back-end bonding h&k 710 bonder glue pitch adaptors robot i&j2500 glue beetle chip to hybrid
TRANSCRIPT
![Page 1: Back-End Bonding H&K 710 bonder Glue Pitch Adaptors Robot I&J2500 Glue Beetle Chip to Hybrid](https://reader036.vdocuments.net/reader036/viewer/2022062417/55160216550346a2308b4c60/html5/thumbnails/1.jpg)
Back-End BondingH&K 710 bonder
Glue Pitch AdaptorsRobot
I&J2500Glue Beetle Chip to
Hybrid
![Page 2: Back-End Bonding H&K 710 bonder Glue Pitch Adaptors Robot I&J2500 Glue Beetle Chip to Hybrid](https://reader036.vdocuments.net/reader036/viewer/2022062417/55160216550346a2308b4c60/html5/thumbnails/2.jpg)
Mike Wormald [email protected]
2
Robot I&J2500
The I&J2500 has a work area of 510 x 510mm. We mount a turn plate to the work holder that allows us to hold the hybrid for accurate dispensing of the glue.
![Page 3: Back-End Bonding H&K 710 bonder Glue Pitch Adaptors Robot I&J2500 Glue Beetle Chip to Hybrid](https://reader036.vdocuments.net/reader036/viewer/2022062417/55160216550346a2308b4c60/html5/thumbnails/3.jpg)
Mike Wormald [email protected]
3
Requirements
Glue pitch adaptors to LHCB hybrids.
• Making sure all the bond pads are supported with glue, as bonding is impossible with bounce under the pads.
• Even spread of glue for planarity. (Bonding jigs vacuum this area down)
• Ensure no overspill of glue that would hinder the position of the sensors or cover bond pads for the chips
• Correct location of the pitch adaptors.
![Page 5: Back-End Bonding H&K 710 bonder Glue Pitch Adaptors Robot I&J2500 Glue Beetle Chip to Hybrid](https://reader036.vdocuments.net/reader036/viewer/2022062417/55160216550346a2308b4c60/html5/thumbnails/5.jpg)
Mike Wormald [email protected]
5
Process
•Apply Weights •Leave to cure•In oven at 40◦c for 1hour.•Visually inspect.•Remove any excess or fill unsupported areas.•Chips can be mounted at this stage•Place back in oven for further two hours
![Page 6: Back-End Bonding H&K 710 bonder Glue Pitch Adaptors Robot I&J2500 Glue Beetle Chip to Hybrid](https://reader036.vdocuments.net/reader036/viewer/2022062417/55160216550346a2308b4c60/html5/thumbnails/6.jpg)
Mike Wormald [email protected]
6
Glue chips to Hybrid
Requirements
• Planarity, 710 bonder only has one touchdown per reference system but chips are bonded on all three faces.
• No overspill of conductive glue that may cause shorts on the hybrid
• Accurate placement –ease of bonding front end-