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BC92 Hardware Design LPWA/GSM/GPRS Module Series Rev. BC92_Hardware_Design_V1.0 Date: 2019-06-24 Status: Preliminary www.quectel.com

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Page 1: BC92 Hardware Design

BC92 Hardware Design

LPWA/GSM/GPRS Module Series

Rev. BC92_Hardware_Design_V1.0

Date: 2019-06-24

Status: Preliminary

www.quectel.com

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Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: [email protected] Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm Or email to: [email protected] GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN.

Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.

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About the Document

History

Revision Date Author Description

1.0 2019-06-24 Glenn GE/ Miles LI

Initial

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Contents About the Document .................................................................................................................................... 2 Contents ........................................................................................................................................................ 3 Table Index .................................................................................................................................................... 5 Figure Index .................................................................................................................................................. 6

1 Introduction ........................................................................................................................................... 7 1.1. Safety Information .................................................................................................................... 7

2 Product Concept ................................................................................................................................... 9 2.1. General Description .................................................................................................................. 9 2.2. Key Features .......................................................................................................................... 10 2.3. Functional Diagram ................................................................................................................ 12 2.4. Development Board ................................................................................................................ 12

3 Application Interfaces ........................................................................................................................ 13 3.1. General Description ................................................................................................................ 13 3.2. Pin Assignment ....................................................................................................................... 14 3.3. Pin Description ....................................................................................................................... 15 3.4. Operating Modes .................................................................................................................... 19 3.5. Power Supply ......................................................................................................................... 20

3.5.1. Power Features of the Module ........................................................................................ 20 3.5.2. Decrease Supply Voltage Drop ....................................................................................... 20 3.5.3. Reference Design for Power Supply ............................................................................... 21 3.5.4. Monitor Power Supply ..................................................................................................... 22

3.6. Turn on and off Scenarios ...................................................................................................... 22 3.6.1. Turn on ............................................................................................................................ 22 3.6.2. Turn off ............................................................................................................................ 23

3.6.2.1. Turn off Module with AT Command ........................................................................ 24 3.6.2.2. Under-voltage Automatic Shutdown* ..................................................................... 24

3.6.3. Reset ............................................................................................................................... 24 3.7. Power Saving ......................................................................................................................... 26

3.7.1. Light Sleep Mode ............................................................................................................ 26 3.7.2. Deep Sleep Mode ........................................................................................................... 26

3.8. RTC ........................................................................................................................................ 27 3.9. UART Interfaces ..................................................................................................................... 29

3.9.1. Main Port ......................................................................................................................... 30 3.9.1.1. Features of Main Port ............................................................................................. 30 3.9.1.2. The Connection of UART ....................................................................................... 31

3.9.2. Debug Port ...................................................................................................................... 31 3.9.3. UART Application ............................................................................................................ 32

3.10. Audio Interfaces* .................................................................................................................... 33 3.11. (U)SIM Interfaces ................................................................................................................... 34 3.12. RI Behaviors* .......................................................................................................................... 36

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3.13. Network Status Indication* ..................................................................................................... 36 3.14. ADC* ....................................................................................................................................... 37

4 Antenna Interfaces .............................................................................................................................. 38 4.1. NB-IoT/GSM Antenna Interface ............................................................................................. 38

4.1.1. Reference Design ........................................................................................................... 38 4.1.2. RF Output Power ............................................................................................................ 40 4.1.3. RF Receiving Sensitivity ................................................................................................. 40 4.1.4. Operating Frequencies.................................................................................................... 41

4.2. Bluetooth Antenna Interface ................................................................................................... 42

5 Electrical, Reliability and Radio Characteristics ............................................................................. 43 5.1. Absolute Maximum Ratings.................................................................................................... 43 5.2. Operation and Storage Temperatures .................................................................................... 43 5.3. Current Consumption ............................................................................................................. 44 5.4. Electrostatic Discharge ........................................................................................................... 46

6 Mechanical Dimensions ..................................................................................................................... 47 6.1. Mechanical Dimensions of Module ........................................................................................ 47 6.2. Recommended Footprint ........................................................................................................ 49 6.3. Top and Bottom Views of the Module ..................................................................................... 50

7 Storage, Manufacturing and Packaging ........................................................................................... 51 7.1. Storage ................................................................................................................................... 51 7.2. Manufacturing and Soldering ................................................................................................. 51 7.3. Packaging ............................................................................................................................... 53

8 Appendix A References ...................................................................................................................... 55

9 Appendix B GPRS Coding Schemes ................................................................................................ 62

10 Appendix C GPRS Multi-slot Classes ............................................................................................... 64

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Table Index

TABLE 1: KEY FEATURES ............................................................................................................................... 10 TABLE 2: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE ......................... 11 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 15 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 15 TABLE 5: OPERATING MODES OVERVIEW ................................................................................................... 19 TABLE 6: LOGIC LEVELS OF UART INTERFACES ........................................................................................ 29 TABLE 7: PIN DEFINITION OF UART INTERFACES ....................................................................................... 30 TABLE 8: PIN DEFINITION OF (U)SIM INTERFACES ..................................................................................... 34 TABLE 9: PIN DEFINITION OF ADC* ............................................................................................................... 36 TABLE 10: PIN DEFINITION OF ADC* ............................................................................................................. 37 TABLE 11: PIN DEFINITION OF NB-IOT/GSM_ANT........................................................................................ 38 TABLE 12: GSM LOSS REQUIREMENTS ........................................................................................................ 39 TABLE 13: NB-IOT LOSS REQUIREMENTS .................................................................................................... 39 TABLE 14: ANTENNA REQUIREMENTS .......................................................................................................... 39 TABLE 15: RF OUTPUT POWER ..................................................................................................................... 40 TABLE 16: GSM RECEIVING SENSITIVITY .................................................................................................... 40 TABLE 17: NB-IOT RECEIVING SENSITIVITY WITHOUT RETRANSMISSION ............................................. 41 TABLE 18: NB-IOT RECEIVING SENSITIVITY IN 128 RETRANSMISSIONS ................................................. 41 TABLE 19: OPERATING FREQUENCIES ........................................................................................................ 41 TABLE 20: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 43 TABLE 21: OPERATION TEMPERATURE ........................................................................................................ 43 TABLE 22: CURRENT CONSUMPTION OF NB-IOT MODE ............................................................................ 44 TABLE 23: CURRENT CONSUMPTION OF GSM/GPRS MODE .................................................................... 44 TABLE 24: ELECTROSTATIC DISCHARGE CHARACTERISTICS (25ºC, 45% RELATIVE HUMIDITY) ........ 46 TABLE 25: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................... 52 TABLE 26: REEL PACKAGING ......................................................................................................................... 54 TABLE 27: RELATED DOCUMENTS ................................................................................................................ 55 TABLE 28: TERMS AND ABBREVIATIONS ...................................................................................................... 56 TABLE 29: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 62 TABLE 30: GPRS MULTI-SLOT CLASSES ...................................................................................................... 64

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 12 FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 14 FIGURE 3: VOLTAGE RIPPLE DURING GSM TRANSMITTING ..................................................................... 20 FIGURE 4: REFERENCE CIRCUIT FOR VBAT INPUT .................................................................................... 21 FIGURE 5: REFERENCE CIRCUIT FOR POWER SUPPLY ............................................................................ 21 FIGURE 6: TURN ON THE MODULE THROUGH AN OPEN-COLLECTOR DRIVER ..................................... 22 FIGURE 7: TURN ON THE MODULE THROUGH A BUTTON ......................................................................... 23 FIGURE 8: TURN-ON SCENARIO .................................................................................................................... 23 FIGURE 9: POWER DOWN TIMING (POWER OFF BY AT COMMAND) ........................................................ 24 FIGURE 10: REFERENCE CIRCUIT OF RESET WITH DRIVER CIRCUITS .................................................. 25 FIGURE 11: REFERENCE CIRCUIT OF RESET WITH BUTTONS ................................................................. 25 FIGURE 12: RESET TIMING ............................................................................................................................. 25 FIGURE 13: MODULE POWER CONSUMPTION IN DIFFERENT MODES .................................................... 26 FIGURE 14: TIMING OF WAKING UP MODULE FROM PSM ......................................................................... 27 FIGURE 15: RTC SUPPLY FROM NON-RECHARGEABLE BATTERY ........................................................... 28 FIGURE 16: RTC SUPPLY FROM RECHARGEABLE BATTERY .................................................................... 28 FIGURE 17: RTC SUPPLY FROM CAPACITOR .............................................................................................. 28 FIGURE 18: REFERENCE DESIGN FOR MAIN UART PORT (THREE-WIRE CONNECTION) ..................... 31 FIGURE 19: REFERENCE DESIGN FOR UART PORT WITH HARDWARE FLOW CONTROL .................... 31 FIGURE 20: REFERENCE DESIGN FOR DEBUG PORT ............................................................................... 32 FIGURE 21: LEVEL MATCH DESIGN FOR 3.3V SYSTEM .............................................................................. 32 FIGURE 22: SKETCH MAP FOR RS-232 INTERFACE MATCH ...................................................................... 33 FIGURE 23: REFERENCE CIRCUIT FOR (U)SIM1 INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR

................................................................................................................................................................... 35 FIGURE 24: REFERENCE CIRCUIT FOR (U)SIM2 INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR

................................................................................................................................................................... 35 FIGURE 25: REFERENCE DESIGN FOR NETLIGHT ..................................................................................... 37 FIGURE 26: REFERENCE DESIGN FOR GSM ANTENNA ............................................................................. 38 FIGURE 27: REFERENCE DESIGN FOR BLUETOOTH ANTENNA ............................................................... 42 FIGURE 28: TOP AND SIDE DIMENSIONS (UNIT: MM) .................................................................................. 47 FIGURE 29: BOTTOM DIMENSIONS (BOTTOM VIEW) (UNIT: MM) .............................................................. 48 FIGURE 30: RECOMMENDED FOOTPRINT (UNIT: MM) ................................................................................ 49 FIGURE 31: TOP VIEW OF BC92 ..................................................................................................................... 50 FIGURE 32: BOTTOM VIEW OF BC92 ............................................................................................................ 50 FIGURE 33: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 52 FIGURE 34: TAPE DIMENSIONS ..................................................................................................................... 53 FIGURE 35: REEL DIMENSIONS ..................................................................................................................... 54 FIGURE 36: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3 ........................................................... 62 FIGURE 37: RADIO BLOCK STRUCTURE OF CS-4 ....................................................................................... 63

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1 Introduction This document defines the BC92 module and describes its air interface and hardware interfaces which are connected with customers’ applications. This document can help customers quickly understand BC92 module interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, customers can use BC92 to design and set up mobile applications easily.

1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating BC92 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft.

Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.

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Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength.

The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fueling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.

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2 Product Concept

2.1. General Description BC92 is a multifunctional wireless module that integrates a high-performance, low-power NB-IoT engine and a quad-band GSM/GPRS engine. It supports NB-IoT and GSM/GPRS network modes in compliance with customers' different application requirements. The quad-band GSM/GPRS engine works at frequencies of GSM850MHz, EGSM900MHz, DCS1800MHz and PCS1900MHz. BC92 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to the Appendix B and Appendix C. BC92 module is able to communicate with network operator infrastructure through NB-IoT radio protocols 3GPP Rel.13 and 3GPP Rel.14* BC92 is a SMD module with 50 LCC encapsulated pins, providing a wealth of hardware interfaces that can be embedded in various types of digital product applications. With a super small size of 23.6mm x 19.9mm x 2.2mm, BC92 meets nearly all the requirements of M2M, including smoke detector, wireless meter reading, shared bike, intelligent parking, asset tracking, wearables and other applications of M2M . BC92 module adopts low power consumption technology. The current consumption is as low as 4uA in PSM. BC92 is integrated with Internet service protocols such as TCP, UDP, PPP, HTTP(S)* and FTP*. Extended AT commands have been developed for customers to use these Internet service protocols easily. The module fully complies with the RoHS directive of European Union.

“*” means under development.

NOTE

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2.2. Key Features The following table describes the detailed features of BC92.

Table 1: Key Features

Features Implementation

Power Supply Supply voltage range: 3.4V~4.2V. Typical supply voltage: 3.8V.

Power Saving Mode Typical current consumption in PSM: 4uA

NB-IoT Frequency Bands

Support B3/B5/B8/B20/B28 @H-FDD.

GSM Frequency Bands

Quad-band: GSM850, EGSM900, DCS1800, PCS1900. Modulation: GMSK. The module searches these frequency bands automatically. The frequency bands can be set by AT commands. Compliant with GSM Phase 2/2+

Transmitting Power Class 4 (2W) at GSM850 and EGSM900. Class 1 (1W) at DCS1800 and PCS1900.

GPRS Connectivity GPRS multi-slot class 12 (default). GPRS multi-slot class 1~12 (configurable). GPRS mobile station class B.

GPRS Data

GPRS data downlink transmission: max 85.6kbps. GPRS data uplink transmission: max 85.6kbps. Modulation: GMSK. Coding scheme: CS-1, CS-2, CS-3 and CS-4. Support the protocol PAP (Password Authentication Protocol) usually

used for PPP connection. Internet service protocols:

TCP/UDP/LwM2M/PPP/SNTP/MQTT*/CoAP*/HTTP(S)*, etc.

Bluetooth* Under development.

(U)SIM Interfaces Support (U)SIM: 1.8V/3.0V Support Dual (U)SIM card*

SMS* Text and PDU mode SMS storage: (U)SIM card

Audio Features*

Speech codec modes: Half Rate (ETS 06.20) Full Rate (ETS 06.10) Enhanced Full Rate (ETS 06.50/06.60/06.80) Adaptive Multi-Rate (AMR)

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1. 1) Within operation temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain

functions such as SMS and data transmission, without any unrecoverable malfunction. Radio spectrum and radio network will not be influenced. While there may be several parameters, such as Pout reducing in value, exceeding the specified tolerances of 3GPP. When the temperature returns to the normal operating temperature level, the module will comply with 3GPP specifications again.

3. “*” means under development.

Table 2: Coding Schemes and Maximum Net Data Rates over Air Interface

Echo Suppression Noise Reduction

UART Interfaces

Main port: For AT command communication and data transmission, the maximum

baud rate is 57600bps and the default baud rate is 9600bps. For firmware upgrade*, the default baud rate is 921600bps. Debug port: For software debugging, firmware upgrading and logging. The baud rate

is 921600bps

RTC Support

Temperature Range Operation temperature range: -25°C ~ +75°C 1) Extended temperature range: -40°C ~ +85°C 2) Storage temperature range: -40°C ~ +90°C

Physical Characteristics Size: (23.6±0.15)mm ×(19.9±0.15)mm ×(2.2±0.2)mm Package: LCC Weight: 1.8±0.1g

Firmware Upgrade Firmware upgrade via main port*, debug port or DFOTA.

Antenna Interface 50Ω impedance control

RoHS All hardware components are fully compliant with EU RoHS directive

Coding Scheme 1 Timeslot 2 Timeslot 4 Timeslot

CS-1 9.05kbps 18.1kbps 36.2kbps

CS-2 13.4kbps 26.8kbps 53.6kbps

CS-3 15.6kbps 31.2kbps 62.4kbps

CS-4 21.4kbps 42.8kbps 85.6kbps

NOTES

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2.3. Functional Diagram The following figure shows a block diagram of BC92 and illustrates the major functional parts: Radio frequency Baseband Power management Peripheral interfaces

RF_ANTSWITCH&GSM PA

RXFilter

RF_PA

TXFilter

VBAT LoadSwitch

PMU

DCDC

32K

RF Transceiverand Analogue

VDD_EXT

XO26MHz

XTAL Driver

Baseband

RESET

Main UART

Debug UART

FlashSRAM NETLIGHT

ADC*

RI*

RXFilter

VRTC

PWRKEY

AudioPSM_EINT

GSM

_LB_TX

GSM

_HB_TXN

B_LB_TX

NB&G

SM_

LB_RX

NB&G

SM_

HB_R

X

NB_HB_TX

USIM1eSIM Card(Optional)

AUDIO*

NB_H

B_TX

TX Filter

NB_LB_TX

USIM2*

NB_LB_LPM

_TX

NB_H

B_LPM_TX

BT BT_ANT*

Figure 1: Functional Diagram

2.4. Development Board In order to help customers to develop applications with BC92 conveniently, Quectel offers the development board (BC92-TE-B), Micro-USB cable, antenna and other peripherals to control or test the module. For more details, please refer to document [2].

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3 Application Interfaces

3.1. General Description BC92 is an SMD type module with 50 LCC pins. The later chapters provide detailed descriptions of these interfaces: Operating modes Power supply Turn on/off Power saving RTC UART interfaces Audio interfaces* (U)SIM interfaces RI behaviors* Network status indication* ADC interface*

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3.2. Pin Assignment The following figure shows the pin assignment of BC92.

Power RF ReservedGND UART AudioSIM

GND

SIM1_CLK

SIM1_DATA

SIM1_RST

SIM1_VDD

RES

ER

VED

RES

ER

VED

SIM

2_VD

D*

SIM

2_C

LK*

SIM

2_D

ATA

*

VDD

_EX

T

PWRKEY

RESET

RES

ER

VED

NET

LIG

HT

Top view

GN

D

RF_

ANT

VBAT

AGND

VRTC

GN

D

GN

D

GN

D

GN

D

VBAT

SIM2_RST*

RTS*

CTS*

RXD

TXD

RI*

ADC*

RESERVED

MIC1P*

MIC1N*

SPK1N*

SPK1P*

LOUDSPKN*

LOUDSPKP*

DBG

_RXD

DBG

_TXD

PSM

_EIN

T

Other

RESERVED

RESERVED

1

2

3

4

5

48

49

50

6

7

8

9

10

12 13 14 15 16 201918174241

40 39 38 37 36 32333435

11

31

30

29

28

27

45

44

43

26

25

24

23

22

21

GND

BT_ANT*

GND

GNDBC92

47 46

RES

ER

VED

RES

ER

VED

Figure 2: Pin Assignment

1. All reserved pins should be kept floating. 2. “*” means under development.

NOTES

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3.3. Pin Description

Table 3: I/O Parameters Definition

Table 4: Pin Description

Type Description

IO Bidirectional

DI Digital input

DO Digital output

PI Power input

PO Power output

AI Analog input

AO Analog output

Power Supply

Pin Name Pin No. I/O Description DC Characteristics Comment

VBAT 33, 34 PI Main power supply Vmax=4.2V Vmin=3.4V Vnorm=3.8V

The power supply must be able to provide sufficient current up to 2A

VRTC 32 PI/PO

Input: Power supply for RTC Output: Charging backup battery or golden capacitor

Vnorm=2.5V If unused, keep this pin open

VDD_EXT 19 PO Supply 2.8V voltage for external circuit.

Vnorm=2.8V

No output under PSM; It is recommended to be applied to weak pull-ups of an external I/O port.

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GND

31, 35 36, 37 38, 40, 45, 48, 50

Ground

PWRKEY

Pin Name Pin No. I/O Description DC Characteristics Comment

PWRKEY 10 DI

Turn-on key. Pull down PWRKEY for a particular moment to power on.

RESET

Pin Name Pin No. I/O Description DC Characteristics Comment

RESET 11 DI

Reset the module. Pull down RESET for a particular moment to reset.

PSM_EINT

Pin Name Pin No. I/O Description DC Characteristics Comment

PSM_EINT 20 DI

Wake up the module from PSM. Pull down PSM_EINT for a particular moment to wake up.

Network Status Indicator*

Pin Name Pin No. I/O Description DC Characteristics Comment

NETLIGHT 13 DO Network status indication

VOLmax=0.2V VOHmin=2.6V

If unused, keep this pin open

Audio Interface*

Pin Name Pin No. I/O Description DC Characteristics Comment

AGND 1 Audio-analog ground

MIC1P* 4 AI Positive and negative voice input

If unused, keep these pins open MIC1N* 5 AI

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SPK1P* 7 AO Channel 1 positive and negative voice output

SPK1N* 6 AO

LOUDSPKP* 9 AO Channel 2 positive and negative voice output

LOUDSPKN* 8 AO

Main UART Port

Pin Name Pin No. I/O Description DC Characteristics Comment

RXD 21 DI Receive data

VILmax=0.3×VDD_EXT VIHmin=0.7×VDD_EXT VOLmax=0.2V VOHmin=2.6V

2.8 V voltage domain; If only TXD, RXD and GND are used for communication, it is recommended to keep all other pins open

TXD 22 DO Transmit data

RI* 26 DO Ring indication

CTS* 23 DO Clear to send

RTS* 24 DI Request to send

Debug UART Port

Pin Name Pin No. I/O Description DC Characteristics Comment

DBG_TXD 15 DO Transmit data VILmax=0.3×VDD_EXT VIHmin=0.7×VDD_EXT VOLmax=0.2V VOHmin=2.6V

2.8 V voltage domain; If unused, keep these pins open

DBG_RXD 14 DI Receive data

(U)SIM1 Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

SIM1_VDD 27 PO Power supply for (U)SIM1 card

The voltage can be selected by software automatically. Either 1.8V or 3.0V.

Supports both GSM and NB-IoT networks; All signals of (U)SIM interfaces should be protected against ESD with a TVS diode array; Maximum trace length is 200mm from the module pin to (U)SIM card connector.

SIM1_DATA 29 IO Data signal of (U)SIM1 card

VILmax=0.25×SIM1_VDD VIHmin=0.75×SIM1_VDD VOLmax=0.15×SIM1_VDD VOHmin= 0.85×SIM1_VDD

SIM1_CLK 30 DO Clock signal of (U)SIM1 card

VOLmax=0.15×SIM1_VDD VOHmin=0.85×SIM1_VDD

SIM_RST 28 DO Reset signal of (U)SIM1 card

VOLmax=0.15×SIM1_VDD VOHmin=0.85×SIM1_VDD

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“*” means under development.

(U)SIM2 Interface*

SIM2_VDD* 18 PO Power supply for (U)SIM2 card

The voltage can be selected by software automatically. Either 1.8V or 3.0V.

Supports GSM network only; All signals of (U)SIM interfaces should be protected against ESD with a TVS diode array; Maximum trace length is 200mm from the module pin to (U)SIM card connector.

SIM2_DATA* 16 IO Data signal of (U)SIM2 card

VILmax=0.25×SIM1_VDD VIHmin=0.75×SIM1_VDD VOLmax=0.15×SIM1_VDD VOHmin= 0.85×SIM1_VDD

SIM2_CLK* 17 DO Clock signal of (U)SIM2 card

VOLmax=0.15×SIM1_VDD VOHmin=0.85×SIM1_VDD

SIM2_RST* 25 DO Reset signal of (U)SIM2 card

VOLmax=0.15×SIM1_VDD VOHmin=0.85×SIM1_VDD

ADC*

Pin Name Pin No. I/O Description DC Characteristics Comment

ADC* 2 AI General purpose analog to digital converter

Voltage range: 0V - 1.8V If unused, keep this pin open.

Antenna Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

RF_ANT 39 IO NB-IoT/GSM antenna interface

Impedance of 50Ω

BT_ANT* 49 IO Bluetooth antenna interface

Impedance of 50Ω If unused, keep this pin open.

Reserved Pins

Pin Name Pin No. I/O Description DC Characteristics Comment

RESERVED

3, 12, 41, 42, 43, 44, 46, 47

Keep these pins open.

NOTE

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3.4. Operating Modes The following table briefly describes various working modes of the module

Table 5: Operating Modes Overview

Modes Function

NB-IoT Mode

NB-IoT CONNECTED

All functions of the module are available and all processors are active. Radio transmission and reception can be performed. Transitions to NB-IoT IDLE mode or PSM can be initiated in NB-IoT CONNECTED mode.

NB-IoT IDLE

the software is active when the module has registered on the network and is ready to send and receive data; paging messages can be received; transitions to NB-IoT CONNECTED mode or PSM can be initiated in NB-IoT IDLE mode

PSM

Only the 32kHz RTC is working, and the network is disconnected. The module will exit from PSM and enter into NB-IoT CONNECTED mode when the timer T3412 times out, and it can also be woken up from PSM by PSM_EINT

GSM/GPRS Mode

GSM/GPRS SLEEP

In this case, the current consumption of the module will reduce to the minimal level under GSM/GPRS Mode. During this mode, the module can still receive paging message and SMS from the system normally.

GSM IDLE Software is active. The module has registered on GSM network, and it is ready to send and receive GSM data.

GSM TALK* GSM connection is ongoing. In this mode, the power consumption is decided by the configuration of Power Control Level (PCL), dynamic DTX control and the working RF band.

GPRS IDLE The module is not registered on GPRS network. It is not reachable through GPRS channel.

GPRS STANDBY

The module is registered on GPRS network, but no GPRS PDP context is active. The SGSN knows the Routing Area where the module is located at.

GPRS READY The PDP context is active, but no data transfer is ongoing. The module is ready to receive or send GPRS data. The SGSN knows the cell where the module is located at.

GPRS DATA There is GPRS data in transfer. In this mode, power consumption is decided by the PCL, working RF band and GPRS multi-slot configuration.

POWER DOWN Normal shutdown by sending AT+QPOWD=1 command. Software is not active. The UART interfaces are not accessible but RTC is still working. Operating voltage

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1. Priority network configurable (default NB-IoT network priority). 2. To wake up the module from POWER DOWN mode, the PSM_EINT pin should be pulled down for a

while.

3.5. Power Supply

3.5.1. Power Features of the Module

The power supply of the module is one of the key points in BC92 design. Due to the 577us radio burst in GSM mode every 4.615ms, the power supply must be able to deliver high current peaks in a burst period. During these peaks, drops on the supply voltage must not exceed the minimum working voltage of the module. The maximum current consumption of GSM mode could reach 1.6A during a burst transmission. It will cause a large voltage drop on the VBAT. In order to ensure the stable and normal operation of the module, the minimum voltage of VBAT shall not fall below 3.4V.

Vdrop

4.615ms

577us

IBAT

VBAT

Burst: 1.6A

Figure 3: Voltage Ripple during GSM Transmitting

3.5.2. Decrease Supply Voltage Drop

Make sure that the input voltage will never drop below the minimum voltage even in a burst transmission. For better power performance, it is recommended to place a 100uF tantalum capacitor with low ESR (ESR=0.7Ω) and ceramic capacitors 100nF, 33pF and 10pF near the VBAT pin. A reference circuit is illustrated in the following figure.

(connected to VBAT) remains applied.

NOTES

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The VBAT trace should be wide enough to ensure that there is not too much voltage drop during burst transmission. The width of trace should be no less than 2mm; and in principle, the longer the VBAT trace, the wider it will be.

VBAT

C2C1+ C3 C4

GND

100uF 100nF 10pF0603

33pF0603

Figure 4: Reference Circuit for VBAT Input

3.5.3. Reference Design for Power Supply

The power supply of GSM module is capable of providing sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested to use a LDO as the power supply. If there is a big voltage difference between the input source and the desired output (VBAT), a switcher power converter is recommended to be used as the power supply. The following figure shows a reference design for +5V input power source. The designed output for the power supply is 3.8V and the maximum load current is 3.0A. In addition, it is recommended to add a TVS to increase the surge and ESD tolerance and place it close to the VBAT pin of module.

DC_IN

C1 C2

MIC29302WU U1

IN OUT

EN

GN

D

AD

J

2 4

1 3 5

VBAT

100nF

C3

470uF

C4

100nF

R2

TVS120K

58KR3470uF

R4

470R

MCU_POWER_ON/OFF

47K

4.7KR5

R6

R151K

Figure 5: Reference Circuit for Power Supply

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1. It is suggested to control the module’s main power supply (VBAT) via LDO enable pin to restart the module when the module becomes abnormal. Power switch circuit like P-channel MOSFET switch circuit can also be used to control VBAT.

2. This circuit is suitable for power insensitive scenarios. If there are low power design requirements, please select the appropriate LDO.

3.5.4. Monitor Power Supply

The command AT+CBC can be used to monitor the supply voltage of the GSM part. The unit of the displayed voltage is mV. For details, please refer to document [1].

3.6. Turn on and off Scenarios

3.6.1. Turn on

The module can be turned on by driving the pin PWRKEY to a low-level voltage during re-powering. An open collector driver circuit is suggested to control the PWRKEY. A simple reference circuit is illustrated as below.

Turn on pulse

PWRKEY

4.7K

47K

Figure 6: Turn on the Module through an Open-collector Driver

The other way to control the PWRKEY is through a button directly. While pressing the key, electrostatic strike may generate from the finger, and thus, a TVS component is indispensable to be placed nearby the button for ESD protection. For the best performance, the TVS component must be placed nearby the button. A reference circuit is shown in the following figure.

NOTES

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PWRKEYS1

Close to S1

TVS

Figure 7: Turn on the Module through a Button

The turn-on scenario is illustrated in the following figure.

PWRKEY

VDD_EXT

700ms

≥550msVBAT

Module Status

OFF RUNNINGBOOTING

1.02s

Figure 8: Turn-on Scenario

1. Make sure that VBAT is stable before pulling down PWRKEY pin. It is suggested that the minimum time between VBAT power on and pin PWRKEY pull down is about 100ms.

2. PWRKEY is used for the first booting after the module is powered on. If the module is turned off by AT command, it is by pulling down PSM_EINT for a while that the module is turned on.

3.6.2. Turn off

The following procedures can be used to turn off the module:

Normal turn-off procedure: turn off module with command AT+QPOWD=1 (refer to Chapter 3.6.2.1). Under-voltage automatic shutdown*: turn off when VBAT under-voltage is detected (refer to Chapter

3.6.2.2).

NOTES

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“*” means under development.

3.6.2.1. Turn off Module with AT Command

It is a safe way to turn off the module via command AT+QPOWD=1. This command will let the module log off from the network and allow the firmware to save important data before completely disconnecting the power supply.

VBAT

VDD_EXT

RUNNING OFFModuleStatus

AT+QPOWD=11.5~14s

Figure 9: Power down Timing (Power off by AT Command)

Before the completion of the power-off procedure, the module sends out the result code: NORMAL POWER DOWN After that moment, no further AT commands can be executed. And then the module enters into the power-down mode. Please refer to document [1] for details about AT command AT+QPOWD.

3.6.2.2. Under-voltage Automatic Shutdown*

The function is under development.

3.6.3. Reset

Driving the RESET pin to a low-level voltage for at least 920ms will reset the module.

NOTE

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The recommended circuits of resetting the module are shown below. An open drain/collector driver or button can be used to control the RESET pin.

Reset pulse

RESET

4.7K

47K

Figure 10: Reference Circuit of RESET with Driver Circuits

RESET

S1

Close to S1

TVS

Figure 11: Reference Circuit of RESET with Buttons

The reset timing is illustrated in the following figure.

VBAT

920ms

ResettingModule Status Running

RESET

Restart

≥920ms

VDD_EXT

524ms

240ms

Figure 12: Reset Timing

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3.7. Power Saving Upon system requirement, there are several actions to drive the module to enter low current consumption status.

3.7.1. Light Sleep Mode

In the following cases, the module will enter light sleep mode. GSM/GPRS SLEEP mode GSM network priority and no SIM card be detected Some NB-IoT IDLE cases The UART port is still active in this mode and the module can be waken up from light sleep mode through the main UART port.

3.7.2. Deep Sleep Mode

In the following cases, the module will enter deep sleep mode PSM (Power Saving Mode) NB-IoT network priority and no SIM card be detected Some NB-IoT IDLE cases The UART port is inactive in this mode and module can be wake up from deep sleep mode through the PSM_EINT interface. PSM is designed to reduce power consumption of the module and improve the battery life. The following figure shows the power consumption in different modes.

Pow

er C

onsu

mpt

ion

PSMIdle

Tran

smis

sion

Rec

eptio

n

T3324T3412 TAUUE inactive time

Idle

Figure 13: Module Power Consumption in Different Modes

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The procedure of the module entering PSM is as follows: The module requests to enter PSM through the “ATTACH REQUEST” message during attach/TAU (Tracking Area Update) procedure. Then the network accepts the request and provides an active time value (T3324) to the module, during which the mobile reachable timer starts. When the T3324 timer expires, the module enters PSM for duration of T3412 (periodic TAU timer). Please note that the module cannot request PSM when establishing emergency attachment or initializing PDN (Public Data Network) connection. In PSM, BC92 cannot be paged and stops accessing to network activities such as cell reselection, while T3412 is still active. Either of the following methods can make the module exit from PSM:

After the T3412 timer expires, the module will exit PSM automatically. Pulling down PSM_EINT (falling edge) will wake the module up from PSM. The timing of waking up the module from PSM is illustrated below.

VBAT

VDD_EXT

RUNNINGPSMModuleStatus

PSM_EINT≥100ms

Figure 14: Timing of Waking up Module from PSM

3.8. RTC The RTC (Real Time Clock) can be supplied by an external capacitor or battery (rechargeable or non-chargeable) through the pin VRTC.

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The following figures show various reference circuits for RTC backup.

Non-chargeable Backup Battery

Module

RTC Core

VBAT

Power Supply

LDO/DCDC LDO

VRTC 2K

Figure 15: RTC Supply from Non-rechargeable Battery

Rechargeable Backup Battery

Module

RTC Core

VBAT

Power Supply

LDO/DCDC LDO

VRTC 2K

Figure 16: RTC Supply from Rechargeable Battery

Module

RTC Core

VBAT

Power Supply

LDO/DCDC LDO

VRTC 2K

Large Capacitance Capacitor

Figure 17: RTC Supply from Capacitor

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After module enters the POWER DOWN mode, the VBAT power supply is stopped. At this time, the external Power Supply can supply power to the RTC Core through the VRTC pin.

3.9. UART Interfaces The module provides two serial ports: Main and Debug Port. The module is designed as a DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. The Main Port: TXD: Send data to RXD of DTE. RXD: Receive data from TXD of DTE. RTS*: Request to send. CTS*: Clear to send. RI*: Ring indicator (when there is a call, SMS or URC output, the module will inform DTE with the RI*

pin). The Debug Port: DBG_TXD: Send data to the COM port of peripheral. DBG_RXD: Receive data from the COM port of peripheral.

“*” means under development.

The logic levels are described in the following table.

Table 6: Logic Levels of UART Interfaces

Parameter Min. Max. Unit

VIL 0 0.3×VDD_EXT V

VIH 0.7×VDD_EXT V

VOL 0 0.2 V

NOTE

NOTE

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Table 7: Pin Definition of UART Interfaces

3.9.1. Main Port

3.9.1.1. Features of Main Port

Contain data lines TXD and RXD, hardware flow control lines RTS* and CTS*, as well as RI*. Default 8 data bits, no parity, a stop bit. Baud rates for AT command transfer and GPRS data support are 2400bps, 4800bps, 9600bps

(default), 14400bps, 19200bps, 28800bps, 33600bps, 38400bps and 57600bps. For firmware upgrade *, supports 921600bps baud rate by default.

VOH VDD_EXT-0.2 VDD_EXT+0.2 V

Interface Pin Name Pin No. I/O Description

Main Port

TXD 22 DO Transmit data

RXD 21 DI Receive data

RI* 26 DO Ring indication

CTS* 23 DO Clear to send

RTS* 24 DI Request to send

Debug Port DBG_RXD 14 DI Receive data

DBG_TXD 15 DO Transmit data

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3.9.1.2. The Connection of UART

The connection between module and host using main UART port is very flexible. The following are two common connection methods Three-wire connection is shown as below.

TXD

RXD

GND

UART port

TXD

RXD

GND

Module (DCE) Host (DTE)Controller

Figure 18: Reference Design for Main UART Port (Three-wire Connection)

A reference design for main UART port with hardware flow control is shown as below. The connection will enhance the reliability of the mass data communication.

RTS*

CTS*

RTS

CTS

GND

RXD

TXD TXD

RXD

GND

Module (DCE) Host (DTE) Controller

Figure 19: Reference Design for UART Port with Hardware Flow Control

3.9.2. Debug Port

Two lines: DBG_TXD and DBG_RXD. The port outputs log information automatically. For software debugging and firmware upgrade, baud rate of 921600bps.

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Peripheral

TXD

RXD

GND

Module

DBG_TXD

DBG_RXD

GND

Figure 20: Reference Design for Debug Port

3.9.3. UART Application

A reference design of 3.3V level match is shown as below. If the host is a 3V system, please change the 5.6kΩ resistors to 10kΩ ones.

MCU/ARM/TXD

/RXD

1K

TXD

RXD

RTS*CTS*

RI*

/RTS/CTS

EINT

Module

1K

1K

Voltage level: 3.3V

5.6K5.6K

1K

1K

GND GND

Figure 21: Level Match Design for 3.3V System

1. When the level of the host system is 3V or 3.3V, it is recommended to add a voltage divider circuit to the serial port connection between the module and the host to make the level match.

2. If there is a low power consumption design requirement, it is recommended to set the corresponding MCU output pin low after the module enters the PSM to avoid power leakage.

3. For more details on level matching, please refer to the document [10].

NOTES

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The following figure shows a sketch map between the module and the standard RS-232 interface. As the electrical level of module is 2.8V, a RS-232 level shifter must be used. Note that customers should assure the I/O voltage of level shifter which connects to module is 2.8V.

TXD

RXD

RTS*

CTS*

RI*

Module

GND

C1+

C1-

C2+

C2-

V+

VCC

GND

V-

3.3V

T1IN

T2IN

T3IN

T4IN

R1IN

R2IN

R3IN

R1OUT

R2OUT

R3OUT

T1OUT

T2OUT

T5OUT

T3OUT

T4OUTT5IN

GND

GND

/R1OUT

1

2

3

4

5

6

7

8

9

GND

To PC Serial Port

GND

1K

1K

1K

1K

5.6K

1K

5.6K

RS-232 Level Shifter

Figure 22: Sketch Map for RS-232 Interface Match

Please visit vendors’ websites to select a suitable IC, such as http://www.maximintegrated.com and http://www.exar.com.

3.10. Audio Interfaces* The module provides an analog audio input channel and two analog audio output channels

“*” means under development.

NOTE

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3.11. (U)SIM Interfaces The (U)SIM card is powered by an internal regulator in the module. Both 1.8V and 3.0V (U)SIM cards are supported.

Table 8: Pin Definition of (U)SIM Interfaces

1. (U)SIM1 interface supports both GSM and NB-IoT networks. 2. (U)SIM2 interface supports GSM network only and it is still under development

Pin Name Pin No. I/O Description

SIM1_VDD 27 PO Supply power for (U)SIM1 card. Automatic detection of (U)SIM1 card voltage.

SIM1_CLK 30 DO Clock signal of (U)SIM1 card

SIM1_DATA 29 IO Data signal of (U)SIM1 card

SIM1_RST 28 DO Reset signal of (U)SIM1 card

SIM2_VDD* 18 PO Supply power for (U)SIM2 card. Automatic detection of (U)SIM2 card voltage

SIM2_CLK* 17 DO Clock signal of (U)SIM2 card

SIM2_DATA* 16 IO Data signal of (U)SIM2 card

SIM2_RST* 25 DO Reset signal of (U)SIM2 card

NOTES

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The following figure shows a reference design for (U)SIM1 interface with a 6-pin (U)SIM card connector.

Module

SIM1_VDD

GND

SIM1_RSTSIM1_CLK

SIM1_DATA 22R

22R22R

100nF

GND

TVS

33pF 33pF 33pF

VCCRSTCLK IO

VPPGND

GND

(U)SIM card connector

10K

Figure 23: Reference Circuit for (U)SIM1 Interface with a 6-Pin (U)SIM Card Connector

The following figure shows a reference design for (U)SIM2 interface with a 6-pin (U)SIM card connector.

Module

SIM2_VDD

GND

SIM2_RSTSIM2_CLK

SIM2_DATA 22R

22R22R

100nF

GND

TVS

33pF 33pF 33pF

VCCRSTCLK IO

VPPGND

GND

(U)SIM card connector

10K

Figure 24: Reference Circuit for (U)SIM2 Interface with a 6-Pin (U)SIM Card Connector

In order to enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design: Keep the placement of (U)SIM card connector as close as possible to the module. Keep the trace

length as less than 200mm as possible. Keep (U)SIM card signals away from RF and VBAT traces. Assure the trace between the ground of module and that of (U)SIM card connector is short and wide.

Keep the trace width of ground no less than 0.5mm to maintain the same electric potential. The

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decouple capacitor between SIM_VDD and GND should be not more than 1μF and be placed close to the (U)SIM card connector.

To avoid cross talk between SIM_DATA and SIM_CLK, keep them away from each other and shield them separately with surrounded ground.

In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic capacitance should be not more than 50pF. The ESD protection device should be placed as close to (U)SIM card connector as possible, and make sure the (U)SIM card signal lines go through the ESD protection device first from (U)SIM card connector and then to the module. The 22Ω resistors should be connected in series between the module and the (U)SIM card connector so as to suppress EMI spurious transmission and enhance ESD protection. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector.

The pull-up resistor on SIM_DATA line can improve anti-jamming capability and should be placed close to the (U)SIM card connector.

3.12. RI Behaviors* When a voice call, text message, or feature URC is received, the module notifies the DTE by pulling down the RI pin for a specified period of time.

“*” means under development.

3.13. Network Status Indication* This function is disabled by default and NETLIGHT pin outputs a low level. The function is enabled by the AT command AT+QLEDMODE=1, after which the NETLIGHT pin will work in states shown in the following table.

Table 9: Pin Definition of ADC*

Network Modes State Module Function

NB-IoT Mode

64ms High (light on) / 800ms Low (light off)

The module is searching for network.

64ms High (light on) / 2000ms Low (light off)

The module is attached to network with connected status.

NOTE

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A reference circuit is shown as below.

Module

NETLIGHT4.7K

47K

300R

VBAT

Figure 25: Reference Design for NETLIGHT

3.14. ADC* The module provides a 10-bit ADC input interface to measure the voltage value.

Table 10: Pin Definition of ADC*

“*” means under development.

Low (light off) Other status.

GSM Mode

64ms High (light on) / 800ms Low (light off)

The module is not synchronized with network.

64ms High (light on) / 2000ms Low (light off)

The module is synchronized with network

64ms High (light on) / 600ms Low (light off)

The GPRS data transmission

Pin Name Pin No. Description

ADC* 2 General purpose analog to digital converter.

NOTE

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4 Antenna Interfaces BC92 includes two antenna interfaces,NB-IoT/GSM antenna and Bluetooth interface antenna interface. Pin 39 is the input of NB-IoT/GSM antenna and pin 49 is the input of Bluetooth antenna. Both NB-IoT/GSM antenna and Bluetooth antenna have 50Ω characteristic impedance.

4.1. NB-IoT/GSM Antenna Interface There is a GSM/NB-IoT antenna pin named RF_ANT for BC92, and the pin definition is as following table.

Table 11: Pin Definition of NB-IoT/GSM_ANT

Pin Name Pin No. I/O Description

GND 38 Ground

RF_ANT 39 IO NB-IoT/GSM Antenna Pin

GND 40 Ground

4.1.1. Reference Design

Since the external antenna must be matched properly to achieve the best performance, a matching circuit is necessary. A reference design for GSM antenna is shown below.

Module

RF_ANT0R

NM NM

Figure 26: Reference Design for GSM Antenna

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BC92 provides an RF antenna pin for antenna connection. The RF trace in host PCB connected to the module’s RF antenna pin should be coplanar waveguide line or microstrip line, whose characteristic impedance should be close to 50Ω. BC92 comes with GND pads which are next to the antenna pad in order to give a better grounding. Besides, a π type matching circuit is suggested to be used to adjust the RF performance. To minimize the loss on RF trace and RF cable, please pay attention to the design. The following table shows the requirements on RF antenna.

Table 12: GSM Loss Requirements

Table 13: NB-IoT Loss Requirements

Table 14: Antenna Requirements

Type Requirements

GSM850/EGSM900 Cable insertion loss <1dB

DCS1800/PCS1900 Cable insertion loss <1.5dB

Type Requirements

B5/B8/B20/B28 Cable insertion loss <1dB

B3 Cable insertion loss <1.5dB

Type Requirements

Band GSM frequency band: B2/B3/B5/B8 NB-IoT frequency band: B3/B5/B8/B20/B28

VSWR ≤2

Gain (dBi) 1

Max. Input Power (W) 50

Input Impedance (Ω) 50

Polarization Type Linear

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4.1.2. RF Output Power

Table 15: RF Output Power

In GPRS 4 slots TX mode, the maximum output power is reduced by 2.5dB. This design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.

4.1.3. RF Receiving Sensitivity

Table 16: GSM Receiving Sensitivity

Band Max. Min.

GSM850 33dBm±2dB 5dBm±5dB

EGSM900 33dBm±2dB 5dBm±5dB

DCS1800 30dBm±2dB 0dBm±5dB

PCS1900 30dBm±2dB 0dBm±5dB

B3 23dBm±2dB <-40dBm

B5 23dBm±2dB <-40dBm

B8 23dBm±2dB <-40dBm

B20 23dBm±2dB <-40dBm

B28 23dBm±2dB <-40dBm

Band Receiving Sensitivity 3GPP Standard

GSM850 < -109dBm <-107.5dBm

EGSM900 < -109dBm <-107.5dBm

DCS1800 < -109dBm <-107.5dBm

PCS1900 < -109dBm <-107.5dBm

NOTE

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Table 17: NB-IoT Receiving Sensitivity without Retransmission

Table 18: NB-IoT Receiving Sensitivity in 128 Retransmissions

4.1.4. Operating Frequencies

Table 19: Operating Frequencies

Band Receiving Sensitivity 3GPP Standard

B3 <-114dBm <-107.5dBm

B5 <-114dBm <-107.5dBm

B8 <-114dBm <-107.5dBm

B20 <-114dBm <-107.5dBm

B28 <-114dBm <-107.5dBm

Band Receiving Sensitivity

B3 -129dBm

B5 -129dBm

B8 -129dBm

B20 -129dBm

B28 -129dBm

Band Receiving Frequency Transmitting Frequency

GSM850 869MHz~894MHz 824MHz~849MHz

EGSM900 925MHz~960MHz 880MHz~915MHz

DCS1800 1805MHz~1880MHz 1710MHz~1785MHz

PCS1900 1930MHz~1990MHz 1850MHz~1910MHz

B3 1805MHz~1880MHz 1710MHz~1785MHz

B5 869MHz~894MHz 824MHz~849MHz

B8 925MHz~960MHz 880MHz~915MHz

B20 791MHz~821MHz 832MHz~862MHz

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4.2. Bluetooth Antenna Interface BC92 provides Bluetooth antenna interface. Bluetooth is a radio technology that supports short-distance communication, which exchanges information wirelessly among many devices, including mobile phones, PDA, wireless headphones, laptop related peripherals and so on. The module provides a Bluetooth antenna pin BT_ANT*.

Table 19:Bluetooth Antenna Pin Definition

The external antenna must be matched properly in order to obtain the best performance. Therefore, it is suggested to reserve the matching circuit. The antenna connection reference circuit is shown in the following figure. C1 and C2 are not affixed by default, only 0Ω resistors are affixed.

BT_ANT*R1 0R

C1NM

C2NM

Module

Figure 27: Reference Design for Bluetooth Antenna

The following principles should be followed in design: Antenna matching circuit should be as close as possible to the antenna. RF layout from BT_ANT* foot to antenna must be controlled by 50_impedance. Radio frequency routing of BT_ANT* pin to antenna must be far away from high-speed signal lines

and strong interference sources to avoid crossing or parallel with any signal lines in adjacent layers.

B28 758MHz~803MHz 703MHz~748MHz

Pin Name Pin Number I/O Description

BT_ANT* 49 IO BT_ANT Interface

GND 48, 50 GND

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5 Electrical, Reliability and Radio Characteristics

5.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of BC92 module are listed in the following table.

Table 20: Absolute Maximum Ratings

5.2. Operation and Storage Temperatures The following table lists the operation and storage temperatures of the module.

Table 21: Operation Temperature

Parameter Min. Max. Unit

VBAT 4.35 V

Voltage at Digital Pins 3.06 V

Voltage at Analog Pins 1.8 V

Parameter Min. Typ. Max. Unit

Operation Temperature Range 1) -25 +25 +75 ºC

Extended Temperature Range 2) -40 +85 ºC

Storage Temperature Range -40 +90 ºC

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1. 1) Within operation temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice,

SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again.

5.3. Current Consumption

Table 22: Current Consumption of NB-IoT Mode

Table 23: Current Consumption of GSM/GPRS Mode

Parameter Description Conditions Min. Typ. Max. Unit

IVBAT

PSM Deep sleep 4 uA

Idle DRX=2.56s, ECL0 1.2 mA

Connected

Radio transmission, 23dBm (B3)

270 mA

Radio transmission, 23dBm (B5)

240 mA

Radio transmission, 23dBm (B8)

290 mA

Radio transmission, 23dBm (B20)

250 mA

Radio transmission, 23dBm (B28)

270 mA

Condition Current Consumption

Low power mode

SLEEP mode @DRX=5 1mA

AT+CFUN=0 0.7mA

NOTES

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Voice Call

GSM850 200mA

EGSM900 220mA

DCS1800 160mA

PCS1900 150mA

GPRS Data

DATA Mode, GPRS (3 Rx, 2Tx) CLASS 12

GSM850 320mA

EGSM900 330mA

DCS1800 260mA

PCS1900 220mA

DATA Mode, GPRS (2 Rx, 3Tx) CLASS 12

GSM850 380mA

EGSM900 380mA

DCS1800 290mA

PCS1900 250mA

DATA Mode, GPRS (4 Rx, 1Tx) CLASS 12

GSM850 190mA

EGSM900 200mA

DCS1800 160mA

PCS1900 140mA

DATA Mode, GPRS (1 Rx, 4Tx) CLASS 12

GSM850 450mA

EGSM900 450mA

DCS1800 340mA

PCS1900 290mA

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GPRS Class 12 is the default setting. The GSM module can be configured from GPRS Class 1 to Class 12. Setting to lower GPRS class would make it easier to design the power supply for the GSM module.

5.4. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module. The following table shows the module’s electrostatic discharge characteristics.

Table 24: Electrostatic Discharge Characteristics (25ºC, 45% Relative Humidity)

Test Point Contact Discharge Air Discharge

VBAT, GND +/-5KV +/-10KV

RF_ANT, BT_ANT* +/-5KV +/-10KV

Others +/-0.5KV +/-1KV

NOTE

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6 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the tolerances for dimensions without tolerance values are ±0.05mm.

6.1. Mechanical Dimensions of Module

Figure 28: Top and Side Dimensions (Unit: mm)

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Figure 29: Bottom Dimensions (Bottom View) (Unit: mm)

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6.2. Recommended Footprint

Figure 30: Recommended Footprint (Unit: mm)

The module should be kept about 3mm away from other components on the host PCB.

NOTE

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6.3. Top and Bottom Views of the Module

Figure 31: Top View of BC92

Figure 32: Bottom View of BC92

These are renderings of BC92 module. For authentic dimension and appearance, please refer to the module that you receive from Quectel.

NOTE

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7 Storage, Manufacturing and Packaging

7.1. Storage BC92 is stored in a vacuum-sealed bag. It is rated at MSL 3, and storage restrictions are shown as below. 1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high

temperature processes must be:

Mounted within 168 hours at the factory environment of ≤30ºC/60%RH. Stored at <10%RH.

3. Devices require baking before mounting, if any circumstance below occurs.

When the ambient temperature is 23ºC±5ºC and the humidity indication card shows the humidity is >10% before opening the vacuum-sealed bag.

Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%.

4. If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.

As the plastic package cannot be subjected to high temperature, it should be removed from devices before high temperature (120ºC) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for baking procedure.

7.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of

NOTE

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stencil for the module is recommended to be 0.18-0.20mm. For more details, please refer to document [11]. It is suggested that the peak reflow temperature is 238ºC ~245ºC, and the absolute maximum reflow temperature is 245ºC. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.

Temp. (°C)

Reflow Zone

Soak Zone

245

200220238

C

DB

A150

100

Max slope: 1~3°C/sec

Cooling down slope: 1~4°C/sec

Max slope: 2~3°C/sec

Figure 33: Reflow Soldering Thermal Profile

Table 25: Recommended Thermal Profile Parameters

Factor Recommendation

Soak Zone

Max slope 1 to 3°C/sec

Soak time (between A and B: 150°C and 200°C) 60 to 120 sec

Reflow Zone

Max slope 2 to 3°C/sec

Reflow time (D: over 220°C) 40 to 60 sec

Max temperature 238°C ~ 245°C

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1. During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.

2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12 hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly identifiable and the QR code is still readable, although white rust may be found.

7.3. Packaging BC92 is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. The following figures show the packaging details, measured in mm.

Figure 34: Tape Dimensions

Cooling down slope 1 to 4°C/sec

Reflow Cycle

Max reflow cycle 1

NOTES

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PS

6

DETAIL:A

DETAIL:A

Figure 35: Reel Dimensions

Table 26: Reel Packaging

Model Name MOQ for MP Minimum Package: 250pcs Minimum Package x 4=1000pcs

BC92 250pcs Size: 370mm × 350mm × 56mm N.W: TBD G.W: TBD

Size: 370mm × 250mm × 365mm N.W: TBD G.W: TBD

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8 Appendix A References

Table 27: Related Documents

SN Document Name Remarks

[1] Quectel_BC92_AT_Commands_Manual BC92 AT commands manual

[2] Quectel_BC92-TE-B_User_Guide BC92-TE-B user guide

[3] GSM 07.07 Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME)

[4] GSM 07.10 Support GSM 07.10 multiplexing protocol

[5] GSM 07.05

Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment – Data Circuit terminating Equipment (DTE – DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

[6] GSM 11.14

Digital cellular telecommunications (Phase 2+); Specification of the (U)SIM Application Toolkit for the Subscriber Identity module – Mobile Equipment ((U)SIM – ME) interface

[7] GSM 11.11

Digital cellular telecommunications (Phase 2+); Specification of the Subscriber Identity module – Mobile Equipment ((U)SIM – ME) interface

[8] GSM 03.38 Digital cellular telecommunications (Phase 2+); Alphabets and language-specific information

[9] GSM 11.10

Digital cellular telecommunications (Phase 2); Mobile Station (MS) conformance specification; Part 1: Conformance specification

[10] Quectel_BC92_Reference_Design_V1.0 BC92 reference design

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Table 28: Terms and Abbreviations

[11] Quectel_Module_Secondary_SMT_User_Guide Module secondary SMT user guide

[12] Quectel_GSM_Module_Digital_IO_Application_Note GSM module digital IO application note

Abbreviation Description

ADC Analog-to-Digital Converter

AG Audio Gateway

AGPS Assisted GPS

AIC Active Interference Cancellation

AIN Audio In

AMR Adaptive Multi-Rate

ARP Antenna Reference Point

ASIC Application Specific Integrated Circuit

BER Bit Error Rate

CHAP Challenge Handshake Authentication Protocol

CS Coding Scheme

CSD Circuit Switched Data

CTS Clear to Send

DGPS Differential GPS

DRX Discontinuous Reception

DSP Digital Signal Processor

DCE Data Communications Equipment (typically module)

DTE Data Terminal Equipment (typically computer, external controller)

DTR Data Terminal Ready

DTX Discontinuous Transmission

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EASYTM Embedded Assist System

EFR Enhanced Full Rate

EGSM Enhanced GSM

EMC Electromagnetic Compatibility

EPOTM Extended Prediction Orbit

ESD Electrostatic Discharge

ETS European Telecommunication Standard

FCC Federal Communications Commission (U.S.)

FDMA Frequency Division Multiple Access

FR Full Rate

FS File System

FTP File Transfer Protocol

GAGAN GPS Aided Geo Augmented Navigation

GGA NMEA: Global Positioning System Fix Data

GLL NMEA: Geographic Latitude and Longitude

GLONASS Global Navigation Satellite System

GLP GNSS Low Power

GMSK Gaussian Minimum Shift Keying

GNSS Global Navigation Satellite System

GPRS General Packet Radio Service

GPS Global Positioning System

GSA NMEA: GPS DOP and Active Satellites

GSM Global System for Mobile Communications

GSV NMEA: GPS Satellites in View

G.W Gross Weight

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HFP Hands-free Profile

HO High Level Output

HR Half Rate

HTTP(S) Hypertext Transfer Protocol (Secure)

I/O Input/Output

IC Integrated Circuit

IEEE Institute of Electrical and Electronics Engineers

IMEI International Mobile Equipment Identity

IOmax Maximum Output Load Current

kbps Kilo Bits Per Second

LCC Leadless Chip Carriers

LED Light Emitting Diode

LGA Land Grid Array

Li-Ion Lithium-Ion

LO Low Level Output

MCU Micro Control Unit

MMS Microsoft Media Server

MQTT Message Queuing Telemetry Transport

LNA Low Noise Amplifier

MO Mobile Originated

MOQ Minimum Order Quantity

MP Manufacture Product

MS Mobile Station (GSM engine)

MSAS Multi-Functional Satellite Augmentation System

MT Mobile Terminated

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NMEA National Marine Electronics Association

NTP Network Time Protocol

N.W Net Weight

PAP Password Authentication Protocol

PBCCH Packet Switched Broadcast Control Channel

PCB Printed Circuit Board

PCL Power Control Level

PCM Pulse Code Modulation

PD Pull-down

PDP Packet Data Protocol

PDU Protocol Data Unit

PING Packet Internet Groper

PMOS Positive Channel Metal Oxide Semiconductor

PMTK MTK Proprietary Protocol

PMU Power Management Unit

PPP Point-to-Point Protocol

PPS Pulse per Second

PU Pull-up

QZSS Quasi-Zenith Satellite System

RF Radio Frequency

RMC NMEA: Recommended Minimum Position Data

RMS Root Mean Square (value)

RoHS Restriction of Hazardous Substances

RTC Real Time Clock

RX Receive Direction

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SBAS Satellite-based Augmentation System

SIM Subscriber Identification Module

SMD Surface Mounted Devices

SMS Short Message Service

SMTP Simple Mail Transfer Protocol

SPI Serial Peripheral Interface

SPP Standard Parallel Port

SSL Secure Sockets Layer

TCP Transmission Control Protocol

TDMA Time Division Multiple Access

TE Terminal Equipment

3GPP 3rd Generation Partnership Project

TTFF Time to First Fix

TX Transmitting Direction

UART Universal Asynchronous Receiver & Transmitter

UDP User Datagram Protocol

URC Unsolicited Result Code

USIM Universal Mobile Telecommunication System

USSD Unstructured Supplementary Service Data

VSWR Voltage Standing Wave Ratio

VTG NMEA: Track Made Good and Ground Speed

VOmax Maximum Output Voltage Value

VOnorm Normal Output Voltage Value

VOmin Minimum Output Voltage Value

VIHmax Maximum Input High Level Voltage Value

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VIHmin Minimum Input High Level Voltage Value

VILmax Maximum Input Low Level Voltage Value

VILmin Minimum Input Low Level Voltage Value

VImax Absolute Maximum Input Voltage Value

VInorm Absolute Normal Input Voltage Value

VImin Absolute Minimum Input Voltage Value

VOHmax Maximum Output High Level Voltage Value

VOHmin Minimum Output High Level Voltage Value

VOLmax Maximum Output Low Level Voltage Value

VOLmin Minimum Output Low Level Voltage Value

WAAS Wide Area Augmentation System

Phonebook Abbreviations

LD (U)SIM Last Dialing phonebook (list of numbers most recently dialed)

MC Mobile Equipment list of unanswered MT Calls (missed calls)

ON (U)SIM (or ME) Own Numbers (MSISDNs) list

RC Mobile Equipment list of Received Calls

SM (U)SIM phonebook

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9 Appendix B GPRS Coding Schemes Four coding schemes are used in GPRS protocol. The differences between them are shown in the following table.

Table 29: Description of Different Coding Schemes

Radio block structure of CS-1, CS-2 and CS-3 is shown as the figure below.

Figure 36: Radio Block Structure of CS-1, CS-2 and CS-3

Scheme Code Rate

USF Pre-coded USF

Radio Block excl.USF and BCS

BCS Tail Coded Bits

Punctured Bits

Data Rate Kb/s

CS-1 1/2 3 3 181 40 4 456 0 9.05

CS-2 2/3 3 6 268 16 4 588 132 13.4

CS-3 3/4 3 6 312 16 4 676 220 15.6

CS-4 1 3 12 428 16 - 456 - 21.4

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Radio block structure of CS-4 is shown as the following figure.

Figure 37: Radio Block Structure of CS-4

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10 Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots. The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes is shown in the following table.

Table 30: GPRS Multi-slot Classes

Multi-slot Class Downlink Slots Uplink Slots Active Slots

1 1 1 2

2 2 1 3

3 2 2 3

4 3 1 4

5 2 2 4

6 3 2 4

7 3 3 4

8 4 1 5

9 3 2 5

10 4 2 5

11 4 3 5

12 4 4 5