BEAM TESTS OF AN INTEGRATED TPC

ENDPLATE WITH 2-PHASE CO2 COOLING

Gaseous detectors, upgrade of the Large Prototype at DESY

Integration of endplate and module systems

P. Colas

TPC module integration 2

MENU

Integration of electronics

Cooling • Advantages of 2PCO2• TRACI• Test on one module at NIKHEF• Test on 7 modules at DESY Test Beam

Spending

Future (AIDA 2?)

27/03/2014

TPC module integration 3

INTEGRATION OF ELECTRONICS

AFTER-based electronics (T2K) must be miniaturized to fit behind a module within 5cm and 0.25 X°.

This has been achieved (within AIDA) (62700 € in 2013)

27/03/2014

14 cm

25 cmFron

t-En

d C

ard

(FEC

)

12.5 cm

2.8 cm

INTEGRATED ELECTRONICS Remove packaging and protection

diodes Wire-bond AFTER chips Use two 300-point connectors

0.78 cm

0.74 cm

3.5 cm

3.5 cm

AFTE

R C

hip

The resistive foil protects against sparks

4.5 cm

This is for AFTER chips. Similar work is being done with S-ALTRO

TPC module integration 6

COOLING: WHY 2-PHASE CO2?

Low viscosity allows very small pipe diameter and low DP.

Very large latent heat and heat capacity makes it an excellent cooler

Can work at room temperature (avoids dripping water by condensation)

However needs very high pressures (50 bar for 20 degrees)

27/03/2014

TPC module integration 7

COOLING: WHY 2-PHASE CO2?

27/03/2014

TPC module integration 8

COOLING: TRACI

We used the TRACI purchased by KEK and installed at DESY in February 2014.

27/03/2014

TPC module integration 927/03/2014

TPC module integration 1027/03/2014

TPC module integration 11

COOLING: TESTS AT NIKHEF (1 MODULE)

27/03/2014

TPC module integration 12

COOLING: TESTS AT NIKHEF (1 MODULE)

27/03/2014

TPC module integration 13

COOLING: TESTS AT DESY (7 MODULES)

27/03/2014

TPC module integration 14

COOLING: TESTS AT DESY (7 MODULES)

27/03/2014

7 temperature probes(1 per FEC, 1 FPGA)

TPC module integration 15

SPENDING

The ‘plumbering for the cooling costed about 22 k€ in 2014.

100% of the spending for this has been used. The results overpass the initial goals.

27/03/2014

TPC module integration 16

OUTLOOK

New materials. (Ex: TPG) lighter than Al, with twice better thermal conductivity

New technique (3D printing) allows micro-channels to be built

27/03/2014

TPC module integration 17

SUMMARY

A demonstration of full integration of an endplate meeting the requirements of a LC TPC has been made.

A first try of using 2PCO2 for a TPC has been made, showing that this solution is very attractive.

This opens the way to further developments, using new materials (TPG) and new techniques (3D printing) to get uniform temperature across the endplate.

27/03/2014