications,bothlead1andlead2shouldbeconnectedtogether,asshowninFigure17.

Co-Planar Waveguide Shunt Connection for HSMP-489x Series

Co-Planar waveguide, with ground on the top side ofthe printed circuit board, is shown in Figure 20. Sinceit eliminates the need for via holes to ground, it offerslowershuntparasitic inductanceandhighermaximumattenuationwhencomparedtoamicrostripcircuit.

A SPICE model is not available for PIN diodes as SPICEdoesnotprovideforakeyPINdiodecharacteristic,car-rierlifetime.

1 2

3

Figure 16. Internal Connections.

HSMP-489x

Figure 17. Circuit Layout.

50 OHM MICROSTRIP LINES

PAD CONNECTED TOGROUND BY TWO

VIA HOLES


0.3 nH

0.3 nH

0.3 pF

1.5 nH 1.5 nH

Figure 19. Equivalent Circuit.


Co-Planar Waveguide Groundplane

Center Conductor

Groundplane

0.12 pF** Measured at -20 V

0.5 Ω

RjRs

Cj

Rj = 20 Ω

I0.9

RT = 0.5 + Rj

CT = CP + Cj

I = Forward Bias Current in mA

* See AN1124 for package models


0.3 pF

0.75 nH

Figure 16. Internal Connections.


Microstrip Shunt Connections for HSMP-489x Series

InFigure18,thecenterconductorofthemicrostriplineisinterruptedandleads1and2oftheHSMP-489xdiodeare placed across the resulting gap.This forces the 1.5nHleadinductanceofleads1and2toappearaspartofalowpassfilter,reducingtheshuntparasiticinductanceandincreasingthemaximumavailableattenuation.The0.3nHofshuntinductanceexternaltothediodeiscre-atedbytheviaholes,andisagoodestimatefor0.032"thickmaterial.





8

Assembly Information0.026

0.075

0.016

0.035

Figure 22. PCB Pad Layout, SOT-363. (dimensions in inches).

0.026

0.035

0.07

0.016

Figure 23. PCB Pad Layout, SOT-323. (dimensions in inches).

0.0370.95

0.0370.95

0.0792.0

0.0310.8

DIMENSIONS IN inches

mm

0.0350.9

SOT-23 FootprintFigure 24. PCB Pad Layout, SOT-23.

DIMENSIONS IN inches

mm

0.0751.9 0.071

1.8

0.1122.85

0.0792

0.0330.85

0.0411.05

0.1082.75

0.0330.85

0.0471.2

0.0310.8

0.0330.85

Figure 25. PCB Pad Layout, SOT-143.

9

Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)

Reflow Parameter Lead-Free AssemblyAverageramp-uprate(LiquidusTemperature(TS(max)toPeak) 3°C/secondmax

Preheat TemperatureMin(TS(min)) 150°C

TemperatureMax(TS(max)) 200°C

Time(mintomax)(tS) 60-180seconds

Ts(max)toTLRamp-upRate 3°C/secondmax

Timemaintainedabove: Temperature(TL) 217°C

Time(tL) 60-150seconds

PeakTemperature(TP) 260+0/-5°C

Timewithin5°CofactualPeaktemperature(tP) 20-40seconds

Ramp-downRate 6°C/secondmax

Time25°CtoPeakTemperature 8minutesmax

Note1:Alltemperaturesrefertotopsideofthepackage,measuredonthepackagebodysurface

25

Time

Tem

pera

ture

Tp

T L

tp

tL

t 25° C to Peak

Ramp-up

ts

Ts min

Ramp-downPreheat

Critical ZoneT L to Tp

Ts max

Figure 26. Surface Mount Assembly Profile.

SMT Assembly

Reliable assembly of surface mount components is acomplex process that involves many material, process,and equipment factors, including: method of heating(e.g., IRorvaporphasereflow,wavesoldering,etc.)cir-cuit board material, conductor thickness and pattern,type of solder alloy, and the thermal conductivity andthermal mass of components. Components with a lowmass,suchastheSOTpackage,willreachsolderreflowtemperaturesfasterthanthosewithagreatermass.

AvagoTechnologies’diodeshavebeenqualifiedtothetime-temperatureprofileshowninFigure26.Thisprofileis representativeofan IR reflowtypeofsurfacemountassemblyprocess.

After ramping up from room temperature, the circuitboard with components attached to it (held in placewithsolderpaste)passesthroughoneormorepreheat

zones. The preheat zones increase the temperature ofthe board and components to prevent thermal shockand begin evaporating solvents from the solder paste.The reflow zone briefly elevates the temperature suffi-cientlytoproduceareflowofthesolder.

Theratesofchangeoftemperaturefortheramp-upandcool-down zones are chosen to be low enough to notcausedeformationof theboardordamagetocompo-nentsduetothermalshock.Themaximumtemperatureinthereflowzone(TMAX)shouldnotexceed260°C.

Theseparametersaretypicalforasurfacemountassem-blyprocessforAvagoTechnologiesdiodes.Asageneralguideline,thecircuitboardandcomponentsshouldbeexposedonlytotheminimumtemperaturesandtimesnecessarytoachieveauniformreflowofsolder.

10

e

B

e2

e1

E1

C

E XXX

L

D

A

A1

Notes:XXX-package markingDrawings are not to scale

DIMENSIONS (mm)

MIN.0.79

0.0000.300.082.731.150.891.780.452.100.45

MAX.1.20

0.1000.540.203.131.501.022.040.602.700.69

SYMBOLA

A1BCD

E1e

e1e2EL

e B

e2

B1

e1

E1

C

E XXX

L

D

A

A1


DIMENSIONS (mm)

MIN.0.79

0.0130.360.76

0.0862.801.200.891.780.452.100.45

MAX.1.0970.100.540.92

0.1523.061.401.022.040.602.650.69

SYMBOLA

A1B

B1CD

E1e

e1e2EL

e

B

e1

E1

C

E XXX

L

D

A

A1


DIMENSIONS (mm)

MIN.0.800.000.150.081.801.10

1.800.26

MAX.1.000.100.400.252.251.40

2.400.46

SYMBOLA

A1BCD

E1e

e1EL

1.30 typical0.65 typical

EHE

D

e

A1

b

AA2

DIMENSIONS (mm)

MIN.1.151.801.800.800.800.00

0.150.080.10

MAX.1.352.252.401.101.000.10

0.300.250.46

SYMBOLED

HEA

A2A1ebcL

0.650 BCS

L

c

Package Dimensions

Outline 23 (SOT-23)

Outline 143 (SOT-143) Outline SOT-363 (SC-70 6 Lead)

Outline SOT-323 (SC-70 3 Lead)

11

USERFEED DIRECTION

COVER TAPE

CARRIERTAPE

REEL

Note: "AB" represents package marking code. "C" represents date code.

END VIEW

8 mm

4 mm

TOP VIEW

ABC ABC ABC ABC


END VIEW

8 mm

4 mm

TOP VIEW

ABC ABC ABC ABC

END VIEW

8 mm

4 mm

TOP VIEW


ABC ABC ABC ABC

Option Descriptions-BLKG=Bulk,100pcs.perantistaticbag-TR1G=TapeandReel,3000devicesper7"reel-TR2G=TapeandReel,10,000devicesper13"reel

TapeandReelingconformstoElectronicIndustriesRS-481,“TapingofSurfaceMountedComponentsforAutomatedPlacement.”

Device Orientation

For Outline SOT-143

For Outlines SOT-23, -323

For Outline SOT-363

Ordering InformationSpecifypartnumberfollowedbyoption.Forexample: HSMP-389x-xxx

BulkorTapeandReelOption PartNumber;x=LeadCode SurfaceMountPIN

Package CharacteristicsLeadMaterial Copper(SOT-323/363);Alloy42(SOT-23/143)LeadFinish Tin100%MaximumSolderingTemperature 260°Cfor5secondsMinimumLeadStrength 2poundspullTypicalPackageInductance 2nHTypicalPackageCapacitance 0.08pF(oppositeleads)

12

Tape Dimensions and Product Orientation

For Outline SOT-143

For Outline SOT-23

9 MAX

A0

P

P0

D P2

E

F

W

D1

Ko 8 MAX

B0

13.5 MAX

t1

DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)

LENGTHWIDTHDEPTHPITCHBOTTOM HOLE DIAMETER

A0B0K0PD1

3.15 ± 0.102.77 ± 0.101.22 ± 0.104.00 ± 0.101.00 + 0.05

0.124 ± 0.0040.109 ± 0.0040.048 ± 0.0040.157 ± 0.0040.039 ± 0.002

CAVITY

DIAMETERPITCHPOSITION

DP0E

1.50 + 0.104.00 ± 0.101.75 ± 0.10

0.059 + 0.0040.157 ± 0.0040.069 ± 0.004

PERFORATION

WIDTHTHICKNESS

Wt1

8.00 + 0.30 – 0.100.229 ± 0.013

0.315 + 0.012 – 0.0040.009 0.0005

CARRIER TAPE

CAVITY TO PERFORATION(WIDTH DIRECTION)

CAVITY TO PERFORATION(LENGTH DIRECTION)

F

P2

3.50 ± 0.05

2.00 ± 0.05

0.138 ± 0.002

0.079 ± 0.002

DISTANCEBETWEENCENTERLINE

WF

E

P2P0

DP

D1



A0B0K0PD1

3.19 ± 0.102.80 ± 0.101.31 ± 0.104.00 ± 0.101.00 + 0.25

0.126 ± 0.0040.110 ± 0.0040.052 ± 0.0040.157 ± 0.0040.039 + 0.010

CAVITY


DP0E

1.50 + 0.104.00 ± 0.101.75 ± 0.10

0.059 + 0.0040.157 ± 0.0040.069 ± 0.004

PERFORATION

WIDTHTHICKNESS

Wt1

8.00 + 0.30 – 0.100.254 ± 0.013

0.315+ 0.012 – 0.0040.0100 0.0005

CARRIER TAPE



F

P2

3.50 ± 0.05

2.00 ± 0.05

0.138 ± 0.002

0.079 ± 0.002

DISTANCE

A0

9° MAX 9° MAX

t1

B0

K0

Tape Dimensions and Product Orientation

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-0486ENAV02-0813EN - June 2, 2009

For Outlines SOT-323, -363P

P0

P2

FW

C

D1

D

E

A0

An

t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS)

An

B0

K0



A0B0K0PD1

2.40 ± 0.102.40 ± 0.101.20 ± 0.104.00 ± 0.101.00 + 0.25

0.094 ± 0.0040.094 ± 0.0040.047 ± 0.0040.157 ± 0.0040.039 + 0.010

CAVITY


DP0E

1.55 ± 0.054.00 ± 0.101.75 ± 0.10

0.061 ± 0.0020.157 ± 0.0040.069 ± 0.004

PERFORATION

WIDTHTHICKNESS

Wt1

8.00 ± 0.300.254 ± 0.02

0.315 ± 0.0120.0100 ± 0.0008

CARRIER TAPE



F

P2

3.50 ± 0.05

2.00 ± 0.05

0.138 ± 0.002

0.079 ± 0.002

DISTANCE

FOR SOT-323 (SC70-3 LEAD) An 8°C MAX

FOR SOT-363 (SC70-6 LEAD) 10°C MAX

ANGLE

WIDTHTAPE THICKNESS

CTt

5.4 ± 0.100.062 ± 0.001

0.205 ± 0.0040.0025 ± 0.00004

COVER TAPE

av02-0813en_0

Documents