beam services mobile esc overview
DESCRIPTION
Mobile Electrostatic CarrierTRANSCRIPT
Beam Services, Inc.Beam Services, Inc.
September 27, 2010
Beam Services, Inc.Beam Services, Inc.
Mobile electrostatic carrier technology
Rigid carrier that utilizes electrostatic force for the bonding to an ultra thin substrate Thin opaque electrostatic carrier for the processing of transparent substrates
Clean and “Green”Reduced damage during de‐bond>2000 charge cycle capabilitySimple carrier re‐charge for extended processesSingle tool set for bond and de‐bond processMultiple automated integration solutions
Beam Services, Inc.Beam Services, Inc.
Objective: Beam Services is focused on the commercialization of mobile and non‐
mobile electrostatic handling systems for automated high volume manufacturing.
1.) Fully and semi automated ES 1.) Fully and semi automated ES temporary bond and detemporary bond and de--bond bond systems for the handling of systems for the handling of ultra thin substratesultra thin substrates
2.) Tools and applications 2.) Tools and applications engineering for customer engineering for customer specific handling requirementsspecific handling requirements
Beam Services, Inc.Beam Services, Inc.
1.1. Thin substrate and ESC Thin substrate and ESC are separatedare separated
2.2. Thin substrate and ESC Thin substrate and ESC are placed in close are placed in close contactcontact
3.3. Thin substarte is Thin substarte is chucked by the chucked by the electrostatic field electrostatic field generated by ESCgenerated by ESC
ESC layersESC layers
Thin substrateThin substrate
Thin substrateThin substrate
Thin substrateThin substrate
++-- ++ --
Electrostatic Carrier Electrostatic Carrier
ESC layersESC layers
ESC fieldESC field
Electrostatic Carrier Electrostatic Carrier
Electrostatic Carrier Electrostatic Carrier
Beam Services, Inc.Beam Services, Inc.
Cover foilCover foil
WaferWafer
UU00
UU00 /2/2
A plane A/2A plane A/2
CC++ CC--BipolarBipolar
Power electrodes can hold the wafer without Power electrodes can hold the wafer without the presence of a grounding electrodethe presence of a grounding electrode
-- --++
++ ---- -- --++++++ ESCESC
MultiMulti--Cell Electrostatic fieldCell Electrostatic field
-- --++-- --++ -- --++-- --++ -- --++ESCESC
Beam Services, Inc.Beam Services, Inc.
••MaterialsMaterials••Semiconductor waferSemiconductor wafer••Semiconductor solar cellsSemiconductor solar cells••Metal masksMetal masks••Glass substrates Glass substrates ••Non conductive substrates with Non conductive substrates with conductive layerconductive layer••MEMSMEMS••Substrate pieces Substrate pieces
••Substrates typical dimensionsSubstrates typical dimensions••Thickness (any kind): typical 10Thickness (any kind): typical 10µµm m –– 750750µµmm••Size (any kind): typical 1Size (any kind): typical 1”” to 12to 12””••Shape (any kind): circle, square, rectangular Shape (any kind): circle, square, rectangular
ApplicationsApplications
Beam Services, Inc.Beam Services, Inc.
Easily integrated charging units, all communication protocols supported (USB, 232, etc.)
Operating with “IntelliCharge®”fully heuristic intelligent charging technology. Patent Pending
In house design, hardware, software capability
Volume manufacturing at low cost in the US
Highly experienced team with multi‐market background
Beam Services, Inc.Beam Services, Inc.
APACHEAPACHEBOLTS Charging BOLTS Charging StationStation
APACHEAPACHEIntegrated Charging Integrated Charging StationStation
APACHEAPACHETable Top Charging Table Top Charging StationStation
APACHE 2100APACHE 2100ESC Charging ESC Charging
ControllerController
APACHEAPACHEAutomated Charging Automated Charging StationStation
BiBi--polar polar ESCsESCs
Beam Services, Inc.Beam Services, Inc.
150 mm, 200 mm, and 300 mm mobile ES carrier capability
Integrated real time voltage monitoring for process testing
Vacuum ESC hold down and contact pin actuation
Contact pin assembly design allows for increased rotational tolerance
Integrated touch screen user interface
In house customization options